Philips blu60 12 DATASHEETS

DISCRETE SEMICONDUCTORS
DATA SH EET
BLU60/12
UHF power transistor
Product specification
March 1986
Philips Semiconductors Product specification

DESCRIPTION

N-P-N silicon planar epitaxial transistor in SOT-119 envelope primarily intended for use in mobile radio transmitters in the 470 MHz communications band.

FEATURES

multi-base structure and emitter-ballasting resistors for an optimum temperature profile.
internal matching to achieve an optimum wideband capability and
The transistor has a 6-lead flange envelope with a ceramic cap. All leads are isolated from the flange.
high power gain.
gold metallization ensures excellent reliability.

QUICK REFERENCE DATA

R.F. performance up to T
MODE OF OPERATION V
=25°C in a common-emitter class-B circuit
h
CE
V
f
MHz
P
W
L
G
p
η
dB
narrow band; c.w. 12,5 470 60 > 4,4 > 55

PIN CONFIGURATION

PINNING

PIN DESCRIPTION
1 emitter
handbook, halfpage
1
2
2 emitter 3 base
3
4
4 collector 5 emitter 6 emitter
65
C
%
MSB006
Fig.1 Simplified outline, SOT119A.
PRODUCT SAFETY This device incorporates beryllium oxide, the dust of which is toxic. The device is entirely safe provided that the BeO disc is not damaged.
March 1986 2
Philips Semiconductors Product specification

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-base voltage (open emitter)
peak value V Collector-emitter voltage (open base) V Emitter-base voltage (open collector) V Collector current
d.c. or average I
(peak value); f > 1 MHz I Total power dissipation
at T
= 25 °C; f > 1 MHz P
mb
Storage temperature T Operating junction temperature T
CBOM CEO EBO
C CM
tot stg j
max. 36 V max. 16,5 V max. 4 V
max. 12 A max. 36 A
max. 110 W
65 to + 150 °C
max. 200 °C
200
handbook, halfpage
P
rf
(W)
150
100
50
0
040
I Continuous operation (f > 1 MHz). II Short-time operation during mismatch (f > 1 MHz).
II
I
80 120 160
MDA345
Th ( °C)
200
Fig.2 Power/temperature derating curves.

MAXIMUM THERMAL RESISTANCE

Dissipation = 72 W; T
amb
=25°C
From junction to mounting base (r.f. operation) R From mounting base to heatsink R
th j-mb th mb-h
max. 1,4 K/W max. 0,2 K/W
March 1986 3
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