Philips bap64 DATASHEETS

DISCRETE SEMICONDUCTORS
DATA SH EET
book, halfpage
M3D049
BAP64-03
Silicon PIN diode
Product specification Supersedes data of 1999 Jul 01
1999 Aug 27
Philips Semiconductors Product specification
Silicon PIN diode BAP64-03

FEATURES

High voltage, current controlled
RF resistor for RF attenuators and switches
Low diode capacitance

PINNING

PIN DESCRIPTION
1 cathode 2 anode
Low diode forward resistance
Low series inductance
For applications up to 3 GHz.
handbook, halfpage
12

APPLICATIONS

RF attenuators and switches.
MAM406

DESCRIPTION

Planar PIN diode in a SOD323 very small plastic SMD
Marking code: A3.
package.
Fig.1 Simplified outline (SOD323) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
R
I
F
P
tot
T
stg
T
j
continuous reverse voltage 175 V continuous forward current 100 mA total power dissipation Ts=90°C 500 mW storage temperature 65 +150 °C junction temperature 65 +150 °C
1999 Aug 27 2
Philips Semiconductors Product specification
Silicon PIN diode BAP64-03

ELECTRICAL CHARACTERISTICS

Tj= 25°C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
V
F
I
R
C
d
r
D
τ
L
L
S
forward voltage IF= 50 mA 0.95 1.1 V reverse current VR= 175 V 10 µA
V
=20V 1 µA
R
diode capacitance VR= 0; f = 1 MHz 0.48 pF
V
= 1 V; f = 1 MHz 0.35 pF
R
= 20 V; f = 1 MHz 0.23 0.35 pF
V
R
diode forward resistance IF= 0.5 mA; f = 100 MHz; note 1 20 40
I
= 1 mA; f = 100 MHz; note 1 10 20
F
= 10 mA; f = 100 MHz; note 1 2 3.8
I
F
I
= 100 mA; f = 100 MHz; note 1 0.7 1.35
F
charge carrier life time when switched from IF= 10 mA to
1.55 −µs IR= 6 mA; RL= 100 ; measured at IR=3mA
series inductance 1.68 nH
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT
R
th j-s
thermal resistance from junction to soldering point 120 K/W
1999 Aug 27 3
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