Philips BGY1816S Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
andbook, halfpage
M3D388
BGY1816S
UHF amplifier module
Product specification Supersedes data of 1999 Jan 07
1999 Apr 13
Philips Semiconductors Product specification
UHF amplifier module BGY1816S
FEATURES
26 V nominal supply voltage
16 W output power into a load of 50 Ω with an RF drive power of 20 mW.
APPLICATIONS
Base station transmitting equipment operating in the 1805 to 1880 MHz frequency band.
DESCRIPTION
The BGY1816S is a three-stage UHF amplifier module in a SOT501A package with a plastic cap. It consists of three NPN silicon planar transistor dies mounted together with matching and bias circuit components on a metallized ceramic AlN substrate.
PINNING - SOT501A
PIN DESCRIPTION
1 RF input 2V 3V 4 RF output
Flange ground
1
Front view
Fig.1 Simplified outline.
S1 S2
234
MBK760
QUICK REFERENCE DATA
RF performance at T
MODE OF OPERATION
=25°C.
mb
f
(MHz)
V
(V)
S1
V
(V)
S2
P
(W)
L
G
p
(dB)
η
(%)
ZS; Z
CW 1805 to 1880 5 26 16 29 30 50
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
S1
V
S2
P
D
P
L
T
stg
T
mb
DC supply voltage 4.5 5.5 V DC supply voltage 28 V input drive power 120 mW load power Tmb=25°C 20 W storage temperature 30 +100 °C operating mounting base temperature 10 +90 °C
L
()
1999 Apr 13 2
Philips Semiconductors Product specification
UHF amplifier module BGY1816S
CHARACTERISTICS
T
=25°C; VS1=5V; VS2= 26 V; PL= 16 W; ZS=ZL=50Ω unless otherwise specified.
mb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
f frequency 1805 1880 MHz I
S1
I
S2
P
L
G
p
η efficiency 30 −−% H
2
H
3
VSWR
B AM bandwidth corner frequency=3dB;
supply current 80 mA supply current PD< 60 dBm 430 mA load power PD<20mW 16 −−W power gain 29 −−dB
second harmonic −−−35 dBc third harmonic −−−40 dBc input VSWR −−2:1
in
stability VSWR 2 : 1 through all phases;
16 W; VS2=25to27V
P
L
reverse intermodulation P
carrier
=16W; P
reverse
= 40 dBc;
−−−60 dBc
−−−53 dBc
fi=fc±200 kHz
2 −−MHz
P
= 16 W; modulation = 20%
carrier
ruggedness VSWR 5 : 1 through all phases no degradation
1999 Apr 13 3
Philips Semiconductors Product specification
UHF amplifier module BGY1816S
handbook, full pagewidth
C8
C6
R2 L2
C4
C2
V
S2
50
output
MGM861
Z
2
50 input
C7
C5
Z
1
R1 L1
C3
C1
V
S1
Fig.2 Test circuit.
List of components (see Figs 2 and 3)
COMPONENT DESCRIPTION VALUE CATALOGUE NO.
C1, C2 electrolytic capacitor 10 µF; 35 V C3, C4 multilayer ceramic chip capacitor 10 nF; 50 V C5, C6 multilayer ceramic chip capacitor 100 pF; 50 V C7, C8 multilayer ceramic chip capacitor 10 pF; 50 V L1, L2 Grade 4S2 Ferroxcube bead 4330 030 36300 R1, R2 metal film resistor 10 ; 0.4 W 2322 195 13109
, Z
Z
1
2
stripline; note 1 50 Ω−
Note
1. The striplines are on a double copper-clad printed-circuit board with epoxy dielectric (ε
1999 Apr 13 4
= 4.5); thickness = 1 mm.
r
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