Philips BLU86 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BLU86
UHF power transistor
Product specification
September 1991
Philips Semiconductors Product specification

FEATURES

SMD encapsulation
Emitter-ballasting resistors for
optimum temperature profile
Gold metallization ensures excellent reliability.

DESCRIPTION

NPN silicon planar epitaxial transistor encapsulated in a SOT223 surface mounted envelope and designed primarily for use in mobile radio equipment in the 900 MHz communications band.

PINNING - SOT223

PIN DESCRIPTION
1 emitter 2 base 3 emitter 4 collector

QUICK REFERENCE DATA

RF performance at T
60 °C in a common emitter class-B test circuit (see
s
note 1).
MODE OF OPERATION
f
(MHz)
V
(V)
CE
P
(W)
L
G
(dB)
p
(%)
c.w. narrow band 900 12.5 1 > 7 > 55
Note
1. T
= temperature at soldering point of collector tab.
s

PIN CONFIGURATION

alfpage
123
Top view
4
MSB002 - 1
handbook, halfpage
MBB012
c
b
e
η
c
Fig.1 Simplified outline and symbol.
September 1991 2
Philips Semiconductors Product specification

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
, I
C
C(AV)
I
CM
P
tot
T
stg
T
j
Note
= temperature at soldering point of collector tab.
1. T
s
collector-base voltage open emitter 32 V collector-emitter voltage open base 16 V emitter-base voltage open collector 3V collector current DC or average value 200 mA collector current peak value;
600 mA
f > 1 MHz
total power dissipation f > 1 MHz;
2W Ts= 129 °C (note 1)
storage temperature range 65 150 °C operating junction temperature 175 °C
3
10
handbook, halfpage
I
C
(mA)
2
10
10
1
10
Ts = 129 oC
VCE (V)
MRA241
2
10
Fig.2 DC SOAR.

THERMAL RESISTANCE

SYMBOL PARAMETER CONDITIONS MAX. UNIT
R
th j-s(DC)
from junction to soldering point P
=2W;
tot
23 K/W
Ts= 129 °C
September 1991 3
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