Philips blu56 DATASHEETS
DISCRETE SEMICONDUCTORS
DATA SH EET
BLU56
UHF power transistor
Product specification
January 1991
Philips Components Product specification
UHF power transistor BLU56
FEATURES
• SMD encapsulation
• Emitter-ballasting resistors for
optimum temperature profile
• Gold metallization ensures
excellent reliability.
DESCRIPTION
NPN silicon planar epitaxial transistor
encapsulated in a SOT223 surface
mounted envelope and designed
primarily for use in mobile radio
equipment in the 470 MHz
communications band.
PINNING - SOT223
PIN DESCRIPTION
1 emitter
2 base
3 emitter
4 collector
QUICK REFERENCE DATA
RF performance at T
≤ 60 °C in a common emitter class-B test circuit
s
(see note 1).
MODE OF OPERATION f (MHz) V
(V) PL (W) Gp (dB) ηc (%)
CE
c.w. narrow band 470 12.5 1 > 12 > 50
Note
1. T
= temperature at soldering point of collector tab.
s
PIN CONFIGURATION
alfpage
123
Top view
4
handbook, halfpage
MSB002 - 1
MBB012
c
b
e
Fig.1 Simplified outline and symbol.
January 1991 2
Philips Components Product specification
UHF power transistor BLU56
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
, I
C
C(AV)
I
CM
P
tot
T
stg
T
j
Note
= temperature at soldering point of collector tab.
1. T
s
collector-base voltage open emitter − 36 V
collector-emitter voltage open base − 16 V
emitter-base voltage open collector − 3V
collector current DC or average value − 200 mA
collector current peak value
− 600 mA
f > 1 MHz
total power dissipation f > 1 MHz
− 2W
Ts = 105 °C
(note 1)
storage temperature range −65 150 °C
operating junction temperature − 175 °C
1000
handbook, halfpage
I
C
(mA)
100
10
1
1
Fig.2 DC SOAR; Ts = 105 °C.
THERMAL RESISTANCE
SYMBOL PARAMETER MAX. UNIT
R
th j-s(DC)
MCD027
10
V (V)
CE
100
from junction to soldering point 35 K/W
January 1991 3
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