Philips BLV12 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BLV12
VHF power transistor
Product specification
September 1991
Philips Semiconductors Product specification

FEATURES

Emitter-ballasting resistors for an optimum temperature profile
Excellent reliability
Withstands full load mismatch.

DESCRIPTION

NPN silicon planar epitaxial transistor encapsulated in a 4-lead SOT123 flange envelope with a ceramic cap. It is designed for common emitter, class-B operation in mobile VHF transmitters with a supply voltage of
12.5 V. All leads are isolated from the
mounting flange.

PINNING - SOT123

PIN DESCRIPTION
1 collector 2 emitter 3 base 4 emitter

QUICK REFERENCE DATA

RF performance at T
MODE OF OPERATION
= 25 °C in a common emitter test circuit.
mb
f
(MHz)
V
(V)
CE
P
(W)
L
G
P
(dB)
(%)
c.w. class-B 175 12.5 30 > 9 > 60
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.

PIN CONFIGURATION

lfpage
1
4
c
handbook, halfpage
b
η
C
23
MSB057
Fig.1 Simplified outline and symbol.
MBB012
e
September 1991 2
Philips Semiconductors Product specification

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C,IC(AV)
I
CM
P
tot
T
stg
T
j
collector-base voltage open emitter 36 V collector-emitter voltage open base 16 V emitter-base voltage open collector 3V collector current DC or average value 6A collector current peak value
18 A
f > 1 MHz
total power dissipation RF operation;
100 W f > 1 MHz; Tmb=25°C
storage temperature range 65 150 °C junction operating temperature 200 °C
120
handbook, halfpage
P
tot
(W)
100
80
60
40
20
0
0 20406080100120
(I) Continuous DC operation. (II) Short time operation during mismatch
(f > 1 MHz)
II
I
Fig.2 Power/temperature derating curve.
MRA372
o
T ( C)
h

THERMAL RESISTANCE

SYMBOL PARAMETER CONDITIONS MAX. UNIT
R
th j-mb(RF)
from junction to mounting base P
= 100 W;
tot
1.75 K/W
Tmb=25°C
R
th mb-h
from mounting base to heatsink 0.3 K/W
September 1991 3
Philips Semiconductors Product specification

CHARACTERISTICS

T
= 25 °C.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CES
h
FE
f
T
C
c
C
re
C
c-f
collector-base breakdown voltage open emitter;
Ic= 10 mA
collector-emitter breakdown voltage open base;
Ic= 25 mA
emitter-base breakdown voltage open collector;
IE= 2 mA
collector-emitter leakage current VBE=0;
VCE= 16 V
DC current gain VCE=5 V;
IC=4 A
transition frequency VCE= 12.5 V;
IE= 4 A; f = 500 MHz
collector capacitance VCB= 12.5 V;
IE=Ie=0; f = 1 MHz
feedback capacitance VCE= 12.5 V;
IC=0; f = 1 MHz
collector-flange capacitance f = 1 MHz 2 pF
36 −−V
16 −−V
3 −− V
−−10 mA
25 35
1.6 GHz
90 100 pF
60 70 pF
VCE=
12.5 V
I (A)
C
MRA378
50
handbook, halfpage
h
FE
40
30
20
10
0
0 4 8 12 16
V = 5 V
CE
Fig.3 DC current gain as a function of collector
current, typical values.
September 1991 4
250
handbook, halfpage
C
c
(pF)
200
150
100
50
0
0 4 8 12 16
IE=ie= 0; f = 1 MHz.
V (V)
Fig.4 Collector capacitance as a function of
collector-base voltage, typical values.
MRA374.1
CB
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