Philips BLV75/12 DATASHEETS

DISCRETE SEMICONDUCTORS
DATA SH EET
BLV75/12
VHF power transistor
Product specification
August 1986
Philips Semiconductors Product specification

DESCRIPTION

N-P-N silicon planar epitaxial transistor primarily intended for use in mobile radio transmitters in the 175 MHz commmunications band.

FEATURES

multi-base structure and emitter-ballasting resistors for an optimum temperature profile
gold metallization ensures excellent reliability
internal matching to achieve an optimum wideband capability and high power gain
The transistor has a 6-lead flange envelope with a ceramic cap (SOT-119). All leads are isolated from the flange.

QUICK REFERENCE DATA

R.F. performance up to T
MODE OF OPERATION V
=25°C in a common-emitter class-B circuit
h
CE
V
f
MHz
P
W
L
G
p
η
dB
narrow band; c.w. 12,5 175 75 > 6,5 > 55

PIN CONFIGURATION

PINNING

C
%
PIN DESCRIPTION
1 emitter
handbook, halfpage
1
2
2 emitter 3 base
3
4
4 collector 5 emitter 6 emitter
65
MSB006
Fig.1 Simplified outlinbe, SOT119A.
PRODUCT SAFETY This device incorporates beryllium oxide, the dust of which is toxic. The device is entirely safe provided that the BeO disc is not damaged.
August 1986 2
Philips Semiconductors Product specification

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-base voltage (open emitter)
peak value v Collector-emitter voltage (open base) V Emitter-base voltage (open collector) V Collector current
d.c. or average I
peak value; f > 1 MHz I Total power dissipation
at T
=25°C; f > 1 MHz P
mb
Storage temperature T Operating junction temperature T
CBOM
CEO EBO
C CM
tot stg j
max. 36 V max. 16,5 V max. 4 V
max. 15 A max. 45 A
max. 150 W
65 to + 150 °C max. 200 °C
2
10
handbook, halfpage
I
C
(A)
10
1
110
Fig.2 D.C. soar. R
Th = 70 °C
Tmb = 25 °C
16.5
VCE (V)
= 0,2 K/W.
th mb-h
MGP390
200
handbook, halfpage
P
tot
(W)
ΙΙ
100
Ι
2
10
0
0 100 200
I Continuous operation (f >1 MHz) II Short-time operation during mismatch; (f > 1 MHz).
Th (°C)
MGP391
Fig.3 Power/temperature derating curves;
R
th mb-h
= 0,2 K/W.

THERMAL RESISTANCE

Dissipation = 96 W; T
=25°C
mb
From junction to mounting base
(r.f. operation) R From mounting base to heatsink R
August 1986 3
th jmb th mbh
= 1,05 K/W = 0,2 K/W
Philips Semiconductors Product specification

CHARACTERISTICS

T
=25°C unless otherwise specified
j
Collector-base breakdown voltage
open emitter; I Collector-emitter breakdown voltage
open base; IC= 200 mA V Emitter-base breakdown voltage
open collector; IE= 20 mA V Collector cut-off current
VBE= 0; VCE= 16 V I Second breakdown energy
L = 25 mH; f = 50 Hz; R D.C. current gain
VCE= 10 V; IC= 10 A h
= 100 mA V
C
=10 E
BE
(BR)CBO
(BR)CEO
(BR)EBO
CES
SBR
FE
min. 36 V
min. 16,5 V
min. 4 V
max. 44 mA
min. 20 mJ
min. typ.
15 55
Collector capacitance at f = 1 MHz
I
= 0; VCB= 12,5 V C
E=ie
Feedback capacitance at f = 1 MHz
I
= 0; VCE= 12,5 V C
C
Collector-flange capacitance C
80
handbook, halfpage
h
FE
40
VCE = 12.5 V
10 V
MGP392
800
handbook, halfpage
C
c
(pF)
400
c
re cf
typ. 240 pF
typ. 150 pF typ. 3 pF
MGP393
0
01020 40
30
IC (A)
Fig.4 D.C. current gain versus collector current;
Tj=25°C.
August 1986 4
0
0
10
VCB (V)
20
Fig.5 Output capacitance versus VCB;IE= ie=0;
f = 1 MHz; Tj=25°C.
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