Philips bf909wr DATASHEETS

DISCRETE SEMICONDUCTORS
DATA SH EET
BF909WR
N-channel dual-gate MOS-FET
Product specification File under Discrete Semiconductors, SC07
Philips Semiconductors
1995 Apr 25
Philips Semiconductors Product specification
N-channel dual-gate MOS-FET BF909WR
FEATURES
Specially designed for use at 5 V supply voltage
Short channel transistor with high forward transfer
admittance to input capacitance ratio
Low noise gain controlled amplifier up to 1 GHz
Superior cross-modulation performance during AGC.
APPLICATIONS
VHF and UHF applications with 3 to 7 V supply voltage such as television tuners and professional communications equipment.
DESCRIPTION
Enhancement type field-effect transistor in a plastic microminiature SOT343R package. The transistor consists of an amplifier MOS-FET with source and substrate interconnected and an internal bias circuit to ensure good cross-modulation performance during AGC.
CAUTION
The device is supplied in an antistatic package. The gate-source input must be protected against static discharge during transport or handling.
PINNING
PIN SYMBOL DESCRIPTION
1 s, b source 2 d drain 3g 4g
handbook, halfpage
34
21
Top view
Marking code: ME.
gate 2
2
gate 1
1
g g
MAM192
d
2
1
Fig.1 Simplified outline (SOT343R) and symbol.
s,b
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
DS
I
D
P
tot
T
j
forward transfer admittance 36 43 50 mS
y
fs
C
ig1-s
C
rs
drain-source voltage −−7V drain current −−40 mA total power dissipation −−280 mW operating junction temperature −−150 °C
input capacitance at gate 1 3.6 4.3 pF reverse transfer capacitance f = 1 MHz 30 50 fF
F noise figure f = 800 MHz 2 2.8 dB
1995 Apr 25 2
Philips Semiconductors Product specification
N-channel dual-gate MOS-FET BF909WR
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
I
D
I
G1
I
G2
P
tot
T
stg
T
j
Note
1. Device mounted on a printed-circuit board.
drain-source voltage 7V drain current 40 mA gate 1 current −±10 mA gate 2 current −±10 mA total power dissipation up to T
=50°C; see Fig.2;
amb
280 mW
note 1 storage temperature range 65 +150 °C operating junction temperature +150 °C
300
handbook, halfpage
P
tot
(mW)
200
100
0
0 50 100 200
150
T ( C)
amb
Fig.2 Power derating curve.
MLD150
o
1995 Apr 25 3
Philips Semiconductors Product specification
N-channel dual-gate MOS-FET BF909WR
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
R
th j-s
Notes
1. Device mounted on a printed-circuit board.
2. Ts is the temperature at the soldering point of the source lead.
STATIC CHARACTERISTICS
=25°C; unless otherwise specified.
T
j
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
(BR)G1-SS
V
(BR)G2-SS
V
(F)S-G1
V
(F)S-G2
V
G1-S(th)
V
G2-S(th)
I
DSX
I
G1-SS
I
G2-SS
thermal resistance from junction to ambient note 1 350 K/W thermal resistance from junction to soldering point Ts=91°C; note 2 210 K/W
gate 1-source breakdown voltage V gate 2-source breakdown voltage V forward source-gate 1 voltage V forward source-gate 2 voltage V gate 1-source threshold voltage V gate 2-source threshold voltage V drain-source current V
G2-S=VDS G1-S=VDS G2-S=VDS G1-S=VDS G2-S G1-S=VDS G2-S
= 0; I = 0; I = 0; I = 0; I
= 10 mA 6 15 V
G1-S
= 10 mA 6 15 V
G2-S
= 10 mA 0.5 1.5 V
S-G1
= 10 mA 0.5 1.5 V
S-G2
=4V; VDS=5V; ID=20µA 0.3 1 V
=5V; ID=20µA 0.3 1.2 V
=4V; VDS=5V; RG1= 120 k;
12 20 mA
note 1 gate 1 cut-off current V gate 2 cut-off current V
G2-S=VDS G1-S=VDS
= 0; V = 0; V
=5V 50 nA
G1-S
=5V 50 nA
G2-S
Note
1. R
connects gate 1 to VGG=5V.
G1
DYNAMIC CHARACTERISTICS
Common source; T
=25°C; VDS=5V;V
amb
= 4 V; ID= 15 mA; unless otherwise specified.
G2-S
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
forward transfer admittance pulsed; Tj=25°C 364350mS
y
fs
C
ig1-s
C
ig2-s
C
os
C
rs
F noise figure f = 800 MHz; G
input capacitance at gate 1 f = 1 MHz 3.6 4.3 pF input capacitance at gate 2 f = 1 MHz 2.3 3 pF drain-source capacitance f = 1 MHz 2.3 3 pF reverse transfer capacitance f = 1 MHz 30 50 fF
S=GSopt
; BS=B
2 2.8 dB
Sopt
1995 Apr 25 4
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