Philips BLF544B Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BLF544B
UHF push-pull power MOS transistor
Product specification
October 1992
UHF push-pull power MOS transistor BLF544B

FEATURES

High power gain
Easy power control
Good thermal stability
Gold metallization ensures
excellent reliability
Designed for broadband operation.

DESCRIPTION

Silicon N-channel enhancement mode vertical D-MOS push-pull transistor designed for communications transmitter applications in the UHF frequency range.
The transistor is encapsulated in a 4-lead, SOT268 balanced flange envelope, with two ceramic caps. The mounting flange provides the common source connection for the transistors.

PIN CONFIGURATION

fpage
24
31
Top view
MBB930
d
2
g
2
g
5
1
MBB157
s
d
1
Fig.1 Simplified outline and symbol.
CAUTION
The device is supplied in an antistatic package. The gate-source input must be protected against static charge during transport and handling.

PINNING - SOT268

PIN DESCRIPTION
1 gate 1 2 drain 1 3 gate 2 4 drain 2 5 source
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO discs are not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
WARNING

QUICK REFERENCE DATA

RF performance at T
MODE OF OPERATION
= 25 °C in a push-pull common source test circuit.
h
f
(MHz)
V
(V)
DS
P
(W)
L
G
p
(dB)
(%)
CW, class-B 500 28 20 > 12 > 50
η
D
October 1992 2
UHF push-pull power MOS transistor BLF544B

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134). Per transistor section unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
±V
GS
I
D
P
tot
T
stg
T
j

THERMAL RESISTANCE

drain-source voltage 65 V gate-source voltage 20 V DC drain current 2A total power dissipation up to Tmb=25°C; total device;
48 W
both sections equally loaded storage temperature 65 150 °C junction temperature 200 °C
SYMBOL PARAMETER CONDITIONS
R
th j-mb
R
th mb-h
10
handbook, halfpage
I
D
(A)
1
1
10
110
thermal resistance from junction to mounting base
thermal resistance from mounting base to heatsink
MRA993
(1)
(2)
VDS (V)
10
total device; both sections equally
loaded
total device; both sections equally
loaded
80
handbook, halfpage
P
tot
(W)
60
40
20
2
0
0
40 80
THERMAL
RESISTANCE
3.7 K/W
0.25 K/W
MDA515
(1)
(2)
Th ( °C)
160
120
(1) Current in this area may be limited by R (2) Tmb=25°C. Total device; both sections equally loaded.
DS(on)
.
Fig.2 DC SOAR.
October 1992 3
(1) Short-time operation during mismatch. (2) Continuous operation. Total device; both sections equally loaded.
Fig.3 Power/temperature derating curves.
UHF push-pull power MOS transistor BLF544B
CHARACTERISTICS (per section)
T
= 25 °C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
g
fs
R
DS(on)
I
DSX
C
is
C
os
C
rs
drain-source breakdown voltage ID= 5 mA; VGS=0 65 −− V drain-source leakage current VGS= 0; VDS=28V −−0.5 mA gate-source leakage current ±VGS= 20 V; VDS=0 −−1 µA gate-source threshold voltage ID= 20 mA; VDS=10V 1 4V forward transconductance ID= 0.6 A; VDS= 10 V 300 450 mS drain-source on-state resistance ID= 0.6 A; VGS=10V 0.7 2.5 on-state drain current VGS= 15 V; VDS=10V 2.4 A input capacitance VGS=0;VDS= 28 V; f = 1 MHz 16 pF output capacitance VGS=0;VDS= 28 V; f = 1 MHz 12 pF feedback capacitance VGS=0;VDS= 28 V; f = 1 MHz 3.2 pF
4
handbook, halfpage
T.C.
(mV/K)
2
0
2
4
2
10
VDS=10V.
1
10
ID (A)
Fig.4 Temperature coefficient of gate-source
voltage as a function of drain current, typical values per section.
MDA491
handbook, halfpage
1
3
I
D
(A)
2
1
0
0
VDS=10V.
5
10 20
MDA495
15
V
(V)
GS
Fig.5 Drain current as a function of gate-source
voltage, typical values per section.
October 1992 4
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