Philips BLF278 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BLF278
VHF push-pull power MOS transistor
Product Specification Supersedes data of October 1992
1996 Oct 21
Philips Semiconductors Product Specification
VHF push-pull power MOS transistor BLF278
FEATURES
High power gain
Easy power control
Good thermal stability
Gold metallization ensures excellent reliability.
APPLICATIONS
Broadcast transmitters in the VHF frequency range.
DESCRIPTION
Dual push-pull silicon N-channel enhancement mode vertical D-MOS transistor encapsulated in a 4-lead, SOT262A1 balanced flange package with two ceramic caps. The mounting flange provides the common source connection for the transistors.
CAUTION
The device is supplied in an antistatic package. The gate-source input must be protected against static discharge during transport or handling.
PINNING - SOT262A1
PIN SYMBOL DESCRIPTION
1d 2d 3g 4g
1 2 1 2
drain 1 drain 2 gate 1 gate 2
5 s source
12
g g
55
Top view
34
MAM098
Fig.1 Simplified outline and symbol.
d
s
d
QUICK REFERENCE DATA
RF performance at T
MODE OF OPERATION
=25°C in a push-pull common source test circuit.
h
f
(MHz)
V
(V)
DS
P
(W)
L
G
p
(dB)
η
(%)
D
CW, class-B 108 50 300 >20 >60 CW, class-C 108 50 300 typ. 18 typ. 80 CW, class-AB 225 50 250 >14
typ. 16
>50
typ. 55
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO discs are not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
Philips Semiconductors Product Specification
VHF push-pull power MOS transistor BLF278
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per transistor section
V
DS
V
GS
I
D
P
tot
T
stg
T
j
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-mb
R
th mb-h
drain-source voltage 110 V gate-source voltage −±20 V drain current (DC) 18 A total power dissipation up to Tmb=25°C total device;
500 W
both sections equally loaded storage temperature 65 150 °C junction temperature 200 °C
thermal resistance from junction to mounting base
thermal resistance from mounting base to heatsink
total device; both sections
equally loaded.
total device; both sections
equally loaded.
max. 0.35 K/W
max. 0.15 K/W
100
handbook, halfpage
I
D
(A)
(1)
10
1
1 10 100
Total device; both sections equally loaded. (1) Current is this area may be limited by R (2) Tmb=25°C.
Fig.2 DC SOAR.
(2)
DSon
MRA988
V (V)
DS
.
500
500
handbook, halfpage
P
tot
(W)
400
300
200
100
0
0 40 80 160
Total device; both sections equally loaded. (1) Continuous operation. (2) Short-time operation during mismatch.
(1)
Fig.3 Power derating curves.
(2)
120
MGE616
Th (°C)
Philips Semiconductors Product Specification
VHF push-pull power MOS transistor BLF278
CHARACTERISTICS
T
=25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Per transistor section
V
(BR)DSS
I
DSS
I
GSS
V
GSth
V
GS
g
fs
g
fs1/gfs2
R
DSon
I
DSX
C
is
C
os
C
rs
C
d-f
drain-source breakdown voltage VGS= 0; ID=50mA 110 −−V drain-source leakage current VGS= 0; VDS=50V −−2.5 mA gate-source leakage current VGS= ±20 V; VDS=0 −−1µA gate-source threshold voltage VDS=10V; ID=50mA 2 4.5 V gate-source voltage difference
VDS=10V; ID=50mA −−100 mV of both sections
forward transconductance VDS=10V; ID= 5 A 4.5 6.2 S forward transconductance ratio
VDS=10V; ID=5A 0.9 1.1 of both sections
drain-source on-state resistance VGS= 10 V; ID=5A 0.2 0.3 drain cut-off current VGS= 10 V; VDS=10V 25 A input capacitance VGS= 0; VDS= 50 V; f = 1 MHz 480 pF output capacitance VGS= 0; VDS= 50 V; f = 1 MHz 190 pF feedback capacitance VGS= 0; VDS= 50 V; f = 1 MHz 14 pF drain-flange capacitance 5.4 pF
handbook, halfpage
0
T.C.
(mV/K)
1
2
3
4
5
10
VDS=10V.
2
1
10
110
ID (A)
Fig.4 Temperature coefficient of gate-source
voltage as a function of drain current; typical values per section.
MGE623
30
handbook, halfpage
I
D
(A)
20
10
0
0
VDS= 10V; Tj=25°C.
5
10
MGE622
VGS (V)
Fig.5 Drain current as a function of gate-source
voltage; typical values per section.
15
Philips Semiconductors Product Specification
VHF push-pull power MOS transistor BLF278
400
handbook, halfpage
R
DSon
(m)
300
200
100
0
0 50 100 150
VGS= 10V; ID=5A.
Tj (°C)
Fig.6 Drain-source on-state resistance as a
function of junction temperature; typical values per section.
MGE621
C
is
C
os
VDS (V)
MGE615
1200
handbook, halfpage
C
(pF)
800
400
0
0
VGS= 0; f= 1 MHz.
20
40
Fig.7 Input and output capacitance as functions
of drain-source voltage; typical values per section.
60
400
handbook, halfpage
C
rs
(pF)
300
200
100
0
010 50
VGS= 0; f = 1 MHz.
20 30 40
VDS (V)
Fig.8 Feedback capacitance as a function of
drain-source voltage; typical values per section.
MGE620
Philips Semiconductors Product Specification
VHF push-pull power MOS transistor BLF278
APPLICATION INFORMATION Class-B operation
RF performance in CW operation in a common source push-pull test circuit. T otherwise specified. R
=4Ω per section; optimum load impedance per section = 3.2 + j4.3 (VDS= 50 V).
GS
=25°C; R
h
= 0.15 K/W unless
th mb-h
MODE OF OPERATION
f
(MHz)
V
(V)
DS
I
DQ
(A)
CW, class-B 108 50 2 × 0.1 300 >20
P
(W)
L
G
p
(dB)
η
(%)
D
>60
typ. 22
typ. 70
CW, class-C 108 50 VGS= 0 300 typ. 18 typ. 80
Ruggedness in class-B operation
The BLF278 is capable of withstanding a load mismatch corresponding to VSWR =7:1 through all phases under the conditions: V
= 50 V; f = 108 MHz at rated load power.
DS
Philips Semiconductors Product Specification
VHF push-pull power MOS transistor BLF278
30
handbook, halfpage
G
p
(dB)
20
10
0
0
Class-B operation; VDS=50V;IDQ=2×0.1 A; f = 108 MHz;
= 3.2 + j4.3 (per section); RGS=4Ω (per section).
Z
L
(1) Th=25°C. (2) Th=70°C.
(1)
(2)
200 400 600
PL (W)
Fig.9 Power gain as a function of load power,
typical values.
MGE682
80
handbook, halfpage
η
D
(%)
60
(1)
40
20
0
0 200 400
Class-B operation; VDS=50V;IDQ=2×0.1 A; f = 108 MHz;
= 3.2 + j4.3 (per section); RGS=4Ω (per section).
Z
L
(1) Th=25°C. (2) Th=70°C.
(2)
(2)
(1)
PL (W)
Fig.10 Efficiency as a function of load power,
typical values.
MGE683
600
600
handbook, halfpage
P
L
(W)
400
200
0
0
Class-B operation; VDS=50V;IDQ=2×0.1 A; f = 108 MHz;
= 3.2 + j4.3 (per section); RGS=4Ω (per section).
Z
L
(1) Th=25°C. (2) Th=70°C.
(1)
(2)
51015
MGE684
Pi (W)
Fig.11 Load power as a function of input power,
typical values.
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