Philips BLV194 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BLV194
UHF power transistor
Product specification
January 1993
Philips Semiconductors Product specification
FEATURES
Emitter-ballasting resistors for an optimum temperature profile
Gold metallization ensures excellent reliability.
DESCRIPTION
NPN silicon planar epitaxial transistor intended for common emitter class-AB operation in the 900 MHz communications band.
The transistor has a SOT171 flange envelope with a ceramic cap.
All leads are isolated from the mounting base.
PINNING - SOT171
PIN DESCRIPTION
1 emitter 2 emitter 3 base 4 collector 5 emitter 6 emitter
QUICK REFERENCE DATA
RF performance at T
MODE OF
OPERATION
= 25 °C in a common emitter test circuit.
h
f
(MHz)
V
(V)
CE
P
(W)
L
(dB)
G
p
η
C
(%)
CW, class-AB 900 12.5 16 7 50
lfpage
1
3 5
Top view
2
4 6
MBA931 - 1
handbook, halfpage
b
MBB012
c
e
Fig.1 Simplified outline and symbol.
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
January 1993 2
Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CEO
V
CES
V
EBO
I
C
I
C(AV)
P
tot
T
stg
T
j
collector-emitter voltage open base 16 V collector-emitter voltage base short-circuited 32 V emitter-base voltage open collector 3V DC collector current 3A average collector current 3A total power dissipation Tmb =25°C 46 W storage temperature 65 150 °C junction temperature 200 °C
10
handbook, halfpage
I
C
(A)
1
1
10
110
(1) Tmb=25°C. (2) Th=70°C.
(1)
(2)
Fig.2 DC SOAR.
VCE (V)
MRC103
60
handbook, halfpage
P
tot
(W)
40
20
2
10
0
02040
(1) Continuous operation. (2) Short-time operation during mismatch.
(2)
(1)
60 80
MRC102
100 120
o
Th (
C)
Fig.3 Power/temperature derating curve.
THERMAL RESISTANCE
SYMBOL PARAMETER CONDITIONS
R
th j-mb
R
th mb-h
thermal resistance from junction to mounting base P thermal resistance from mounting base to heatsink 0.4 K/W
= 46 W; Tmb=25°C 3.8 K/W
dis
January 1993 3
THERMAL
RESISTANCE
Philips Semiconductors Product specification
CHARACTERISTICS
T
= 25 °C, unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CEO
V
(BR)CES
V
(BR)EBO
I
CER
h
FE
C
c
C
re
C
c-mb
Note
1. Measured under pulse conditions: t
collector-emitter breakdown voltage IB= 0; IC=40mA 16 −− V collector-emitter breakdown voltage IC= 20 mA; VBE=0 32 −− V emitter-base breakdown voltage IC= 0; IE= 5 mA 3 −− V collector leakage current RBE= 700 ; VCE=16V −−1mA DC current gain IC= 1.2 A; VCE= 10 V (note 1) 25 70 collector capacitance IE=ie= 0; VCB= 12.5 V; f = 1 MHz 26 pF feedback capacitance IC= 0; VCB= 12.5 V; f = 1 MHz 19 pF collector-mounting base capacitance 2 pF
200 µs; δ≤0.02.
p
100
handbook, halfpage
h
FE
80
60
40
20
0
02
VCE=10V. Measured under pulse conditions: t
δ≤0.02.
200µs;
p
4
MRC098
I
(A)
C
Fig.4 DC current gain as a function of collector
current, typical values.
60
handbook, halfpage
C
c
(pF)
40
20
6
0
048
IE=ie= 0; f = 1 MHz.
MRC095
12 16
VCB (V)
Fig.5 Collector capacitance as a function of
collector-base voltage, typical values.
January 1993 4
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