Datasheet BAS70 Datasheet (Philips)

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Page 1

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

Rev. 08 — 4 May 2006 Product data sheet

1. Product proﬁle

1.1 General description

General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.

Table 1. Product overview

Type number Package Conﬁguration

1PS76SB70 SOD323 SC-76 single diode 1PS79SB70 SOD523 SC-79 single diode BAS70 SOT23 - single diode BAS70H SOD123F - single diode BAS70L SOD882 - single diode BAS70W SOT323 SC-70 single diode BAS70-04 SOT23 - dual series BAS70-04W SOT323 SC-70 dual series BAS70-05 SOT23 - dual common cathode BAS70-05W SOT323 SC-70 dual common cathode BAS70-06 SOT23 - dual common anode BAS70-06W SOT323 SC-70 dual common anode BAS70-07 SOT143B - dual isolated BAS70-07S SOT363 SC-88 dual isolated BAS70-07V SOT666 - dual isolated BAS70VV SOT666 - triple isolated BAS70XY SOT363 SC-88 quadruple; 2 series

Philips JEITA

1.2 Features

n High switching speed n Low leakage current n High breakdown voltage n Low capacitance

1.3 Applications

n Ultra high-speed switching n Voltage clamping

Page 2

Philips Semiconductors

1.4 Quick reference data

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Per diode

[1] Pulse test: tp≤ 300 µs; δ≤0.02.

2. Pinning information

Table 3. Pinning

Pin Description Simpliﬁed outline Symbol

BAS70H; 1PS76SB70; 1PS79SB70

1 cathode 2 anode

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

forward current - - 70 mA forward voltage IF=1mA reverse voltage - - 70 V

[1]

- - 410 mV

001aab540

sym001

BAS70L

1 cathode 2 anode

BAS70; BAS70W

1 anode 2 not connected 3 cathode

BAS70-04; BAS70-04W

1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1),

anode (diode 2)

[1]

sym001

Transparent

top view

006aaa144

n.c.

006aaa436

006aaa437

Product data sheet Rev. 08 — 4 May 2006 2 of 20

Page 3

Philips Semiconductors

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

Table 3. Pinning

…continued

Pin Description Simpliﬁed outline Symbol

BAS70-05; BAS70-05W

1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 1),

cathode (diode 2)

006aaa144

BAS70-06; BAS70-06W

1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 1),

anode (diode 2)

006aaa144

BAS70-07

1 cathode (diode 1) 2 cathode (diode 2)

3 anode (diode 2) 4 anode (diode 1)

006aaa438

006aaa439

006aaa434

BAS70-07S; BAS70-07V

1 anode (diode 1) 2 not connected 3 cathode (diode 2) 4 anode (diode 2) 5 not connected 6 cathode (diode 1)

BAS70VV

1 anode (diode 1) 2 anode (diode 2) 3 anode (diode 3) 4 cathode (diode 3) 5 cathode (diode 2) 6 cathode (diode 1)

6 45

1 32

123

001aab555

456

654

123

006aaa440

61524

sym046

Product data sheet Rev. 08 — 4 May 2006 3 of 20

Page 4

Philips Semiconductors

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

Table 3. Pinning

Pin Description Simpliﬁed outline Symbol

BAS70XY

1 anode (diode 1) 2 cathode (diode 2) 3 anode (diode 3),

4 anode (diode 4) 5 cathode (diode 3) 6 cathode (diode 1),

[1] The marking bar indicates the cathode.

3. Ordering information

Table 4. Ordering information

Type number Package

1PS76SB70 SC-76 plastic surface-mounted package; 2 leads SOD323 1PS79SB70 SC-79 plastic surface-mounted package; 2 leads SOD523 BAS70 - plastic surface-mounted package; 3 leads SOT23 BAS70H - plastic surface-mounted package; 2 leads SOD123F BAS70L - leadless ultra small plastic package; 2 terminals;

BAS70W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS70-04 - plastic surface-mounted package; 3 leads SOT23 BAS70-04W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS70-05 - plastic surface-mounted package; 3 leads SOT23 BAS70-05W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS70-06 - plastic surface-mounted package; 3 leads SOT23 BAS70-06W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS70-07 - plastic surface-mounted package; 4 leads SOT143B BAS70-07S SC-88 plastic surface-mounted package; 6 leads SOT363 BAS70-07V - plastic surface-mounted package; 6 leads SOT666 BAS70VV - plastic surface-mounted package; 6 leads SOT666 BAS70XY SC-88 plastic surface-mounted package; 6 leads SOT363

…continued

cathode (diode 4)

132

anode (diode 2)

Name Description Version

body 1.0 × 0.6 × 0.5 mm

654

123

006aaa256

SOD882

Product data sheet Rev. 08 — 4 May 2006 4 of 20

Page 5

Philips Semiconductors

4. Marking

Table 5. Marking codes

Type number Marking code

1PS76SB70 S2 BAS70-05W 75* 1PS79SB70 G BAS70-06 76* BAS70 73* BAS70-06W 76* BAS70H AH BAS70-07 77* BAS70L S8 BAS70-07S 77* BAS70W 73* BAS70-07V 77 BAS70-04 74* BAS70VV N1 BAS70-04W 74* BAS70XY 70* BAS70-05 75* - -

[1] * = -: made in Hong Kong

* = p: made in Hong Kong * = t: made in Malaysia * = W: made in China

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

[1]

Type number Marking code

[1]

5. Limiting values

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

FRM

FSM

amb

stg

[1] Tj=25°C prior to surge.

reverse voltage - 70 V forward current - 70 mA repetitive peak forward

tp≤ 1s;δ≤0.5 - 70 mA

current non-repetitive peak forward

tp≤ 10 ms

[1]

- 100 mA

current junction temperature - 150 °C ambient temperature −65 +150 °C storage temperature −65 +150 °C

Product data sheet Rev. 08 — 4 May 2006 5 of 20

Page 6

Philips Semiconductors

6. Thermal characteristics

Table 7. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Per device

th(j-a)

th(j-sp)

thermal resistance from junction to ambient

SOT23 - - 500 K/W SOT143B - - 500 K/W SOT363 (BAS70-07S) - - 416 K/W SOT666 (BAS70VV) SOT666 (BAS70-07V) SOD123F SOD323 - - 450 K/W SOD523 SOD882 SOT323 - - 625 K/W

thermal resistance from junction to solder point

SOT363 (BAS70XY)

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

in free air

[1]

[2]

- - 700 K/W

[2]

- - 416 K/W

[2]

- - 330 K/W

[2]

- - 450 K/W

[2]

- - 500 K/W

[3]

- - 260 K/W

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint. [2] Reﬂow soldering is the only recommended soldering method. [3] Soldering point at pins 2, 3, 5 and 6.

7. Characteristics

Table 8. Characteristics

amb

Symbol Parameter Conditions Min Typ Max Unit

Per diode

[1] Pulse test: tp≤ 300 µs; δ≤0.02.

=25°C unless otherwise speciﬁed.

forward voltage

[1]

IF= 1 mA - - 410 mV

= 10 mA - - 750 mV

=15mA - - 1 V

reverse current VR= 50 V - - 100 nA

=70V - - 10 µA

diode capacitance VR= 0 V; f = 1 MHz - - 2 pF

Product data sheet Rev. 08 — 4 May 2006 6 of 20

Page 7

Philips Semiconductors

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

(mA)

−1

(1) (4)(2) (3)

−2

0 0.2 0.4 0.6 0.8 1

(1) T (2) T (3) T (4) T

amb amb amb amb

= 125 °C =85°C =25°C = −40 °C

mra803

(V)

Fig 1. Forward current as a function of forward

voltage; typical values

(µA)

−1

−2

−3

020406080

(1) T (2) T (3) T

amb amb amb

= 125 °C =85°C =25°C

(1)

(2)

(3)

mra805

VR (V)

Fig 2. Reverse current as a function of reverse

voltage; typical values

IF (mA)

mra802

(Ω)

dif

−1

110

f = 10 kHz T

Fig 3. Differential forward resistance as a function of

forward current; typical values

mra804

(V)

(pF)

1.5

0.5

0 20406080

=25°C; f = 1 MHz

amb

Fig 4. Diode capacitance as a function of reverse

voltage; typical values

Product data sheet Rev. 08 — 4 May 2006 7 of 20

Page 8

Philips Semiconductors

8. Package outline

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

1.1

0.8

0.25

0.10

0.85

0.75

1.65

1.25

1.55

1.15

0.34

0.26

03-12-17Dimensions in mm

2.7

2.3

1.8

1.6

1.35

1.15

0.40

0.25

0.45

0.15

Fig 5. Package outline SOD323 (SC-76) Fig 6. Package outline SOD523 (SC-79)

1.7

1.5

0.55

0.35

2.5

2.1

1.4

1.2

3.0

2.8

1.1

0.9

0.45

0.15

3.6

2.7

3.4

2.5

0.65

0.58

1.2

1.0

0.17

0.11 02-12-13Dimensions in mm

1.9

0.48

0.38

0.15

0.09

04-11-04Dimensions in mm

0.70

0.55

Fig 7. Package outline SOT23 (TO-236AB) Fig 8. Package outline SOD123F

2.2

1.8

1.3

0.4

0.3

0.45

0.15

0.30

0.22

0.30

0.22

0.62

0.55

0.47

0.65

cathode marking on top side

0.50

0.46

1.02

0.95

2.2

1.35

2.0

1.15

03-04-17Dimensions in mm

Fig 9. Package outline SOD882 Fig 10. Package outline SOT323 (SC-70)

0.25

0.10

1.1

0.8

0.25

0.10

04-11-29Dimensions in mm

04-11-04Dimensions in mm

Product data sheet Rev. 08 — 4 May 2006 8 of 20

Page 9

Philips Semiconductors

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

2.5

2.1

1.4

1.2

0.88

0.78

3.0

2.8

1.9

1.7

1.1

0.9

0.45

0.15

0.48

0.38

0.15

0.09

04-11-16Dimensions in mm

2.2

2.0

1.35

1.15

2.2

1.8

pin 1 index

132

0.65

1.3

0.45

465

0.15

0.3

0.2

Fig 11. Package outline SOT143B Fig 12. Package outline SOT363 (SC-88)

1.7

1.5

1.3

1.1 pin 1 index

1.7

1.5

456

0.3

0.1

0.6

0.5

1.1

0.8

0.25

0.10

04-11-08Dimensions in mm

Fig 13. Package outline SOT666

Dimensions in mm

123

0.5 1

0.27

0.17

0.18

0.08

04-11-08

Product data sheet Rev. 08 — 4 May 2006 9 of 20

Page 10

Philips Semiconductors

9. Packing information

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

Table 9. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number Package Description Packing quantity

1PS76SB70 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS79SB70 SOD523 2 mm pitch, 8 mm tape and reel - - -315 -

4 mm pitch, 8 mm tape and reel -115 - - -135 BAS70 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS70H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS70L SOD882 2 mm pitch, 8 mm tape and reel - - - -315 BAS70W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS70-04 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS70-04W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS70-05 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS70-05W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS70-06 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS70-06W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS70-07 SOT143B 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS70-07S SOT363 4 mm pitch, 8 mm tape and reel; T1

4 mm pitch, 8 mm tape and reel; T2 BAS70-07V SOT666 2 mm pitch, 8 mm tape and reel - - -315 -

4 mm pitch, 8 mm tape and reel - -115 - BAS70VV SOT666 2 mm pitch, 8 mm tape and reel - - -315 -

4 mm pitch, 8 mm tape and reel - -115 - BAS70XY SOT363 4 mm pitch, 8 mm tape and reel; T1

4 mm pitch, 8 mm tape and reel; T2

[1]

3000 4000 8000 10000

[2]

-115 - - -135

[3]

-125 - - -165

[2]

-115 - - -135

[3]

-125 - - -165

[1] For further information and the availability of packing methods, seeSection 13. [2] T1: normal taping [3] T2: reverse taping

Product data sheet Rev. 08 — 4 May 2006 10 of 20

Page 11

Philips Semiconductors

10. Soldering

1.65

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

3.05

2.80

2.10

1.60

0.60

0.500.95

solder lands

solder resist

occupied area

0.50 (2×)

msa433

Dimensions in mm

Fig 14. Reﬂow soldering footprint SOD323 (SC-76)

5.00

4.40

1.40

1.202.75

preferred transport direction during soldering

Dimensions in mm

Fig 15. Wave soldering footprint SOD323 (SC-76)

solder paste

solder lands

solder resist

occupied area

MSA415

2.15

0.60

solder paste solder lands solder resist

occupied area

1.20

0.30

0.40

1.80

1.90

0.50

MGS343

Reﬂow soldering is the only recommended soldering method. Dimensions in mm

Fig 16. Reﬂow soldering footprint SOD523 (SC-79)

Product data sheet Rev. 08 — 4 May 2006 11 of 20

Page 12

Philips Semiconductors

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

2.90

2.50

solder lands

0.50 (3x)

0.60 (3x)

MSA439

3.00

0.85

1.30

0.85

1.00

3.30

Dimensions in mm

Fig 17. Reﬂow soldering footprint SOT23 (TO-236AB)

3.40

1.20 (2x)

4.00

1.20

4.60

2.70

solder resist

occupied area

solder paste

solder lands

solder resist

occupied area

preferred transport direction during soldering

2.80

4.50

MSA427

Dimensions in mm

Fig 18. Wave soldering footprint SOT23 (TO-236AB)

Product data sheet Rev. 08 — 4 May 2006 12 of 20

Page 13

Philips Semiconductors

Fig 19. Reﬂow soldering footprint SOD123F

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

4.4 4

2.9

1.6

1.1

(2×)

Reﬂow soldering is the only recommended soldering method. Dimensions in mm

1.30

0.30R = 0.05 (8×) R = 0.05 (8×)

1.1 1.22.1

solder lands

solder resist

solder paste

occupied area

0.90

0.30 (2×)

0.40 (2×)

0.50 (2×)

Reﬂow soldering is the only recommended soldering method. Dimensions in mm

Fig 20. Reﬂow soldering footprint SOD882

MBL872

0.60 (2×)

0.70 (2×)

0.80 (2×)

solder lands

solder resist

occupied area

solder paste

Product data sheet Rev. 08 — 4 May 2006 13 of 20

Page 14

Philips Semiconductors

Fig 21. Reﬂow soldering footprint SOT323 (SC-70)

BAS70 series; 1PS7xSB70 series

0.852.35

Dimensions in mm

0.60 (3x)

0.55 (3x)

4.60

4.00

1.15

2.65

1.30

2.40

General-purpose Schottky diodes

1.3250.75

solder lands

0.50

1.90

(3x)

MSA429

solder resist

occupied area

solder paste

solder lands

2.103.65

preferred transport direction during soldering

Dimensions in mm

Fig 22. Wave soldering footprint SOT323 (SC-70)

0.90 (2x)

solder resist

occupied area

2.70

MSA419

Product data sheet Rev. 08 — 4 May 2006 14 of 20

Page 15

Philips Semiconductors

Fig 23. Reﬂow soldering footprint SOT143B

BAS70 series; 1PS7xSB70 series

0.60 (4x)

2.70

Dimensions in mm

3.25

0.60 (3x)

0.50 (3x)

3.00

1.30

0.90

1.00

2.50

General-purpose Schottky diodes

solder lands

solder resist

occupied area

solder paste

msa441

4.45

1.20 (3x)

1.15

1.00

3.40

Dimensions in mm

Fig 24. Wave soldering footprint SOT143B

4.00

solder lands

solder resist

occupied area

4.60

preferred transport direction during soldering

MSA422

Product data sheet Rev. 08 — 4 May 2006 15 of 20

Page 16

Philips Semiconductors

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

2.35

solder paste solder lands solder resist occupied area

0.50 (4×)

Dimensions in mm

Fig 25. Reﬂow soldering footprint SOT363 (SC-88)

5.25

2.65

1.20

2.40

0.60 (2×)

0.40 (2×)

MSA432

0.90 2.10

4.50

solder lands solder resist occupied area

Dimensions in mm

transport direction during soldering

1.15

3.75

Fig 26. Wave soldering footprint SOT363 (SC-88)

1.000.30 4.00

sot363

Product data sheet Rev. 08 — 4 May 2006 16 of 20

Page 17

Philips Semiconductors

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

2.75

2.45

2.10

1.60

0.15 (4

×)

0.40 (6

×)

2.00 1.70 1.00

0.55 (2

×)

1.20

2.20

2.50

0.30 (2×)

0.375

×)

0.075

solder lands

solder resist

Reﬂow soldering is the only recommended soldering method.

Fig 27. Reﬂow soldering footprint SOT666

placement area occupied area

Dimensions in mm

Product data sheet Rev. 08 — 4 May 2006 17 of 20

Page 18

Philips Semiconductors

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

11. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAS70_1PS7XSB70_ SER_8

Modiﬁcations:

BAS70_1PS7XSB70_ SER_7

1PS76SB70_2 20040126 Product speciﬁcation - 1PS76SB70_1 1PS79SB70_1 19980716 Product speciﬁcation - BAS70H_1 20050425 Product data sheet - BAS70L_1 20030520 Product speciﬁcation - BAS70-07V_1 20020117 Product speciﬁcation - BAS70VV_1 20040910 Product data sheet - BAS70W_3 19990326 Product speciﬁcation - BAS70W_2 BAS70-07S_4 20030411 Product speciﬁcation - BAS70_07S_3 BAS70_SERIES_6 20011011 Product speciﬁcation - BAS70_5

20060504 Product data sheet - BAS70_1PS7XSB70_

SER_7

• Type number BAS70XY added

• Table 9 “Packing methods”: added packing method 2 mm pitch for SOD523

• Figure 26 “Wave soldering footprint SOT363 (SC-88)”: amended

• Figure 27 “Reﬂow soldering footprint SOT666”: amended

• Section 12 “Legal information”: updated

20050718 Product data sheet - 1PS76SB70_2

1PS79SB70_1 BAS70H_1 BAS70L_1 BAS70-07V_1 BAS70VV_1 BAS70W_3 BAS70-07S_4 BAS70_SERIES_6

Product data sheet Rev. 08 — 4 May 2006 18 of 20

Page 19

Philips Semiconductors

12. Legal information

12.1 Data sheet status

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

Document status

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development. Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation. Product [short] data sheet Production This document contains the product speciﬁcation.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Deﬁnitions”. [3] The productstatus of device(s) described in this document may have changed since this document was published and may differin case of multiple devices. The latest product status

information is available on the Internet at URL

[1][2]

Product status

12.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modiﬁcations or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information includedherein and shallhave noliability forthe consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with thesame product typenumber(s) andtitle. A shortdata sheet isintended for quick referenceonly and should notbe relied upon tocontain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales ofﬁce.In case of anyinconsistency or conﬂict withthe short data sheet, the full data sheet shall prevail.

12.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

Right to make changes — Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation speciﬁcations and product descriptions, at any time and without notice. Thisdocument supersedes and replacesall information supplied prior to the publication hereof.

Suitability for use — Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or

[3]

http://www.semiconductors.philips.com.

Deﬁnition

malfunction ofa Philips Semiconductors productcan reasonably beexpected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in the AbsoluteMaximum Ratings System ofIEC 60134) maycause permanent damage tothe device. Limitingvalues arestress ratings onlyand operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.

Terms and conditions of sale — Philips Semiconductors products are sold subject to the general terms and conditions ofcommercial sale, as published at

http://www.semiconductors.philips.com/proﬁle/terms, including those

pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. Incase of any inconsistencyor conﬂict betweeninformation in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance orimplication of any licenseunder any copyrights,patents or other industrial or intellectual property rights.

12.4 Trademarks

Notice: Allreferenced brands,product names,service names andtrademarks are the property of their respective owners.

13. Contact information

For additional information, please visit: http://www.semiconductors.philips.com For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Product data sheet Rev. 08 — 4 May 2006 19 of 20

Page 20

Philips Semiconductors

BAS70 series; 1PS7xSB70 series

14. Contents

1 Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 4

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

9 Packing information. . . . . . . . . . . . . . . . . . . . . 10

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19

12.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19

13 Contact information. . . . . . . . . . . . . . . . . . . . . 19

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

General-purpose Schottky diodes

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.

Document identifier: BAS70_1PS7XSB70_SER_8

Date of release: 4 May 2006

Datasheet BAS70 Datasheet (Philips)

Specifications and Main Features

Frequently Asked Questions

User Manual

1.1 General description

1.2 Features

1.3 Applications

1.4 Quick reference data

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

8. Package outline

9. Packing information

10. Soldering

11. Revision history

12. Legal information

12.1 Data sheet status

12.3 Disclaimers

12.4 Trademarks

13. Contact information

14. Contents