Philips BLF545 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BLF545
UHF push-pull power MOS transistor
Product specification
October 1992
UHF push-pull power MOS transistor BLF545

FEATURES

High power gain
Easy power control
Good thermal stability
Gold metallization ensures
excellent reliability
Designed for broadband operation.

DESCRIPTION

Silicon N-channel enhancement mode vertical D-MOS push-pull transistor designed for communications transmitter applications in the UHF frequency range.
The transistor is encapsulated in a 4-lead, SOT268 balanced flange envelope, with two ceramic caps. The mounting flange provides the common source connection for the transistors.

PIN CONFIGURATION

handbook, halfpage
1
2
Top view
4
g
5
3
g
d
s
d
MAM395
Fig.1 Simplified outline and symbol.
CAUTION
The device is supplied in an antistatic package. The gate-source input must be protected against static charge during transport and handling.

PINNING - SOT268

PIN DESCRIPTION
1 drain 1 2 gate 1 3 gate 2 4 drain 2 5 source
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO discs are not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
WARNING

QUICK REFERENCE DATA

RF performance at T
MODE OF OPERATION
= 25 °C in a push-pull common source circuit.
h
f
(MHz)
V
(V)
DS
P
(W)
L
G
P
(dB)
(%)
CW, class-B 500 28 40 > 11 > 50
η
D
October 1992 2
UHF push-pull power MOS transistor BLF545

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134). Per transistor section unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
±V
GS
I
D
P
tot
T
stg
T
j

THERMAL RESISTANCE

drain-source voltage 65 V gate-source voltage 20 V DC drain current 3.5 A total power dissipation up to Tmb=25°C; total device;
92 W
both sections equally loaded storage temperature 65 150 °C junction temperature 200 °C
SYMBOL PARAMETER CONDITIONS
R
th j-mb
R
th mb-h
2
10
handbook, halfpage
I
D
(A)
10
1
110
thermal resistance from junction to mounting base
thermal resistance from mounting base to heatsink
(1)
(2)
VDS (V)
MRA995
total device; both sections equally loaded
total device; both sections equally loaded
120
handbook, halfpage
P
tot
(W)
80
40
2
10
0
0
40 80
THERMAL
RESISTANCE
1.9 K/W
0.25 K/W
MBK463
(1)
(2)
Th ( °C)
160
120
(1) Current in this area may be limited by R (2) Tmb=25°C. Total device; both sections equally loaded.
DS(on)
.
Fig.2 DC SOAR.
October 1992 3
(1) Short-time operation during mismatch. (2) Continuous operation. Total device; both sections equally loaded.
Fig.3 Power/temperature derating curves.
UHF push-pull power MOS transistor BLF545
CHARACTERISTICS (per section)
T
= 25 °C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
g
fs
R
DS(on)
I
DSX
C
is
C
os
C
rs
drain-source breakdown voltage VGS= 0; ID = 10 mA 65 −−V drain-source leakage current VGS= 0; VDS= 28 V −−1mA gate-source leakage current ±VGS= 20 V; VDS=0 −−1µA gate-source threshold voltage ID= 40 mA; VDS= 10 V 1 4V forward transconductance ID= 1.2 A; VDS= 10 V 600 900 mS drain-source on-state resistance ID= 1.2 A; VGS= 10 V 0.85 1.25 on-state drain current VGS= 15 V; VDS= 10 V 4.8 A input capacitance VGS= 0; VDS= 28 V; f = 1 MHz 32 pF output capacitance VGS= 0; VDS= 28 V; f = 1 MHz 24 pF feedback capacitance VGS= 0; VDS= 28 V; f = 1 MHz 6.4 pF
handbook, halfpage
4
T.C
(mV/K)
2
0
2
4
10
VDS= 10 V.
2
1
10
110
ID (A)
Fig.4 Temperature coefficient of gate-source
voltage as a function of drain current, typical values per section.
MDA504
handbook, halfpage
6
I
D
(A)
4
2
0
0
VDS= 10 V; Tj= 25 °C.
5
10 20
MDA505
15
V
(V)
GS
Fig.5 Drain current as a function of gate-source
voltage, typical values per section.
October 1992 4
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