Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
BAP50-03
General purpose PIN diode
Product specification
Supersedes data of 1999 May 10
2004 Feb 11
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Philips Semiconductors Product specification
General purpose PIN diode BAP50-03
FEATURES
• Low diode capacitance
• Low diode forward resistance.
PINNING
PIN DESCRIPTION
1 cathode
2 anode
APPLICATIONS
• General RF applications.
DESCRIPTION
General purpose PIN diode in a SOD323 small plastic
21
SMD package.
Top view
Marking code: A8.
The marking bar indicates the cathode.
sym006
Fig.1 Simplified outline (SOD323) and symbol.
ORDERING INFORMATION
TYPE
NUMBER
NAME DESCRIPTION VERSION
PACKAGE
BAP50-03 − plastic surface mounted package; 2 leads SOD323
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
R
I
F
P
tot
T
stg
T
j
continuous reverse voltage − 50 V
continuous forward current − 50 mA
total power dissipation Ts=90°C − 500 mW
storage temperature −65 +150 °C
junction temperature −65 +150 °C
2004 Feb 11 2
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Philips Semiconductors Product specification
General purpose PIN diode BAP50-03
ELECTRICAL CHARACTERISTICS
Tj= 25°C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
F
V
R
I
R
C
d
r
D
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
forward voltage IF=50mA − 0.95 1.1 V
reverse voltage IR=10µA50−−V
reverse current VR=50V −−100 nA
diode capacitance VR= 0; f = 1 MHz − 0.4 − pF
VR= 1 V; f = 1 MHz − 0.3 0.55 pF
VR= 5 V; f = 1 MHz − 0.2 0.35 pF
diode forward resistance IF= 0.5 mA; f = 100 MHz; note 1 − 25 40 Ω
IF= 1 mA; f = 100 MHz; note 1 − 14 25 Ω
IF= 10 mA; f = 100 MHz; note 1 − 35Ω
THERMAL CHARACTERISTICS
SYMBOL PARAMETER VALUE UNIT
R
th(j-s)
thermal resistance from junction to soldering point 85 K/W
2004 Feb 11 3
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Philips Semiconductors Product specification
General purpose PIN diode BAP50-03
GRAPHICAL DATA
3
10
handbook, halfpage
r
D
(Ω)
2
10
10
1
−2
10
Tj=25°C; f = 100 MHz.
−1
10
110
MGS317
IF (mA)
Fig.2 Forward resistanceas a function of forward
current; typical values.
500
handbook, halfpage
C
d
(fF)
400
300
200
100
0
020
Tj=25°C; f = 1 MHz.
4 8 12 16
MGS323
VR (V)
Fig.3 Diode capacitance as a function of reverse
voltage; typical values.
handbook, halfpage
0
2
|S21|
(dB)
−1
−2
−3
−4
−5
0.5 3
(1) IF= 10 mA. (2) IF= 1 mA. (3) IF= 0.5 mA.
Diodeinserted in series with a 50 Ωstripline circuit and biased via the
analyzer Tee network.
=25°C.
T
amb
1
1.5 2 2.5
(1)
(2)
(3)
MGS319
f (GHz)
Fig.4 Insertion loss (|S21|2) of the diode as a
function of frequency; typical values.
handbook, halfpage
0
2
|S21|
(dB)
−5
−10
−15
−20
−25
0.5 3
Diode zero biased and inserted in series with a 50 Ω stripline circuit.
T
=25°C.
amb
1 1.5 2 2.5
MGS316
f (GHz)
Fig.5 Isolation(|S21|2)of the diode as a functionof
frequency; typical values.
2004 Feb 11 4
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Philips Semiconductors Product specification
General purpose PIN diode BAP50-03
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
D
H
D
SOD323
A
X
M
vA
E
Q
21
(1)
01
DIMENSIONS (mm are the original dimensions)
A
1.1
0.8
1
b
A
max
c D E H
p
0.40
0.25
1.8
0.25
0.10
IEC JEDEC JEITA
1.6
1.35
1.15
D
2.7
2.3
REFERENCES
UNIT
mm 0.05
Note
1. The marking bar indicates the cathode
OUTLINE
VERSION
SOD323 SC-76
L
0.45
0.15
b
p
scale
Q
0.25
0.15
v
0.2
p
A
A
2 mm
1
L
detail X
EUROPEAN
PROJECTION
p
c
ISSUE DATE
99-09-13
03-12-17
2004 Feb 11 5
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Philips Semiconductors Product specification
General purpose PIN diode BAP50-03
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
I Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor at any other conditionsabove thosegiveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuch applications will be
suitable for the specified use without further testing or
modification.
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personalinjury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2004 Feb 11 6
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Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands R77/03/pp7 Date of release: 2004 Feb 11 Document order number: 9397 750 12633
SCA76
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