Philips BAS15 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D050
BAS15
High-speed diode
Product specification Supersedes data of April 1996 File under Discrete Semiconductors, SC01
1996 Sep 10
Philips Semiconductors Product specification
High-speed diode BAS15

FEATURES

Hermetically sealed leaded glass SOD68 (DO-34) package
High switching speed: max. 4 ns

DESCRIPTION

The BAS15 is a high-speed switching diode fabricated in planar technology, and encapsulated in the hermetically sealed leaded glass SOD68 (DO-34) package.
Continuous reverse voltage: max. 50 V
Repetitive peak reverse voltage: max. 50 V
Repetitive peak forward current: max. 225 mA.

APPLICATIONS

High-speed switching
handbook, halfpage
The diode is type branded.
Fig.1 Simplified outline (SOD68; DO-34) and symbol.
k
a
MAM156
Protection diodes in reed relays.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V V I
F
I
FRM
I
FSM
RRM R
repetitive peak reverse voltage 50 V continuous reverse voltage 50 V continuous forward current see Fig.2; note 1 100 mA repetitive peak forward current 225 mA non-repetitive peak forward current square wave; Tj=25°C prior to
surge; see Fig.4
t=1µs 4A t=1ms 1A t=1s 0.5 A
P
tot
T
stg
T
j
total power dissipation T storage temperature 65 +200 °C junction temperature 200 °C
=25°C; note 1 350 mW
amb
Note
1. Device mounted on an FR4 printed circuit-board; lead length 10 mm.
1996 Sep 10 2
Philips Semiconductors Product specification
High-speed diode BAS15

ELECTRICAL CHARACTERISTICS

T
=25°C; unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
F
I
R
C
d
t
rr
V
fr
forward voltage see Fig.3
=1mA 700 mV
I
F
=10mA 850 mV
I
F
= 100 mA 1.1 V
I
F
reverse current see Fig.5
=30V 50 nA
V
R
=50V 200 nA
V
R
=30V; Tj= 150 °C 75 µA
V
R
=50V; Tj= 150 °C 100 µA
V
R
diode capacitance f = 1 MHz; VR= 0; see Fig.6 2pF reverse recovery time when switched from IF= 10 mA to
4ns IR= 60 mA; RL= 100 ; measured at IR= 1 mA; see Fig.7
forward recovery voltage when switched from IF= 50 mA;
2.5 V tr= 20 ns; see Fig.8

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R R
th j-tp th j-a
thermal resistance from junction to tie-point lead length 10 mm 240 K/W thermal resistance from junction to ambient lead length 10 mm; note 1 500 K/W
Note
1. Device mounted on a printed circuit-board without metallization pad.
1996 Sep 10 3
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