Philips BLV10 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BLV10
VHF power transistor
Product specification
August 1986
Philips Semiconductors Product specification

DESCRIPTION

N-P-N silicon planar epitaxial transistor intended for use in class-A, B and C operated mobile, h.f. and v.h.f. transmitters with a nominal supply voltage of 13,5 V. The transistor is resistance stabilized and is guaranteed to withstand severe load mismatch conditions with a supply over-voltage to 16,5 V.

QUICK REFERENCE DATA

R.F. performance up to T
MODE OF OPERATION V
= 25 °C in an unneautralized common-emitter class-B circuit
h
CE
V
c.w. 13,5 175 8 > 9,0 > 70 2,8 + j1,2 76 j16
c.w. 12,5 175 8 typ. 10,5 typ. 75 −−

PIN CONFIGURATION

handbook, halfpage
1
It has a 3/8” flange envelope with a ceramic cap. All leads are isolated from the flange.
f
MHz
P
L
W
4
G dB
P
η
%
z
i

PINNING

PIN DESCRIPTION
1 collector 2 emitter 3 base 4 emitter
Y
mS
L
23
MSB057
Fig.1 Simplified outline, SOT123.
PRODUCT SAFETY This device incorporates beryllium oxide, the dust of which is toxic. The device is entirely safe provided that the BeO disc is not damaged.
August 1986 2
Philips Semiconductors Product specification

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-emitter voltage (V
peak value V Collector-emitter voltage (open base) V Emitter-base voltage (open collector) V Collector current (average) I Collector current (peak value); f > 1 MHz I R.F. power dissipation (f > 1 MHz); T Storage temperature T Operating junction temperature T
BE
= 0)
CESM CEO
EBO C(AV) CM
=25°CP
mb
rf
stg
j
max. 36 V max. 18 V max. 4 V max. 1,5 A max. 4,0 A max. 20 W
65 to + 150 °C max. 200 °C
1.75
handbook, halfpage
I
C
(A)
1.5
1.25
1
0.75
0.5 5101520
Th = 70 °C
Fig.2 D.C. SOAR.
Tmb = 25 °C
VCE (V)
MGP248
30
handbook, halfpage
P
tot
(W)
20
10
0
0 50 100
I Continuous d.c. operation II Continuous r.f. operation III Short-time operation during mismatch
ΙΙΙ
derate by 0.12 W/K
ΙΙ
0.1 W/K
Ι
Fig.3 R.F. power dissipation;
VCE≤ 16,5 V; f > 1 MHz.
MGP249
Th (°C)
August 1986 3
Philips Semiconductors Product specification

THERMAL RESISTANCE

(dissipation = 8 W; T
From junction to mounting base (d.c. dissipation) R From junction to mounting base (r.f. dissipation) R From mounting base to heatsink R

CHARACTERISTICS

T
=25°C
j
Collector-emitter breakdown voltage
= 0; IC= 5 mA V
V
BE
Collector-emitter breakdown voltage
open base; I
C
Emitter-base breakdown voltage
open collector; IE= 1 mA V
Collector cut-off current
V
= 0; VCE= 18 V I
BE
Second breakdown energy; L = 25 mH; f = 50 Hz
open base E R
=10 E
BE
D.C. current gain
I
= 0,75 A; VCE=5 V h
C
Collector-emitter saturation voltage
IC= 2 A; IB= 0,4 A V
Transition frequency at f = 100 MHz
IE= 0,75 A; VCB= 13,5 V f
I
= 2 A; VCB= 13,5 V f
E
Collector capacitance at f = 1 MHz
I
=0;VCB= 13,5 V C
E=Ie
Feedback capacitance at f = 1 MHz
= 100 mA; VCE= 13,5 V C
I
C
Collector-flange capacitance C
= 72,4 °C, i.e. Th=70°C)
mb
= 25 mA V
(1)
(1)
(1)
th j-mb(dc) th j-mb(rf) th mb-h
(BR) CES
(BR) CEO
(BR)EBO
CES
SBO SBR
FE
CEsat
T T
c
re cf
= 10,7 K/W = 8,6 K/W = 0,3 K/W
> 36 V
> 18 V
> 4V
< 2mA
> 0,5 mJ > 0,5 mJ
typ. 40
10 to 100
typ. 0,85 V
typ. 950 MHz typ. 850 MHz
typ. 16,5 pF
typ. 12 pF typ. 2 pF
Note
1. Measured under pulse conditions: t
200 µs; δ≤0,02.
p
August 1986 4
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