Philips BLF546 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BLF546
UHF push-pull power MOS transistor
Product specification
October 1992
UHF push-pull power MOS transistor BLF546
FEATURES
High power gain
Easy power control
Good thermal stability
Gold metallization ensures
excellent reliability
Designed for broadband operation.
DESCRIPTION
Silicon N-channel enhancement mode vertical D-MOS push-pull transistor designed for communications transmitter applications in the UHF frequency range.
The transistor is encapsulated in a 4-lead, SOT268 balanced flange envelope, with two ceramic caps. The mounting flange provides the common source connection for the transistors.
PIN CONFIGURATION
handbook, halfpage
1
2
Top view
4
g
5
3
g
d
s
d
MAM395
Fig.1 Simplified outline and symbol.
CAUTION
The device is supplied in an antistatic package. The gate-source input must be protected against static charge during transport and handling.
PINNING - SOT268
PIN DESCRIPTION
1 drain 1 2 gate 1 3 gate 2 4 drain 2 5 source
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO discs are not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
WARNING
QUICK REFERENCE DATA
RF performance at T
MODE OF OPERATION
= 25 °C in a push-pull common source test circuit.
h
f
(MHz)
V
(V)
DS
P
(W)
L
G
(dB)
p
(%)
CW, class-B 500 28 80 > 11 > 50
η
D
October 1992 2
UHF push-pull power MOS transistor BLF546
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134). Per transistor section unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
±V
GS
I
D
P
tot
T
stg
T
j
THERMAL RESISTANCE
drain-source voltage 65 V gate-source voltage 20 V DC drain current 9A total power dissipation up to Tmb=25°C; total device;
145 W
both sections equally loaded storage temperature 65 150 °C junction temperature 200 °C
SYMBOL PARAMETER CONDITIONS
R
th j-mb
R
th mb-h
2
10
handbook, halfpage
I
D
(A)
10
thermal resistance from junction to mounting base
thermal resistance from mounting base to heatsink
MRA995
(1)
(2)
total device; both sections equally loaded
total device; both sections equally loaded
200
handbook, halfpage
P
tot
(W)
160
120
80
40
THERMAL
RESISTANCE
1.2 K/W
0.25 K/W
MDA519
(2)
(1)
1
110
(1) Current in this area may be limited by R (2) Tmb=25°C. Total device; both sections equally loaded.
VDS (V)
DS(on)
.
2
10
Fig.2 DC SOAR.
October 1992 3
0
0
(1) Continuous operation. (2) Short-time operation during mismatch. Total device; both sections equally loaded.
40 80
120
Fig.3 Power/temperature derating curves.
Th (°C)
160
UHF push-pull power MOS transistor BLF546
CHARACTERISTICS (per section)
T
= 25 °C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
g
fs
R
DS(on)
I
DSX
C
is
C
os
C
rs
drain-source breakdown voltage VGS= 0; ID= 20 mA 65 −−V drain-source leakage current VGS= 0; VDS= 28 V −−2mA gate-source leakage current ±VGS= 20 V; VDS=0 −−1µA gate-source threshold voltage ID= 80 mA; VDS= 10 V 1 4V forward transconductance ID= 2.4 A; VDS= 10 V 1.2 1.7 S drain-source on-state resistance ID= 2.4 A; VGS= 10 V 0.4 0.6 on-state drain current VGS= 15 V; VDS= 10 V 10 A input capacitance VGS= 0; VDS= 28 V; f = 1 MHz 60 pF output capacitance VGS= 0; VDS= 28 V; f = 1 MHz 46 pF feedback capacitance VGS= 0; VDS= 28 V; f = 1 MHz 15 pF
12
handbook, halfpage
T.C.
(mV/K)
8
4
0
4 10
VDS= 10 V.
2
1
10
110
ID (A)
Fig.4 Temperature coefficient of gate-source
voltage as a function of drain current, typical values per section.
MDA520
12
handbook, halfpage
I
D
(A)
8
4
0
0
VDS= 10 V; Tj= 25 °C.
4
816
MDA521
12
V
(V)
GS
Fig.5 Drain current as a function of gate-source
voltage, typical values per section.
October 1992 4
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