Philips BLV20 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BLV20
VHF power transistor
Product specification
August 1986
Philips Semiconductors Product specification

DESCRIPTION

N-P-N silicon planar epitaxial transistor intended for use in class-A, B and C operated h.f. and v.h.f. transmitters with a nominal supply voltage of 28 V. The transistor is resistance stabilized and is guaranteed to withstand severe load mismatch conditions.
It has a 3/8" flange envelope with a ceramic cap. All leads are isolated from the flange.

PINNING - SOT123

PIN DESCRIPTION
1 collector 2 emitter 3 base 4 emitter

QUICK REFERENCE DATA

R.F. performance up to T
= 25 °C in an unneutralized common-emitter
h
class-B circuit
MODE OF
OPERATION
V
CE
VfMHz
P
W
G
L
p
dB
%
η
z
i
c.w. 28 175 8 > 12 > 65 1,8 + j0,7 18 j20

PIN CONFIGURATION

lfpage
1
23
4
handbook, halfpage
b
MBB012
MSB057
Fig.1 Simplified outline and symbol.
Y
L
mS
c
e
PRODUCT SAFETY This device incorporates beryllium oxide, the dust of which is toxic. The device is entirely safe provided that the BeO disc is not damaged.
August 1986 2
Philips Semiconductors Product specification

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-emitter voltage (V
peak value v Collector-emitter voltage (open base) V Emitter-base voltage (open collector) V Collector current (average) I Collector current (peak value); f > 1 MHz I R.F. power dissipation (f > 1 MHz); T Storage temperature T Operating junction temperature T
BE
=0)
CESM
CEO
EBO C(AV) CM
=25°CP
mb
rf
stg
j
max. 65 V max. 36 V max. 4 V max. 0,9 A max. 2,5 A max. 20 W
65 to + 150 °C
max. 200 °C
handbook, halfpage
1
I
C
(A)
0.5
0
10 20 30 40
Th = 70 °C
Fig.2 D.C. SOAR.
Tmb = 25 °C
VCE (V)
MGP272
30
handbook, halfpage
P
tot
(W)
20
10
0
0 50 100
I Continuous d.c. operation II Continuous r.f. operation III Short-time operation during mismatch
ΙΙΙ
derate by 0.12 W/K
ΙΙ
0.1 W/K
Ι
MGP273
Th (°C)
Fig.3 R.F. power dissipation; VCE≤ 28 V; f > 1 MHz.

THERMAL RESISTANCE

(dissipation = 8 W; T
= 72,4 °C, i.e. Th=70°C)
mb
From junction to mounting base (d.c. dissipation) R From junction to mounting base (r.f. dissipation) R From mounting base to heatsink R
August 1986 3
th jmb(dc) th jmb(rf) th mbh
= 10,7 K/W = 8,6 K/W = 0,3 K/W
Philips Semiconductors Product specification

CHARACTERISTICS

T
=25°C
j
Collector-emitter breakdown voltage
V
= 0; IC= 2 mA V
BE
(BR)CES
Collector-emitter breakdown voltage
open base; IC= 10 mA V
(BR)CEO
Emitter-base breakdown voltage
open collector; IE= 1 mA V
(BR)EBO
Collector cut-off current
VBE= 0; VCE= 36 V I
CES
Second breakdown energy; L = 25 mH; f = 50 Hz
open base E R
=10 E
BE
D.C. current gain
I
= 0,4 A; VCE= 5 V 10 to 100
C
Collector-emitter saturation voltage
(1)
(1)
IC= 1,25 A; IB= 0,25 A V
Transition frequency at f = 100 MHz
(1)
IE= 0,4 A; VCB= 28 V f = 1,25 A; VCB= 28 V f
I
E
h
T T
SBO SBR
FE
CEsat
Collector capacitance at f = 1 MHz
IE=Ie= 0; VCB= 28 V C
c
Feedback capacitance at f = 1 MHz
I
= 50 mA; VCE= 28 V C
C
Collector-flange capacitance C
re cf
> 65 V
> 36 V
> 4V
< 1mA
> 0,5 mJ > 0,5 mJ
typ. 50
typ. 0,8 V
typ. 600 MHz typ. 520 MHz
typ. 10 pF
typ. 7,1 pF typ. 2 pF
Note
1. Measured under pulse conditions: t
200 µs; δ≤0,02.
p
August 1986 4
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