c Copyright 2008 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval
system or transmitted, in any form or by any means, electronic, mechanical, photocopying,
or otherwise without the prior permission of Philips.
CLASS 1 LASER PRODUCT
KLASSE 1 LASER PRODUKT
KLASS 1 LASER APPARAT
CLASSE 1 PRODUIT LASER
Published by FU-KC 834 Service AV Systems Printed in The Netherlands Subject to modification
Version 1.0
12NC 3139 785 34350
IMPORTANT SAFETY NOTICE
Proper service and repair is important to the safe, reliable operation of all
Philips Equipment. The service procedures recommended by Philips and
described in this service manual are effective methods of performing
service operations. Some of these service special tools should be used
when and as recommended.
It is important to note that this service manual contains various CAUTIONS
and NOTICES which should be carefully read in order to minimize the risk
of personal injury to service personnel. The possibility exists that improper
service methods may damage the equipment. It also is important to
understand that these CAUTIONS and NOTICES ARE NOT EXHAUSTIVE.
Philips could not possibly know, evaluate and advice the service trade of all
conceivable ways in which service might be done or of the possible
hazardous consequences of each way. Consequently, Philips has not
undertaken any such broad evaluation. Accordingly, a servicer who uses a
service procedure or tool which is not recommended by Philips must first
use all precautions thoroughly so that neither his safety nor the safe
operation of the equipment will be jeopardized by the service method
selected.
Manufactured under license from Dolby Laboratories.
Dolby and the double-D symbol are trademarks of Dolby Laboratories.
LASER BEAM SAFETY PRECAUTIONS
This BD player uses a pickup that emits a laser beam.
Do not look directly at the laser beam coming
from the pickup or allow it to strike against your
skin.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.
Drive Mechanism Assembly
Laser Beam Radiation
Laser Pickup
Turntable
Location: Inside Top of BD mechanism.
1-1-1B1.5P_LSP
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristics which are often not evident from visual inspection, nor can the protection
they give necessarily be obtained by replacing them
with components rated for higher voltage, wattage,
etc. Parts that have special safety characteristics are
identified by a ! on schematics and in parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire, and/or other
hazards. The Product’s Safety is under review continuously and new instructions are issued whenever
appropriate. Prior to shipment from the factory, our
products are carefully inspected to confirm with the
recognized product safety and electrical codes of the
countries in which they are to be sold. However, in
order to maintain such compliance, it is equally important to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified replacements.
Examples: RF converters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do not contact heat produc-
ing parts (heatsinks, oxide metal film resistors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has been replaced, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Use care that foreign objects (screws, solder drop-
lets, etc.) do not remain inside the set.
K. When connecting or disconnecting the internal
connectors, first, disconnect the AC plug from the
AC outlet.
1-2-1BDP_ISP
Safety Check after Servicing
Examine the area surrounding the repaired location
for damage or deterioration. Observe that screws,
parts, and wires have been returned to their original
positions. Afterwards, do the following tests and confirm the specified values to verify compliance with
safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d), (d’)
230 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3 mm(d)
≥6 mm(d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across the terminals of load
Z. See Fig. 2 and the following table.
Chassis or Secondary Conductor
Primary Circuit
d'd
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
AC Voltmeter
(High Impedance)
Fig. 1
Fig. 2
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
230 V
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
parallel
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
One side of power cord plug
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
1-2-2BDP_ISP
STANDARD NOTES FOR SERVICING
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
Top View
Out
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
Pin 1
3. The 1st pin of every male connector is indicated as
shown.
Pin 1
Input
In
Bottom View
5
10
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an
angle.
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
Information about lead-free soldering
Philips CE is producing lead-free sets from 1.1.2005
onwards.
IDENTIFICATION
Regardless of special logo (not always
indicated)
One must treat all sets from
onwards, according to the next rule:
Serial Number gives a 14-digit. Digit 5&6 shows the
YEAR, and digit 7&8 shows the WEEK.
So from onwards=from 1 Jan 2005 onwards
Important note
must be treated in this way as long as you avoid
mixing solder-alloys (leaded/ lead-free). So best to
always use SAC305 and the higher temperatures
belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solderpaste is required, please contact the manufacturer
of your solder-equipment. In general use of solderpaste within workshops should be avoided because
paste is not easy to store and to handle.
• Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able
• To reach at least a solder-temperature of 400°C,
• To stabilize the adjusted temperature at the solder-
• To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around
360°C
solder joint. Heating-time of the solder-joint should
not exceed ~ 4 sec. Avoid temperatures above
400°C otherwise wear-out of tips will rise drastically
and flux-fluid will be destroyed. To avoid wear-out of
tips switch off un-used equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded
solder alloy / parts is possible but PHILIPS
recommends strongly to avoid mixed solder alloy
types (leaded and lead-free).
If one cannot avoid or does not know whether
product is lead-free, clean carefully the solder-joint
from old solder alloy and re-solder with new solder
alloy (SAC305).
• Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased at external companies.
0501
: In fact also products of year 2004
tip
- 380°C is reached and stabilized at the
1 Jan 2005
1-3-1B1N_PC_SN
• Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for desoldering always use the lead-free temperature
profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
'dry-packaging' (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on indicatorlabel in the bag, the BGA-IC possibly still has to be
baked dry. (MSL=Moisture Sensitivity Level). This
will be communicated via AYS-website.
Do not re-use BGAs at all.
• For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
• On our website
www.atyourservice.ce.Philips.com
information to:
• BGA-de-/soldering (+ baking instructions)
• Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information within
the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
you find more
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
1-3-2B1N_PC_SN
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Machine
Flat Pack-IC
Tweezers
Fig. S-1-2
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
Hot Air Blower
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
To Solid
Mounting Point
CBA
Tweezers
or
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
1-3-3B1N_PC_SN
2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.
2. The “●” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Instructions for Handling Semiconductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 MΩ) that is
properly grounded to remove any static electricity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1 MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductors
with your clothing.
<Incorrect>
CBA
Presolder
Flat Pack-IC
Fig. S-1-8
<Correct>
1MΩ
CBA
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
1-3-4B1N_PC_SN
OPERATING CONTROLS AND FUNCTIONS
1-4-1E5J10IB
1-4-2E5J10IB
SIGNAL NAME ABBREVIATIONS
Signal NameFunction
A33-PW-CONT Power Regulator Control Signal
AL+12V
AL+2.5V
AL+5V
AUDIO(L)Audio Left Signal
AUDIO(L)MUTE
AUDIO(R)Audio Right Signal
AUDIO(R)MUTE
AUDIO+3.3V+3.3V Power Supply (Audio)
AUDIO+5V+5V Power Supply (Audio)
AUDIO+12V+12V Power Supply (Audio)
AUDIO-MUTEAudio Mute Control Signal
CEC-INCEC Signal Input
CEC-OUTCEC Signal Output
CENTERCenter Audio Signal (5.1ch)
CENTER-MUTE
EV+3.3V+3.3V Power Supply
F1Filament Power Supply 1
F2Filament Power Supply 2
FAN-CONTFan Motor Control Signal
FAN-DETECTFan Signal Detect
FAN-VCCPower Supply for Fan Motor
FLFIP Drive Power Supply
FL-CSFL Chip Select Signal
FL-RESETFL3000 Reset
FL-SCLFL Serial Clock
FL-SDAFL Serial Data
FL-SWFL On/Off Control Signal
FRONTAUDIO(L)
FRONT-AUDIO
(L)-MUTE
FRONTAUDIO(R)
FRONT-AUDIO
(R)-MUTE
GNDGround
IIC-BUS SCLIIC-BUS Serial Clock
IIC-BUS SDAIIC-BUS Serial Data
KEY-1Key Data Input 1
MAIN-P-ONPower On Signal
MODE1Mode 1 Signal
Always +12V with AC Plug
Connected
Always +2.5V with AC Plug
Connected
Always +5V with AC Plug
Connected
Audio Mute Control Left Signal
(Mute = “H”)
Audio Mute Control Right Signal
(Mute = “H”)
Center Audio Mute Signal
(Mute=“L”)
Front Audio Left Signal (5.1ch)
Front Audio Mute Left Signal
(Mute=“L”)
Front Audio Right Signal (5.1ch)
Front Audio Mute Right Signal
(Mute=“L”)
Signal NameFunction
MODE2Mode 2 Signal
OSC1Main Clock Output
OSC2Main Clock Input
P-ON+1.2V+1.2V at Power On Signal
P-ON+10.5V+10.5V at Power On Signal
P-ON+12V+12V at Power On Signal
P-ON+3.3V+3.3V at Power On Signal
P-ON+5V+5V at Power On Signal
PWSW1Power On Signal Output1
PWSW2Power On Signal Output2
PWSW3Power On Signal Output3
RDY
REMOTERemote Signal Input
RESETMicro Controller Reset Signal
SAFETYPower Supply Failure Detection
SPDIF
STANDBY-LEDStandby LED Control Signal
SUB WOOFER Sub Woofer Signal
SUB WOOFERMUTE
SUB-RXD
SUB-TXD
SURROUND(L) Surround Audio Left Signal (5.1ch)
SURROUND(R)
SURROUNDMUTE
SYS-RESETSystem Reset Signal
V5V-PW-SWVideo+5V Power Control
VDD+3.3V Power Supply
VIDEOComposite Video Signal
VIDEO-Pb/CbComponent Video Signal (Pb/Cb)
VIDEO-Pr/CrComponent Video Signal (Pr/Cr)
VIDEO-Y(I/P)
VREFGround
Ready/Busy communication
Control Signal
Digital Audio Interface Format
Signal
Sub Woofer Mute Signal (Mute=“L”)
Reception Data from Main Micro
Controller
Transmission Data to Main Micro
Controller
Surround Audio Right Signal
(5.1ch)
Surround Audio Mute
Signal(Mute=“L”)
Component Video (Luminance)
Signal (Interlace / Progressive)
1-5-1E5J10SNA
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] Top Cover
[2] Tray Panel
[3] Front Assembly
[4] Front CBA
[5] Power SW CBA
[6] FE Main CBA &
BD Mechanism Assembly
[7] BE Main CBA Unit
[8] Power Supply CBA
[9] Rear Panel
[11] AV CBA
[13] Front Bracket R
[10] Motor DC Fan
[12] SD CBA
ID/
Loc.
No.
[13]
↓
(1)
Part
Front
Bracket R
↓
(2)
Fig.
No.
D5 (S-18)---
↓
(3)
Removal
Remove/*Unhook/
Unlock/Release/
Unplug/Desolder
↓
(4)
Note
(5)
Note:
(1) Identification (location) No. of parts in the figures
(2) Name of the part
(3) Figure Number for reference
(4) Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P = Spring, L = Locking Tab, S = Screw,
CN = Connector
* = Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5) Refer to “Reference Notes.”
Reference Notes
↓
2. Disassembly Method
ID/
Loc.
No.
Part
Fig.
No.
[1]Top CoverD1 10(S-1)---
[2]Tray PanelD2 *2(L-1)1
[3]
Front
Assembly
*5(L-2), *3(L-3),
D2
*CN2001
[4]Front CBAD2 4(S-2)---
Power SW
[5]
CBA
D2 (S-3)---
FE Main
[6]
CBA & BD
Mechanism
4(S-4), *CN2601,
D3
*CN6401
Assembly
(S-5), (S-6), *CN7000,
[7]
BE Main
CBA Unit
*CN7001, *CN7401,
D3
*CN7602, Locking
Card Spacers
Power
[8]
Supply CBA
[9]Rear PanelD5
Motor DC
[10]
Fan
3(S-7a), (S-7b), (S-8),
D4
2(S-9), *CN2600,
Power PCB Holder
6(S-10), (S-11),
(S-12), *CN2004
D5 2(S-13), Fan Holder---
[11] AV CBAD5 5(S-14), (S-15), ---
[12] SD CBAD5
2(S-16), 2(S-17),
SD Card Holder
Removal
Remove/*Unhook/
Unlock/Release/
Unplug/Desolder
Note
1
2
---
---
---
---
1. CAUTION 1: Locking Tabs (L-1), (L-2) and (L-3)
are fragile. Be careful not to break them.
2. The FE Main CBA & BD Mechanism Assembly is
adjusted as a unit at factory. Therefore, do not
disassemble it. Replace the FE Main CBA & BD
Mechanism Assembly as a unit.
[1] Top Cover
(S-1)
(S-1)
(S-1)
Fig. D1
1-6-1E5J10DC
(S-9)
(S-7a)
(S-8)
(S-7a)
(S-7b)
[8] Power
Supply CBA
[5] Power
SW CBA
(L-2)
(L-2)
(L-3)
(L-1)
(L-1)
[2] Tray
Panel
[6] FE Main
CBA& BD
Mechanism
Assembly
CN2001
(S-3)
(L-3)
(L-3)
(S-2)
(L-2)
[3] Front Assembly
(S-4)
(S-6)
CN6401
[4] Front CBA
(L-2)
[7] BE Main CBA
Unit
CN7401
CN7000
CN7602
(S-2)
Wire
Fig. D2
(S-5)
CN7001
Power PCB
Holder
(S-15)
(S-14)
[11] AV CBA
Fan Holder
CN2600
Fig. D4
(S-14)
CN2004
(S-14)
[10] Motor DC Fan
CN2601
Locking Card
Spacers
Fig. D3
[9] Rear Panel
[13] Front
Bracket R
(S-18)
(S-12)
(S-13)
(S-16)
(S-17)
Wire
SD Card Holder
(S-11)
(S-10)
Wire
[12]
SD CBA
(S-17)
Fig. D5
1-6-2E5J10DC
3. How to Eject Manually
1. Remove the Top Cover.
2. Insert a screwdriver, etc. into the Hole A straightly so that the Portion A is pushed.
3. Pull the tray out manually and remove a disc.
Portion A
Hole A
Screwdriver,
hexagon wrench
1-6-3E5J10DC
HOW TO INITIALIZE THE BLU-RAY DISC PLAYER
To put the program back at the factory-default,
initialize the BD player as the following procedure.
1. Turn the power on.
2. Press [1], [2], [3], [4], and [INFO] buttons on the
remote control unit in that order.
Fig. a appears on the screen.
"
" differ depending on the models.
*******
Version Info
Model Name
Version
Region
: *******
: *.***
: *-*
EXIT <POWER>EEPROM CLEAR <STOP>
Fig. a
3. Press [STOP] button on the remote control unit.
Fig. b appears on the screen and Fig. c appears
on the VFD.
"
" differ depending on the models.
*******
Version Info
Model Name
Version
Region
EEPROM CLEAR : OK
: *******
: *.***
: *-*
EXIT <POWER>EEPROM CLEAR <STOP>
Fig. b
Fig. c
4. To exit this mode, press [] button.
1-7-1E5E10INT
FIRMWARE RENEWAL MODE
)
1. Turn the power on and remove the disc on the tray.
2. To put the BD player into version up mode, press
[9], [8], [7], [6], and [DISC MENU/POP-UP MENU]
buttons on the remote control unit in that order.
The tray will open automatically.
Fig. a appears on the screen and Fig. b appears
on the VFD.
"
" differs depending on the models.
*******
F/W VERSION UP MODEModel No. ******* Ver. *.***
Please insert a Disc
for F/W Version Up
Fig. a Version Up Mode Screen
Fig. b VFD in Version Up Mode
The BD player can also enter the version up mode
with the tray open. In this case, Fig. a will be
shown on the screen while the tray is open.
3. Load the disc for version up.
4. The BD player enters the F/W version up mode
automatically. Fig. c appears on the screen and
Fig. d appears on the VFD. If you enter the F/W for
different models, “Disc Error” will appear on the
screen, then the tray will open automatically.
"
" differs depending on the models.
*******
F/W VERSION UP MODEModel No. ******* Ver. *.***
1. ALL
(*1)
Ver. *.*** ************B*.bin
Now Loading...
EXIT : POWER
The appearance shown in (*1) of Fig. c is
described as follows:
No.AppearanceState
1Now Loading... Loading the disc
Sending files into the
2Reading...
memory.
After reading, automatically
the tray opens.
Remove the
3
disc
Reading has finished.
Remove the disc and close
the tray.
Writing new version data,
4See FL display
the progress will be displayed
as shown in Fig. e.
Fig. e VFD in Version Up Mode
5. After programming is finished, the checksum on
the VFD (Fig. f).
Fig. f VFD upon Finishing the Programming Mode (Example)
At this time, no button is available.
6. Unplug the AC cord from the AC outlet. Then plug
it again.
7. Turn the power on.
8. Press [1], [2], [3], [4], and [INFO] buttons on the
remote control unit in that order.
Fig. g appears on the screen.
"
" differ depending on the models.
*******
Version Info
Model Name
Version
Region
: *******
: *.***
: *-*
Fig. c Programming Mode Screen (Example
Fig. d VFD in Programming Mode (Example)
EXIT <POWER>EEPROM CLEAR <STOP>
Fig. g
1-8-1E5H10FW
9. Press [STOP] button on the remote control unit.
j
Fig. h appears on the screen and Fig. i appears on
the VFD.
"
" differ depending on the models.
*******
Version Info
Model Name
Version
Region
: *******
: *.***
: *-*
How to Verify the Firmware Version
1. Turn the power on.
2. Press [1], [2], [3], [4], and [INFO] buttons on the
remote control unit in that order.
Fig. j appears on the screen.
"
" differ depending on the models.
*******
Version Info
EEPROM CLEAR : OK
EXIT <POWER>EEPROM CLEAR <STOP>
Fig. h
Fig. i
10. To exit this mode, press [] button.
Model Name
Version
Region
: *******
: *.***
: *-*
EXIT <POWER>EEPROM CLEAR <STOP>
Fig.
3. To exit this mode, press [] button.
1-8-2E5H10FW
FLOW CHART NO.1
The power cannot be turned on.
TROUBLESHOOTING
Is the fuse normal?
Ye s
Is normal state restored when once unplugged
power cord is plugged again after several seconds?
Ye s
Is the AL+5V line voltage normal?
Ye s
Check each rectifying circuit of the secondary circuit
and service it if defective.
FLOW CHART NO.2
The fuse blows out.
Check the presence that the primary component
is leaking or shorted and service it if defective.
After servicing, replace the fuse.
FLOW CHART NO.3
When the output voltage fluctuates.
Does the photo coupler circuit on the secondary
side operate normally?
Ye s
Check IC1001, IC1003, D1006 and their periphery,
and service it if defective.
No
No
No
No
See FLOW CHART No.2 <The fuse blows out.>
Check if there is any leak or short-circuiting on the
primary circuit component, and service it if defective.
(IC1001,Q1003, T1001, D1001, D1002, D1003,
D1004, D1007, D1008, C1010, R1013)
Check the presence that the rectifying diode or
circuit is shorted in each rectifying circuit of
secondary side, and service it if defective.
Check IC1003, D1009 and their periphery,
and service it if defective.
FLOW CHART NO.4
When buzz sound can be heard in the vicinity of power circuit.
Check if there is any short-circuit on the rectifying diode and the circuit in each rectifying circuit of the secondary
side
, and service it if defective.
Q2603, Q2604, Q2606, Q2607)
FLOW CHART NO.5
FL is not outputted.
Is 34.5V voltage supplied to the emitter of Q2012?
Is the "L" signal outputted to the collector of
Q2013?