Philips BDP-9600 Service Manual
Blue-Ray Disc Player
BDP9600/12/51/93/98
Contents
1 Repair Scenario Matrix..................................... 1-1
2 Technical Specification and Connection Facilities
3 Laser Beam Safety Precautions.................................3-1
4 Important Safety Precautions ..........................4-1 to 4-2
5 Safety Check After Servicing .................................... 5-1
6 Safety Information General Notes & Lead Free
Requirements ............................................................6-1
7 Standard Notes For Servicing,Lead Free Requirements
& Handling Flat Pack IC ..................................7-1 to 7-4
8 Direction of Use ...............................................8-1 to 8-5
9 Cabinet Disassembly Instructions ................... 9-1 to 9-3
10 Troubleshooting ....................................................... 10-1
11 Software Version Check &Upgrad..............11-1 to 11-2
12 Repair Service Flow....................................12-1 to 12-5
13 Block Diagram ........................................................13-1
14 Wiring Diagram ...................................................... 14-1
15 Touch Key Board
©
Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a
retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without the prior permission of Philips.
...................................................2-1 to 2-2
Circuit Diagram .................................15-1
Layout Diagram ................................15-1
Page
/93/51
Page
/98
Contents
16 Output Board
Circuit Diagram .................................15-2
Layout Diagram ................................15-3
17 Power Socket and LED Board
Circuit Diagram .................................15-4
Layout Diagram ................................15-4
18 VFD Display Board
19 MCU Board
20 Decoder Board
21 Power Board
22 Exploded View......................................................16-1 to 16-2
23 Revision List .........................................................17-1
Circuit Diagram ...............................15-5
Layout Diagram ...............................15-6
Circuit Diagram ..............................15-7
Layout Diagram .............................15-8
Block Diagram ................................15-9
Layout Diagram ..............................15-10
Circuit Diagram ..............................15-11
Layout Diagram .............................15-12
Feature
Features
RDS
Voltage Selector
ECO Standby
DTS
Different
/12
Published by RY-KM 1046 AVM Printed in the Netherlands
Version 1.1
Subject to modi cation EN
3139 785 35511
Rapir Scenario Matrix
Type Versions
BDP9600
Boards in Used /12 /51 /93 /98
Touch Key Board C C C C
Power Socket Board C C C C
VFD Display Board C C C C
MCU Board C C C C
LED Board C C C C
Power Board BD BD BD BD
Output Board BD BD BD BD
Decoder Board BD BD BD BD
*C=Component Level Repair
*BD=Board Level Replacement
1-1
Technical Specification and Connection Facilities
1. Technical Specification and Connection Facilities
1.1 PCB Locations
Power Board
VFD Display Board
Power Socket Board
Bly-Ray Loader Driver
Output Board
LED Board
Touch Key Board
Decoder Board
WIFI Module
MCU Board
Specifications differences
Type/Versions
Specifications /12 /51 /93 /98
Voltage 230V 230V 110V-240V 110V-240V
Frequency 50Hz 50Hz 50Hz-60Hz 50Hz-60Hz
2-1
BDP9600
Technical Specifications and Connection Facilities
1.2 General
Power supply : 110-240V, 50Hz~60Hz
Power consumption : 30W
Standby power consumption ： ＜0.2 W
1.3 Connectivity
CD-DA(PCM)/VideoCD(MPEG-1)
Output Voltage : 2V ± 0.5dB
Signal to Noise Ratio
8QZHLJKWHG G%
$ZHLJKWHG G%
:LWK$XWRPXWH G%
2XWEDQG$WWHQXDWLRQ$ERYHN+]G%
DVD(LPCM / MPEG-2 /Dobly AC-3)
Output Voltage : 2V ± 0.5dB
6LJQDOWR1RLVH5DWLRG%
Outband Attenuation(Above25kHz) :
Digital Audio Outputs
LPCM : accordingIEC 60958-3
MPEG 1, MPEG 2, AC3 : according IEC 61937
DTS : according IEC 61937+
addendum
Coaxial & Optical output
2XWSXWVLJQDO$PSOLWXGHȍWHUPLQDWHU9SS
2XWSXWLPSHGDQFHȍ
DC Output voltageȍWHUPLQDWHU9
Video Supporting Format
Signal system : PAL/NTSC
HDMI output : 480p,576p,720p,1080i,
Video output : 480/576i,480/576p,
CVBS Output Component
Amplitude Output : 1000mVpp ± 10%
White Bar : 714mVpp ± 10%
Sync.Amplitude : 286mVpp ± 10%
S/N Luminunce G%
Chroma/Luminunce Delay(2T pulse) :
DC Level :
Video Output Component
Amplitude Output : 1000mVpp ± 10%
White Bar : 714mVpp ± 10%
Sync.Amplitude : 286mVpp ± 10%
S/N Luminunce G%
DC Level :
USB
Compatibility : USB2.0
Type of connector : Series A Connector
Class support : UMS(USB Mass Storage Class)
File System : FAT12,FAT16,FAT32
HDMI Output
Compatibility : HDMI Version 1.4
Type of connector : Type A Connector(19pins)
-50dB
1080p,1080p24
720p,1080i
20nS
1V
1V
1.4 Dimension and Weight
Set Dimension WxHxD : 435x70x260(mm)
Net Weight : 5.0kg
1.5 Laser Output Power & Wavelength
DVD
Output power : 6mW
Wavelength : 655 +10nm/-10nm
CD
Output power : 7mW
Wavelength : 790 +10nm/-20nm
1.6 Playability
Video Playback
1. Playback Media:
CD-R/CD-RW, DVD+R/+RW,
DVD-R/-RW, DVD-Video, Video
CD/SVCD, DVD+R DL, DVD-R
DL,USB flash drive
2. Compression Formats:
MPEG2, MPEG1, DivX 3.11, DivX
4.x, DivX 5.x, DivX 6.0, MPEG4
Audio Playback
1. Playback Media:
Audio CD, CD-R/RW, DVD+R DL,
DVD+R/+RW, DVD-R/-RW, MP3CD,MP3-DVD,USB flash drive,
WMA-CD
2. Compression Format:
Dolby Digital, MP3, MPEG2
Multichannel, PCM, WMA
3. MPEG1 bit rates: 64-384 kbps
and VBR
Still Picture Playback
1. Playback Media: CD-R/RW,
DVD+R DL, DVD+R/+RW, DVDR/-RW, Picture CD, USB Digital
Camera(PTP),USB flash drive
2. Picture Compression Format:
JPEG, JPEG digital camera
photos
3. Picture enhancement: Slideshow
with MP3 playback, Create
albums, Rotate, Slideshow with
music playback, Zoom
x
x
x
x
x
x
x
x
2-2
Laser Beam Safety Precautions
This Blu-Ray player uses a pickup that emits a laser beam.
Do not look directly at the laser beam coming
from the pickup or allow it to strike against your
skin.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.
Drive Mechanism Assembly
Laser Beam Radiation
Laser Pickup
Turntable
Location: Inside Top of Blu-Ray mechanism.
3-1
Important Safety Precautions
Important
Read and understand all instructions before you use
your home theater. If damage is caused by failure to
follow instructions, the warranty does not apply.
Safety
Riskof electricshockor re!
Neverexposetheproductand
accessories to rain or water. Never place
liquid containers, such as vases, near the
product. If liquids are spilt on or into the
product, disconnect it from the power
outlet immediately. Contact Philips
Consumer Care to have the product
checked before use.
Never place the product and accessories
near naked
including direct sunlight.
Neverinsertobjectsintotheventilation
slots
or other openings on the product.
Wherethemainsplugoranappliance
coupler is used as the disconnect device,
the disconnect device shall remain readily
operable.
Disconnect the product from the power
outlet before lightning storms.
Whenyoudisconnectthepowercord,
always pull the plug, never the cable.
Riskof short circuit or
Before you connect the product to the
poweroutlet,ensurethatthepower
voltage matches the value printed on the
back or bottom of the product. Never
connec
if the voltage is different.
Risk of injury or damage to the home theater!
For wall-mountable products, use only
the supplied wall mount bracket. Secure
the wall mount to a wall that can support
the combined weight of the product
and the wall mount. Koninklijke Philips
Electronics N.V. bears no responsibility
for improper wall mounting that results in
accident,injuryordamage.
ames or other heat sources,
re!
ttheproducttothepoweroutlet
For speakers with stands, use only the
supplied stands. Secure the stands to
the speakers tightly. Place the assembled
stands on
support the combined weight of the
speaker and stand.
Never place the product or any objects
on power cords or on other electrical
equipment.
If the product is transported in
temperatures below 5°C, unpack the
product and wait u
matches room temperature before
connecting it to the power outlet.
Visible and invisible laser radiation when
open. Avoid exposure to beam.
Do not touch the disc optical lens inside
the disc compartment.
Risk of overheating!
Never install this product in a con
space. Always leave a space of at least
four inches around the product for
ventilation. Ensure curtains or other
objects never cover the ventilation slots
on the product.
Risk of contamination!
Do not mix batteries (old and new or
carbon and alkaline,
Remove batteries if they are exhausted
oriftheremotecontrolisnottobeused
for a long time.
Batteries contain chemical substances,
they should be disposed of properly.
t,levelsurfacesthatcan
ntil its temperature
etc.).
Product care
Do not insert any objects other than discs
into the disc compartment.
Donotinsertwarpedorcrackeddiscs
intothedisccompartme
Remove discs from the disc compartment
ifyouarenotusingtheproductforan
extended period of time.
Only use microfiber cloth to clean the
product.
nt.
ned
4-1
Important Safety Precautions
Disposal of your old product and
batteries
Your product is designed and manufactured
with high quality materials and components,
which can be recycled and reused.
When this crossed-out wheeled bin symbol
is attached to a product it means that the
product is covered by the European Directive
2002/96/EC.Pleaseinformyourselfaboutthe
local separate collection system for electrical
and electronic products.
Please act according to your local rules and
do not dispose of your old products with your
normal household waste.
Corr
ect disposal of your old product helps to
prevent pote
the environment and human health.
ntial negative consequences for
Your product contains batteries covered by
the European Directive 2006/66/EC, which
cannot be disposed with normal household
waste.
Please inform yourself about the local rules
on separate collection of batteries because
correct disposal helps to prevent negative
consequences for the environmental and
human health.
4-2
Safety Check after Servicing
Examine the area surrounding the repaired location for damage or deterioration. Observe that screws, parts, and
wires have been returned to their original positions. Afterwards, do the following tests and confirm the specified
values to verify compliance with safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between
soldered terminals, and between term
surrounding metallic parts. (See Fig. 1)
Table 1: Rating
s for selected area
inals and
Chassis or Secondary Conductor
Primary Circuit
AC Line Voltage Clearance Distance (d), (d
110V~220V
Note: This table is unofficial and for reference only. Be
sure to confirm the precise values.
3.2 mm (0.126 inches)
’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs) and
externally exposed accessible parts (RF terminals,
antenna terminals, video and audio input and output
terminals, microphone jacks, earphone jacks, etc.) is
than or equal to the specified value in the table
lower
below.
Measuring Method (Power ON):
Insert load Z between B (earth ground, power cord plug
prongs) and exposed accessible parts. Use an AC
voltmeter to measure across the terminals of load Z.
See Fig. 2 and the following table.
d' d
Fig. 1
Exposed Accessible Part
Z
AC Voltmeter
(High Impedance)
Earth Ground
B
Power Cord Plug Prongs
Table 2: Leakage current ratings for selected areas
AC Line Voltage Load Z Leakage Current (i) Earth Ground (B) to:
110V~220V
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
0.15 μF CAP. & 1.5 k
Connected in parallel
RES.
i
0.5 mA Peak Exposed accessible parts
5-1
Fig. 2
Safety Information, General Notes & Lead Free Requirements
1 Safety Instructions
1.1 General Safety
Safety regulations require that during a repair:
Connect the unit to the mains via an isolation transformer.
Replace safety components, indicated by the symbol
only by components identical to the original ones. Any
other component substitution (other than original type)
Safety regulations require that after a repair, you must return
the unit in its original condition. Pay, in particular, attention to
the following points:
Route the wires/cables correctly
mounted cable clamps.
damage.
Check the electrical DC resistance between the mains
plug and the secondary side:
1. Unplug the mains cord, and connect a wire between
the two pins of the mains plug.
2. Set the mains switch to the ‘on’ position (keep the
mains cord unplugged!).
3. Measure the resistance value between the mains
plug and the front panel, controls, and chassis
bottom.
4. Repair or correct unit when the resistance
5. Verify this, before you return the unit to the customer/
user (ref. UL-standard no. 1492).
6. Switch the unit ‘off’, and remove the wire between the
two pins of the mains plug.
1.2 Laser Safety
This unit employs a laser
may remove the cover, or attempt to service this device (due
to possible eye injury).
2 Warnings
2.1 General
All ICs and many other semiconductors are susceptible to
electrostatic discharges (ESD,
,
during repair can reduce life drastically. Make sure that,
during repair, you are at the same potential as the mass
of the set by a wristband with resistance. Keep
components and tools at this same potential.
Available ESD protection equipment:
– Complete kit ESD3 (small tablemat, wristband,
4822 310 10671.
– Wristband tester 4822 344 13999.
Be careful during measurements in the live voltage
section. The primary side of the power supply, including
the heatsink, carries live mains voltage when you
connect the player to the mains (even when the
player is ‘off’!). It is possible to touch copper tracks and/
or components in this unshielded primary area, when
you service the player. Service personnel must take
precautions to prevent touching this area or components
in this area. A ‘lightning stroke’ and a stripe-marked
printing on the printed wiring board, indicate the primary
side of the power supply.
Never replace modules, or components, while the unit is
‘on’.
2.2 Laser
The use of optical instruments with this product, will
Only quali ed service personnel may remove the cover or
attempt to service this device, due to possible eye injury.
Repair handling should take place as much as possible
with a disc loaded inside the player.
T
shield:
). Careless handling
Laser Device Unit
epyT
:AIGalnN(BD)
:AIGalnP(DVD)
: AIGalnP(CD)
Wavelength : 650 nm (DVD)
)DC/DCV(mn087:
405nm(BD):
Output Power : 20 mW
)gnitirwWR+DVD(
Wm8.0:
)gnidaerDVD(
Wm3.0:
)gnidaerDC/DCV(
Beam divergence : 60 degree
CLASS 1
LASER PRODUCT
1-2erugiF
Note: Use of controls or adjustments or performance of
procedure other than those speci
ed herein, may result in
A
CAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPENAVOID EXPOSURE TO BEAM
ADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING VED ÅBNING UNDGÅ UDSÆTTELSE FOR STRÅLING
ADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES UNNGÅ EKSPONERING FOR STRÅLEN
VARNING SYNLIG OCH OSYNLIG LASERSTRÅLNING NÄR DENNA DEL ÄR ÖPPNAD BETRAKTA EJ STRÅLEN
VARO ! AVAT TAESSA OLETALTTIINA NÄKYVÄLLE JA NÄKYMÄTTÖMÄLLE LASER SÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN
VORSICHT SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG WENN ABDECKUNG GEÖFFNETNICHT DEM STRAHL AUSSETSEN
DANGER VISIBLE AND INVISIBLE LASER RADIATION WHEN OPENAVOID DIRECT EXPOSURE TO BEAM
ATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS D’OUVERTURE EXPOSITION DANGEREUSE AU FAISCEAU
Figure 2-2
6-1
Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
Top View
Out
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
Pin 1
3. The 1st pin of every male connector is indicated as
shown.
Pin 1
Input
In
Bottom View
5
10
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an
angle.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
Information about lead-free soldering
Philips CE is producing lead-free sets from 1.1.2005
onwards.
IDENTIFICATION
Regardless of special logo (not always
indicated)
One must treat all sets from
onwards, according to the next rule:
Serial Number gives a 14-digit. Digit 5&6 shows the
YEAR, and digit 7&8 shows the WEEK.
So from onwards=from 1 Jan 2005 onwards
0501
Important note : In fact also products of year 2004
must be treated in this way as long as you avoid
mixing solder-alloys (leaded/ lead-free). So best to
always use SAC305 and the higher temperatures
belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solderpaste is required, please contact the manufacturer
of your sol
paste within workshops should be avoided because
paste is not easy to store and to handle.
Use only adequate solder tools applicable for leadfree solder alloy. The solder tool must be able
To reach at least a solder-temperature of 400°C,
To stabilize the adjusted temperature at the solder-
tip
To exchange solder-tips for different applications.
Adjust your solder tool so that a temperature around
360°C
solder joint. Heating-time of the solder-joint should
not exceed ~ 4 sec. Avoid temperatures above
400°C otherwise wear-out of tips will rise drastically
and flux-fluid will be destroyed. To avoid wear-out of
tips switch off un-used equipment, or reduce heat.
Mix of lead-free solder alloy / parts with leaded
solder alloy / parts is possible but PHILIPS
recommends strongly to avoid mixed solder alloy
types (leaded
If one cannot avoid or does not know whether
product is lead-free, clean carefully the solder-joint
from old solder alloy and re-solder with new solder
alloy (SAC305).
Use only original spare-parts listed in the ServiceManuals. Not listed standard-material (commodities)
has to be purchased at external companies.
der-equipment. In general use of solder-
- 380°C is reached and stabilized at the
and lead-free).
1 Jan 2005
7-1
Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC
Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for desoldering always use the lead-free temperature
profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
'dry-packaging' (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on indicatorlabel in the bag, the BGA-IC possibly still has to be
baked dry. (MSL=Moisture Sensit
will be communicated via AYS-website.
Do not re-use BGAs at all.
For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
On our website
www.atyourservice.ce.Philips.com
information to:
BGA-de-/soldering (+ baking instructions)
Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information within
the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
ivity Level). This
you find more
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
to the
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appr
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
opriate hot-air flat pack-IC desoldering
7-2
Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Tweezers
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
Machine
Flat Pack-IC
Fig. S-1-2
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
With Iron Wire:
1. Using desoldering braid, remove
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or s
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
4. Bottom of the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be dama
flat pack-IC is fixed with glue to the
ensure that the flat pack-IC is not
the solder from
olid mounting
ged if force is applied.
Soldering Iron
Fig. S-1-3
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to whic
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air de
machine. (Fig. S-1-4)
Fine Tip
Soldering Iron
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
h solder will
soldering
Sharp
Pin
Fig. S-1-4
7-3
To Solid
Mounting Point
CBA
Tweezers
Hot Air Blower
or
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC
2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.
2. The “
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
” mark on the flat pack-IC indicates pin 1.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Instructions for Handling Semiconductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 M ) that is
properly grounded to remove any static electricity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1 M
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be
with your clothing.
careful to avoid contacting semi-conductors
<Incorrect>
) on the workbench or
CBA
Presolder
Flat Pack-IC
Fig. S-1-8
<Correct>
1M
CBA
Grounding Band
1M
CBA
Conductive Sheet or
Copper Plate
7-4
Direction of Use
j
*The following excerpt of the DFU/QSG serves as an introduction to the set.
The Complete Direction for Use can be download in different languages from
the internet site of Philips Customer care Center : www.support.philips.com
Product overview
Main unit
c
b
a
a
bDisplaypanel
cIRsensor
d Disc compartment
e
f
g
h
Turn on this player or switch to standby
mode.
Detect signals from the remote control.
Always point the remote control at the
IR sensor.
Open or close the disc compartment .
Startorresumeplay.
Pause play.
jack
Connect a USB device.
Remote control
a
b
c
g
e
d
h
f
d
e
f
g
e
q
p
h
i
o
n
j
k
l m
a
b
cDISC/POP-UP
d
e
Turn on this player or switch to standby
mode.
When EasyLink is enabled, press and
hold for at least three seconds to turn all
connected HDMI CEC compliant devices
to standby.
Accessthehomemenuofthisplayer.
BD:Accessorexitthepop-upmenu.
DVD: Access or exit the disc menu.
/ / /
Navigate through the menus.
/
Skip to the previous or next title, chapter,
or track.
8-1
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