Philips BAP64-05 Datasheet

DISCRETE SEMICONDUCTORS
DATA SHEET
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BAP64-05
Silicon PIN diode
Preliminary specification 1999 Jun 16
Philips Semiconductors Preliminary specification
Silicon PIN diode BAP64-05
FEATURES
PINNING
High voltage, current controlled
RF resistor for RF attenuators and switches
Low diode capacitance
Low diode forward resistance
Low series inductance
For applications up to 3 GHz.
APPLICATIONS
RF attenuators and switches.
DESCRIPTION
Two planar PIN diodes in common cathode configuration in a SOT23 small plastic SMD package.
Marking code: 5Kp.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
PIN DESCRIPTION
1 anode (a1) 2 anode (a2) 3 common cathode
Fig.1 Simplified outline (SOT23) and symbol.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per diode
V
R
I
F
P
tot
T
stg
T
j
continuous reverse voltage 175 V continuous forward current 100 mA total power dissipation Ts=90°C 250 mW storage temperature −65 +150 °C junction temperature −65 +150 °C
1999 Jun 16 2
Philips Semiconductors Preliminary specification
Silicon PIN diode BAP64-05
ELECTRICAL CHARACTERISTICS
T
= 25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Per diode
V
F
I
R
C
d
r
D
τ
L
L
S
forward voltage IF=50mA 0.95 1.1 V
V
= 175 V −−10 µA
reverse leakage current
diode capacitance
diode forward resistance
charge carrier life time when switched from IF=10mA to
R
V
=20V −−1 µA
R
=0; f=1MHz 0.52 pF
V
R
V
=1V; f=1MHz 0.37 0.5 pF
R
V
=20V; f=1MHz 0.23 0.35 pF
R
I
= 0.5 mA; f = 100 MHz; note 1 20 40
F
= 1 mA; f = 100 MHz; note 1 10 20
I
F
I
= 10 mA; f = 100 MHz; note 1 23.8
F
I
= 100 mA; f = 100 MHz; note 1 0.7 1.35
F
1.55 −µs
=6mA; RL= 100 ;
I
R
measured at I
=3mA
R
series inductance 1.4 nH
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER VALUE UNIT
R
th j-s
thermal resistance from junction to soldering point 220 K/W
1999 Jun 16 3
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