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BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

Rev. 07 — 12 May 2006 Product data sheet

1. Product proﬁle

1.1 General description

General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.

Table 1. Product overview

Type number Package Conﬁguration

1PS70SB40 SOT323 SC-70 single diode 1PS76SB40 SOD323 SC-76 single diode 1PS79SB40 SOD523 SC-79 single diode BAS40 SOT23 - single diode BAS40H SOD123F - single diode BAS40L SOD882 - single diode BAS40W SOT323 SC-70 single diode 1PS70SB44 SOT323 SC-70 dual series BAS40-04 SOT23 - dual series BAS40-04W SOT323 SC-70 dual series 1PS70SB45 SOT323 SC-70 dual common cathode 1PS75SB45 SOT416 SC-75 dual common cathode BAS40-05 SOT23 - dual common cathode BAS40-05W SOT323 SC-70 dual common cathode 1PS70SB46 SOT323 SC-70 dual common anode BAS40-06 SOT23 - dual common anode BAS40-06W SOT323 SC-70 dual common anode BAS40-07 SOT143B - dual isolated BAS40-07V SOT666 - dual isolated BAS40-05V SOT666 - quadruple common cathode/

1PS88SB48 SOT363 SC-88 quadruple common cathode/

BAS40XY SOT363 SC-88 quadruple; 2 series

Philips JEITA

common cathode

Philips Semiconductors

1.2 Features

n High switching speed n Low leakage current n High breakdown voltage n Low capacitance

1.3 Applications

n Ultra high-speed switching n Voltage clamping

1.4 Quick reference data

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Per diode

[1] Pulse test: tp≤ 300 µs; δ≤0.02.

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

forward current - - 120 mA forward voltage IF=1mA reverse voltage - - 40 V

[1]

- - 380 mV

2. Pinning information

Table 3. Pinning

Pin Description Simpliﬁed outline Symbol

BAS40H; 1PS76SB40; 1PS79SB40

1 cathode 2 anode

BAS40L

1 cathode 2 anode

BAS40; BAS40W; 1PS70SB40

1 anode 2 not connected 3 cathode

[1]

001aab540

[1]

Transparent

top view

006aaa144

sym001

n.c.

006aaa436

Product data sheet Rev. 07 — 12 May 2006 2 of 21

Philips Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

Table 3. Pinning

…continued

Pin Description Simpliﬁed outline Symbol

BAS40-04; BAS40-04W; 1PS70SB44

1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1),

anode (diode 2)

006aaa144

BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45

1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 1),

cathode (diode 2)

006aaa144

BAS40-06; BAS40-06W; 1PS70SB46

1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 1),

anode (diode 2)

006aaa144

006aaa437

006aaa438

006aaa439

BAS40-07

1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 2) 4 anode (diode 1)

BAS40-07V

1 anode (diode 1) 2 not connected 3 cathode (diode 2) 4 anode (diode 2) 5 not connected 6 cathode (diode 1)

456

123

006aaa434

654

123

006aaa440

Product data sheet Rev. 07 — 12 May 2006 3 of 21

Philips Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

Table 3. Pinning

…continued

Pin Description Simpliﬁed outline Symbol

BAS40-05V; 1PS88SB48

1 anode (diode 1) 2 anode (diode 2)

6 45

654

3 cathode (diode 3),

cathode (diode 4) 4 anode (diode 3) 5 anode (diode 4)

1 32

001aab555

123

6 cathode (diode 1),

cathode (diode 2)

BAS40XY

1 anode (diode 1)

2 cathode (diode 2)

3 anode (diode 3),

cathode (diode 4) 4 anode (diode 4)

132

5 cathode (diode 3) 6 cathode (diode 1),

anode (diode 2)

[1] The marking bar indicates the cathode.

006aaa446

654

123

006aaa256

Product data sheet Rev. 07 — 12 May 2006 4 of 21

Philips Semiconductors

3. Ordering information

Table 4. Ordering information

Type number Package

1PS70SB40 SC-70 plastic surface-mounted package; 3 leads SOT323 1PS76SB40 SC-76 plastic surface-mounted package; 2 leads SOD323 1PS79SB40 SC-79 plastic surface-mounted package; 2 leads SOD523 BAS40 - plastic surface-mounted package; 3 leads SOT23 BAS40H - plastic surface-mounted package; 2 leads SOD123F BAS40L - leadless ultra small plastic package; 2 terminals;

BAS40W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB44 SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-04 - plastic surface-mounted package; 3 leads SOT23 BAS40-04W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB45 SC-70 plastic surface-mounted package; 3 leads SOT323 1PS75SB45 SC-75 plastic surface-mounted package; 3 leads SOT416 BAS40-05 - plastic surface-mounted package; 3 leads SOT23 BAS40-05W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB46 SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-06 - plastic surface-mounted package; 3 leads SOT23 BAS40-06W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-07 - plastic surface-mounted package; 4 leads SOT143B BAS40-07V - plastic surface-mounted package; 6 leads SOT666 BAS40-05V - plastic surface-mounted package; 6 leads SOT666 1PS88SB48 SC-88 plastic surface-mounted package; 6 leads SOT363 BAS40XY SC-88 plastic surface-mounted package; 6 leads SOT363

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

Name Description Version

SOD882

body 1.0 × 0.6 × 0.5 mm

Product data sheet Rev. 07 — 12 May 2006 5 of 21

Philips Semiconductors

4. Marking

Table 5. Marking codes

Type number Marking code

1PS70SB40 6*3 1PS75SB45 45 1PS76SB40 S4 BAS40-05 45* 1PS79SB40 T BAS40-05W 65* BAS40 43* 1PS70SB46 6*6 BAS40H AJ BAS40-06 46* BAS40L S6 BAS40-06W 66* BAS40W 63* BAS40-07 47* 1PS70SB44 6*4 BAS40-07V 67 BAS40-04 44* BAS40-05V 65 BAS40-04W 64* 1PS88SB48 8*5 1PS70SB45 6*5 BAS40XY 40*

[1] * = -: made in Hong Kong

* = p: made in Hong Kong * = t: made in Malaysia * = W: made in China

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

[1]

Type number Marking code

[1]

5. Limiting values

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

FRM

FSM

amb

stg

[1] Tj=25°C prior to surge.

reverse voltage - 40 V forward current - 120 mA repetitive peak forward

tp≤ 1s;δ≤0.5 - 120 mA

current non-repetitive peak forward

tp≤ 10 ms

[1]

- 200 mA

current junction temperature - 150 °C ambient temperature −65 +150 °C storage temperature −65 +150 °C

Product data sheet Rev. 07 — 12 May 2006 6 of 21

Philips Semiconductors

6. Thermal characteristics

Table 7. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Per device

th(j-a)

th(j-sp)

thermal resistance from junction to ambient

SOT23 - - 500 K/W

SOT143B - - 500 K/W

SOT363 (1PS88SB48) - - 416 K/W

SOT416 - - 833 K/W

SOT666 (BAS40-05V)

SOT666 (BAS40-07V)

SOD123F

SOD323 - - 450 K/W

SOD523

SOD882

SOT323 - - 625 K/W

thermal resistance from junction to solder point

SOT363 (BAS40XY)

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

in free air

[1]

[2]

- - 225 K/W

[2]

- - 416 K/W

[2]

- - 330 K/W

[2]

- - 450 K/W

[2]

- - 500 K/W

[3]

- - 260 K/W

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint. [2] Reﬂow soldering is the only recommended soldering method. [3] Soldering point at pins 2, 3, 5 and 6.

7. Characteristics

Table 8. Characteristics

amb

Symbol Parameter Conditions Min Typ Max Unit

Per diode

[1] Pulse test: tp≤ 300 µs; δ≤0.02.

=25°C unless otherwise speciﬁed.

forward voltage

[1]

IF= 1 mA - - 380 mV

= 10 mA - - 500 mV

=40mA - - 1 V

reverse current VR=30V - - 1 µA

=40V - - 10 µA

diode capacitance VR=0V; f=1MHz - - 5 pF

Product data sheet Rev. 07 — 12 May 2006 7 of 21

Philips Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

(mA)

−1

−2

(1) T (2) T (3) T (4) T

amb amb amb amb

= 125 °C =85°C =25°C = −40 °C

(1) (2) (3) (4)

0.6 0.80.40.2 1

mlc361

(V)

Fig 1. Forward current as a function of forward

voltage; typical values

(µA)

−1

−2

(1) T (2) T (3) T

amb amb amb

(1)

(2)

(3)

2010 4030

= 125 °C =85°C =25°C

mlc362

VR (V)

Fig 2. Reverse current as a function of reverse

voltage; typical values

(mA)

mlc364

(Ω)

dif

−1

110

f = 10 kHz T

Fig 3. Differential resistance as a function of forward

current; typical values

(pF)

01020 4030

=25°C; f = 1 MHz

amb

mlc363

VR (V)

Fig 4. Diode capacitance as a function of reverse

voltage; typical values

Product data sheet Rev. 07 — 12 May 2006 8 of 21

Philips Semiconductors

8. Package outline

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

1.1

0.8

0.25

0.10

0.85

0.75

1.65

1.25

1.55

1.15

0.34

0.26

03-12-17Dimensions in mm

2.7

2.3

1.8

1.6

1.35

1.15

0.40

0.25

0.45

0.15

Fig 5. Package outline SOD323 (SC-76) Fig 6. Package outline SOD523 (SC-79)

1.7

1.5

0.55

0.35

2.5

2.1

1.4

1.2

3.0

2.8

1.1

0.9

0.45

0.15

3.6

2.7

3.4

2.5

0.65

0.58

1.2

1.0

0.17

0.11 02-12-13Dimensions in mm

1.9

0.48

0.38

0.15

0.09

04-11-04Dimensions in mm

0.70

0.55

Fig 7. Package outline SOT23 (TO-236AB) Fig 8. Package outline SOD123F

2.2

1.8

1.3

0.4

0.3

0.45

0.15

0.30

0.22

0.30

0.22

0.62

0.55

0.47

0.65

cathode marking on top side

0.50

0.46

1.02

0.95

2.2

1.35

2.0

1.15

03-04-17Dimensions in mm

Fig 9. Package outline SOD882 Fig 10. Package outline SOT323 (SC-70)

0.25

0.10

1.1

0.8

0.25

0.10

04-11-29Dimensions in mm

04-11-04Dimensions in mm

Product data sheet Rev. 07 — 12 May 2006 9 of 21

Philips Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

2.5

2.1

1.4

1.2

0.88

0.78

3.0

2.8

1.9

1.7

1.1

0.9

0.45

0.15

0.48

0.38

0.15

0.09

04-11-16Dimensions in mm

2.2

2.0

1.35

1.15

2.2

1.8

pin 1 index

132

0.65

1.3

0.45

465

0.15

0.3

0.2

Fig 11. Package outline SOT143B Fig 12. Package outline SOT363 (SC-88)

1.7

1.5

456

1.75

1.45

0.9

0.7

1.8

1.4

0.95

0.60

0.45

0.15

1.7

1.5

1.3

1.1 pin 1 index

0.3

0.1

1.1

0.8

0.25

0.10

0.6

0.5

04-11-08Dimensions in mm

0.30

0.15

0.25

0.10

04-11-04Dimensions in mm

Dimensions in mm

123

0.5 1

Fig 13. Package outline SOT416 (SC-75) Fig 14. Package outline SOT666

0.27

0.17

0.18

0.08

04-11-08

Product data sheet Rev. 07 — 12 May 2006 10 of 21

Philips Semiconductors

9. Packing information

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

Table 9. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number Package Description Packing quantity

1PS70SB40 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS76SB40 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS79SB40 SOD523 2 mm pitch, 8 mm tape and reel - - -315 -

4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40H SOD123F 4mm pitch, 8 mm tape and reel -115 - - -135 BAS40L SOD882 2 mm pitch, 8 mm tape and reel - - - -315 BAS40W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS70SB44 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-04 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-04W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS70SB45 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS75SB45 SOT416 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-05 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-05W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS70SB46 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-06 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-06W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-07 SOT143B 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-07V SOT666 2 mm pitch, 8 mm tape and reel - - -315 -

4 mm pitch, 8 mm tape and reel - -115 - BAS40-05V SOT666 2 mm pitch, 8 mm tape and reel - - -315 -

4 mm pitch, 8 mm tape and reel - -115 - 1PS88SB48 SOT363 4 mm pitch, 8 mm tape and reel; T1

4 mm pitch, 8 mm tape and reel; T2 BAS40XY SOT363 4 mm pitch, 8 mm tape and reel; T1

4 mm pitch, 8 mm tape and reel; T2

[1]

3000 4000 8000 10000

[2]

-115 - - -135

[3]

-125 - - -165

[2]

-115 - - -135

[3]

-125 - - -165

[1] For further information and the availability of packing methods, seeSection 13. [2] T1: normal taping [3] T2: reverse taping

Product data sheet Rev. 07 — 12 May 2006 11 of 21

Philips Semiconductors

10. Soldering

1.65

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

3.05

2.80

2.10

1.60

0.60

0.500.95

solder lands

solder resist

occupied area

0.50 (2×)

msa433

Dimensions in mm

Fig 15. Reﬂow soldering footprint SOD323 (SC-76)

5.00

4.40

1.40

1.202.75

preferred transport direction during soldering

Dimensions in mm

Fig 16. Wave soldering footprint SOD323 (SC-76)

solder paste

solder lands

solder resist

occupied area

MSA415

2.15

0.60

solder paste solder lands solder resist occupied area

1.20

0.30

0.40

1.80

1.90

0.50

MGS343

Reﬂow soldering is the only recommended soldering method. Dimensions in mm

Fig 17. Reﬂow soldering footprint SOD523 (SC-79)

Product data sheet Rev. 07 — 12 May 2006 12 of 21

Philips Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

2.90

2.50

solder lands

0.50 (3x)

0.60 (3x)

MSA439

3.00

0.85

1.30

0.85

1.00

3.30

Dimensions in mm

Fig 18. Reﬂow soldering footprint SOT23 (TO-236AB)

3.40

1.20 (2x)

4.00

1.20

4.60

2.70

solder resist

occupied area

solder paste

solder lands

solder resist

occupied area

preferred transport direction during soldering

2.80

4.50

MSA427

Dimensions in mm

Fig 19. Wave soldering footprint SOT23 (TO-236AB)

Product data sheet Rev. 07 — 12 May 2006 13 of 21

Philips Semiconductors

Fig 20. Reﬂow soldering footprint SOD123F

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

4.4 4

2.9

1.6

1.1

(2×)

Reﬂow soldering is the only recommended soldering method. Dimensions in mm

1.30

0.30R = 0.05 (8×) R = 0.05 (8×)

1.1 1.22.1

solder lands

solder resist

solder paste

occupied area

0.90

0.30 (2×)

0.40 (2×)

0.50 (2×)

Reﬂow soldering is the only recommended soldering method. Dimensions in mm

Fig 21. Reﬂow soldering footprint SOD882

MBL872

0.60 (2×)

0.70 (2×)

0.80 (2×)

solder lands

solder resist

occupied area

solder paste

Product data sheet Rev. 07 — 12 May 2006 14 of 21

Philips Semiconductors

Fig 22. Reﬂow soldering footprint SOT323 (SC-70)

BAS40 series; 1PSxxSB4x series

0.852.35

Dimensions in mm

0.60 (3x)

0.55 (3x)

4.60

4.00

1.15

2.65

1.30

2.40

General-purpose Schottky diodes

1.3250.75

solder lands

0.50

1.90

(3x)

MSA429

solder resist

occupied area

solder paste

solder lands

2.103.65

preferred transport direction during soldering

Dimensions in mm

Fig 23. Wave soldering footprint SOT323 (SC-70)

0.90 (2x)

solder resist

occupied area

2.70

MSA419

Product data sheet Rev. 07 — 12 May 2006 15 of 21

Philips Semiconductors

Fig 24. Reﬂow soldering footprint SOT143B

BAS40 series; 1PSxxSB4x series

0.60 (4x)

2.70

Dimensions in mm

3.25

0.60 (3x)

0.50 (3x)

3.00

1.30

0.90

1.00

2.50

General-purpose Schottky diodes

solder lands

solder resist

occupied area

solder paste

msa441

4.45

1.20 (3x)

1.15

1.00

3.40

Dimensions in mm

Fig 25. Wave soldering footprint SOT143B

4.00

solder lands

solder resist

occupied area

4.60

preferred transport direction during soldering

MSA422

Product data sheet Rev. 07 — 12 May 2006 16 of 21

Philips Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

2.35

solder paste solder lands solder resist

occupied area

0.50 (4×)

Dimensions in mm

Fig 26. Reﬂow soldering footprint SOT363 (SC-88)

5.25

2.65

1.20

2.40

0.60 (2×)

0.40 (2×)

MSA432

0.90 2.10

4.50

solder lands solder resist occupied area

Dimensions in mm

transport direction during soldering

1.15

3.75

Fig 27. Wave soldering footprint SOT363 (SC-88)

1.000.30 4.00

sot363

Product data sheet Rev. 07 — 12 May 2006 17 of 21

Philips Semiconductors

Fig 28. Reﬂow soldering footprint SOT416

BAS40 series; 1PSxxSB4x series

2.00

0.85

Dimensions in mm

0.60 (3x)

0.60

2.20

0.70

1.90

General-purpose Schottky diodes

1.10

solder lands

1.50

0.50 (3x)

MSA438

2.75

2.45

2.10

1.60

solder resist

occupied area

solder paste

0.15 (4

×)

2.00 1.70 1.00

0.075

0.55

×)

solder lands

solder resist

Reﬂow soldering is the only recommended soldering method.

Fig 29. Reﬂow soldering footprint SOT666

1.20

2.20

2.50

placement area occupied area

0.30 (2×)

0.375

×)

Dimensions in mm

0.40 (6

×)

Product data sheet Rev. 07 — 12 May 2006 18 of 21

Philips Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

11. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAS40_1PSXXSB4X_ SER_7

Modiﬁcations:

BAS40_1PSXXSB4X_ SER_6

1PS70SB40_3 19990426 Product speciﬁcation - 1PS70SB40_2 1PS75SB45_2 19990426 Product speciﬁcation - 1PS75SB45_1 1PS76SB40_3 20040126 Product speciﬁcation - 1PS76SB40_2 1PS79SB40_2 19990426 Product speciﬁcation - 1PS79SB40_1 1PS88SB48_3 20021107 Product speciﬁcation - 1PS88SB48_2 BAS40H_1 20050425 Product data sheet - BAS40L_1 20030520 Product speciﬁcation - BAS40-05V_1 20021121 Product speciﬁcation - BAS40-07V_1 20020327 Product speciﬁcation - BAS40W_3 19990426 Product speciﬁcation - BAS40W_2 BAS40_SERIES_5 20011010 Product speciﬁcation - BAS40_4

20060512 Product data sheet - BAS40_1PSXXSB4X_

SER_6

• Type number BAS40XY added

• Table 9 “Packing methods”: added packing method 2 mm pitch for SOD523

• Figure 27 “Wave soldering footprint SOT363 (SC-88)”: amended

• Figure 29 “Reﬂow soldering footprint SOT666”: amended

• Section 12 “Legal information”: updated

20050809 Product data sheet - 1PS70SB40_3

1PS75SB45_2 1PS76SB40_3 1PS79SB40_2 1PS88SB48_3 BAS40H_1 BAS40L_1 BAS40-05V_1 BAS40-07V_1 BAS40W_3 BAS40_SERIES_5

Product data sheet Rev. 07 — 12 May 2006 19 of 21

Philips Semiconductors

12. Legal information

12.1 Data sheet status

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

Document status

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development. Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation. Product [short] data sheet Production This document contains the product speciﬁcation.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Deﬁnitions”. [3] The product statusof device(s) described in this document mayhave changedsince this document was published and may differ incase of multiple devices. The latest product status

information is available on the Internet at URL

[1][2]

Product status

12.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modiﬁcations or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included hereinand shall have no liabilityfor the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the sameproduct type number(s) and title.A short datasheetis intended for quickreference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the full data sheet shall prevail.

12.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

Right to make changes — Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation speciﬁcations and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or

[3]

http://www.semiconductors.philips.com.

Deﬁnition

malfunction of a Philips Semiconductors productcan reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in the Absolute Maximum Ratings System ofIEC 60134) maycausepermanent damage to the device.Limiting values are stress ratings onlyand operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.

Terms and conditions of sale — Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at

http://www.semiconductors.philips.com/proﬁle/terms, including those

pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of anyinconsistencyor conﬂict between information in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

12.4 Trademarks

Notice: Allreferenced brands, product names,service names and trademarks are the property of their respective owners.

13. Contact information

For additional information, please visit: http://www.semiconductors.philips.com For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Product data sheet Rev. 07 — 12 May 2006 20 of 21

Philips Semiconductors

BAS40 series; 1PSxxSB4x series

14. Contents

1 Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 5

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

9 Packing information. . . . . . . . . . . . . . . . . . . . . 11

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20

12.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20

13 Contact information. . . . . . . . . . . . . . . . . . . . . 20

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

General-purpose Schottky diodes

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.

Document identifier: BAS40_1PSXXSB4X_SER_7

Date of release: 12 May 2006

Philips BAS40 Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual