Philips Semiconductors Product specification
UHF power transistor BLV194
FEATURES
• Emitter-ballasting resistors for an
optimum temperature profile
• Gold metallization ensures
excellent reliability.
DESCRIPTION
NPN silicon planar epitaxial transistor
intended for common emitter
class-AB operation in the 900 MHz
communications band.
The transistor has a SOT171 flange
envelope with a ceramic cap.
All leads are isolated from the
mounting base.
PINNING - SOT171
PIN DESCRIPTION
1 emitter
2 emitter
3 base
4 collector
5 emitter
6 emitter
QUICK REFERENCE DATA
RF performance at T
MODE OF
OPERATION
= 25 °C in a common emitter test circuit.
h
f
(MHz)
V
(V)
CE
P
(W)
L
(dB)
G
p
η
C
(%)
CW, class-AB 900 12.5 16 ≥ 7 ≥ 50
lfpage
1
3
5
Top view
2
4
6
MBA931 - 1
handbook, halfpage
b
MBB012
c
e
Fig.1 Simplified outline and symbol.
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided
that the BeO disc is not damaged. All persons who handle, use or dispose of
this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to
the regulations applying at the location of the user. It must never be thrown
out with the general or domestic waste.
January 1993 2
Philips Semiconductors Product specification
UHF power transistor BLV194
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CEO
V
CES
V
EBO
I
C
I
C(AV)
P
tot
T
stg
T
j
collector-emitter voltage open base − 16 V
collector-emitter voltage base short-circuited − 32 V
emitter-base voltage open collector − 3V
DC collector current − 3A
average collector current − 3A
total power dissipation Tmb =25°C − 46 W
storage temperature −65 150 °C
junction temperature − 200 °C
10
handbook, halfpage
I
C
(A)
1
−1
10
110
(1) Tmb=25°C.
(2) Th=70°C.
(1)
(2)
Fig.2 DC SOAR.
VCE (V)
MRC103
60
handbook, halfpage
P
tot
(W)
40
20
2
10
0
02040
(1) Continuous operation.
(2) Short-time operation during mismatch.
(2)
(1)
60 80
MRC102
100 120
o
Th (
C)
Fig.3 Power/temperature derating curve.
THERMAL RESISTANCE
SYMBOL PARAMETER CONDITIONS
R
th j-mb
R
th mb-h
thermal resistance from junction to mounting base P
thermal resistance from mounting base to heatsink 0.4 K/W
= 46 W; Tmb=25°C 3.8 K/W
dis
January 1993 3
THERMAL
RESISTANCE
Philips Semiconductors Product specification
UHF power transistor BLV194
CHARACTERISTICS
T
= 25 °C, unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CEO
V
(BR)CES
V
(BR)EBO
I
CER
h
FE
C
c
C
re
C
c-mb
Note
1. Measured under pulse conditions: t
collector-emitter breakdown voltage IB= 0; IC=40mA 16 −− V
collector-emitter breakdown voltage IC= 20 mA; VBE=0 32 −− V
emitter-base breakdown voltage IC= 0; IE= 5 mA 3 −− V
collector leakage current RBE= 700 Ω; VCE=16V −−1mA
DC current gain IC= 1.2 A; VCE= 10 V (note 1) 25 70 −
collector capacitance IE=ie= 0; VCB= 12.5 V; f = 1 MHz − 26 − pF
feedback capacitance IC= 0; VCB= 12.5 V; f = 1 MHz − 19 − pF
collector-mounting base capacitance − 2 − pF
≤ 200 µs; δ≤0.02.
p
100
handbook, halfpage
h
FE
80
60
40
20
0
02
VCE=10V.
Measured under pulse conditions: t
δ≤0.02.
≤ 200µs;
p
4
MRC098
I
(A)
C
Fig.4 DC current gain as a function of collector
current, typical values.
60
handbook, halfpage
C
c
(pF)
40
20
6
0
048
IE=ie= 0; f = 1 MHz.
MRC095
12 16
VCB (V)
Fig.5 Collector capacitance as a function of
collector-base voltage, typical values.
January 1993 4