Philips BLF277 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BLF277
VHF power MOS transistor
Product specification
September 1992
Philips Semiconductors Product specification
FEATURES
High power gain
Easy power control
Gold metallization ensures
excellent reliability
Good thermal stability
Withstands full load mismatch.
DESCRIPTION
Silicon N-channel enhancement mode vertical D-MOS transistor designed for large signal amplifier applications in the VHF frequency range.
The transistor is encapsulated in a 6-lead, SOT119 flange envelope, with a ceramic cap. All leads are isolated from the flange.
A marking code, showing gate-source voltage (V
) information is provided
GS
for matched pair applications. Refer to the ‘General' section for further information.
PIN CONFIGURATION
ndbook, halfpage
1
3
MSB006
2
d
4
65
g
MBB072
s
Fig.1 Simplified outline and symbol.
CAUTION
The device is supplied in an antistatic package. The gate-source input must be protected against static charge during transport and handling.
PINNING - SOT119
PIN DESCRIPTION
1 source 2 source 3 gate 4 drain 5 source 6 source
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
WARNING
QUICK REFERENCE DATA
RF performance at T
MODE OF OPERATION
= 25 °C in a common source circuit.
h
(MHz)
f
V
(V)
DS
P
(W)
L
G
(dB)
p
(%)
CW, class-B 175 50 150 > 14 > 50
η
D
September 1992 2
Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
±V
GS
I
D
P
tot
T
stg
T
j
THERMAL RESISTANCE
drain-source voltage 110 V gate-source voltage 20 V DC drain current 16 A total power dissipation up to Tmb = 25 °C 220 W storage temperature 65 150 °C junction temperature 200 °C
SYMBOL PARAMETER CONDITIONS
R
th j-mb
thermal resistance from junction to
Tmb = 25 °C; P
= 220 W 0.8 K/W
tot
mounting base
R
th mb-h
thermal resistance from mounting
Tmb = 25 °C; P
= 220 W 0.2 K/W
tot
base to heatsink
2
10
handbook, halfpage
I
D
(A)
10
1
1
10
110
(1) (2)
2
10
MRA906
3
DS
(V)
10
V
300
handbook, halfpage
P
tot
(W)
200
100
0
050
THERMAL
RESISTANCE
(1)
(2)
100 150
Th (°C)
MGP219
(1) Current in this area may be limited by R (2) Tmb=25°C.
DS(on)
.
Fig.2 DC SOAR.
September 1992 3
(1) Continuous operation. (2) Short-time operation during mismatch.
Fig.3 Power/temperature derating curves.
Philips Semiconductors Product specification
CHARACTERISTICS
T
= 25 °C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
V
GS
g
fs
R
DS(on)
I
DSX
C
is
C
os
C
rs
drain-source breakdown voltage VGS = 0; ID = 50 mA 110 −− V drain-source leakage current VGS = 0; VDS = 50 V −−2.5 mA gate-source leakage current ±VGS = 20 V; VDS = 0 −−1 µA gate-source threshold voltage ID = 50 mA; VDS = 10 V 2 4.5 V gate-source voltage difference of
ID = 50 mA; VDS = 10 V −−100 mV
matched pairs forward transconductance ID = 5 A; VDS = 10 V 4.5 6.2 S drain-source on-state resistance ID = 5 A; VGS = 10 V 0.2 0.3 on-state drain current VGS = 10 V; VDS = 10 V 25 A input capacitance VGS = 0; VDS = 50 V; f = 1 MHz 480 pF output capacitance VGS = 0; VDS = 50 V; f = 1 MHz 190 pF feedback capacitance VGS = 0; VDS = 50 V; f = 1 MHz 14 pF
handbook, halfpage
0
T.C.
(mV/K)
1
2
3
4
5
VDS= 10 V.
2
1
10
1
ID (A)
Fig.4 Temperature coefficient of gate-source
voltage as a function of drain current, typical values.
MGP220
30
handbook, halfpage
I
D
(A)
20
10
0
1010
0 5 10 15
VDS = 10 V; Tj = 25 °C.
MGP221
VGS (V)
Fig.5 Drain current as a function of gate-source
voltage, typical values.
September 1992 4
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