74LV365PW
INTEGRATED CIRCUITS
74LV365
Hex buffer/line driver (3-State)
Product specification
Supersedes data of 1997 Mar 04
IC24 Data Handbook
1998 May 29
Philips Semiconductors Product specification
74L V365Hex buffer/line driver (3-State)
FEA TURES
•Optimized for Low Voltage applications: 1.0 to 3.6V
•Accepts TTL input levels between V
•Typical V
T
amb
•Typical V
T
amb
(output ground bounce) 0.8V @ VCC = 3.3V,
OLP
= 25°C
(output VOH undershoot) 2V @ VCC = 3.3V,
OHV
= 25°C
= 2.7V and VCC = 3.6V
CC
•Non-inverting outputs
•Output capability: bus driver
•I
category: MSI
CC
QUICK REFERENCE DATA
GND = 0V; T
SYMBOL
t
PHL/tPLH
C
I
C
PD
NOTES:
is used to determine the dynamic power dissipation (PD in µW)
1. C
PD
= CPD × V
P
D
f
= input frequency in MHz; CL = output load capacitance in pF;
i
= output frequency in MHz; VCC = supply voltage in V;
f
o
(C
2. The condition is V
= 25°C; tr = tf 2.5 ns
amb
2
CC
2
× V
L
× fo) = sum of the outputs.
CC
PARAMETER CONDITIONS TYPICAL UNIT
Propagation delay
nA to nY
Input capacitance 3.5 pF
Power dissipation capacitance per buffer Notes 1 and 2 40 pF
× fi (CL × V
= GND to V
I
CC
CC
2
× fo) where:
DESCRIPTION
The 74LV365 is a low-voltage CMOS device and is pin and function
compatible 74HC/HCT365.
The 74LV365 is a hex non-inverting buffer/line driver with 3-State
outputs. The 3-State outputs (nY) are controlled by the output
enable inputs (OE
A HIGH on OEn, causes the outputs to assume a high impedance
OFF-state.
CL = 15pF
VCC = 3.3V
1, OE2).
9 ns
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA PKG. DWG. #
16-Pin Plastic DIL –40°C to +125°C 74LV365 N 74LV365 N SOT38-4
16-Pin Plastic SO –40°C to +125°C 74LV365 D 74LV365 D SOT109-1
16-Pin Plastic SSOP Type II –40°C to +125°C 74LV365 DB 74LV365 DB SOT338-1
16-Pin Plastic TSSOP Type I –40°C to +125°C 74L V365 PW 74LV365PW DH SOT403-1
PIN DESCRIPTION
PIN
NUMBER
1, 15 OE1
2, 4, 6, 10,
12, 14
3, 5, 7, 9, 11,
13
8 GND Ground (0V)
16 V
SYMBOL FUNCTION
OE2 Output enable inputs (active-LOW)
,
1A to 6A Data inputs
1Y to 6Y Data outputs
CC
Positive supply voltage
FUNCTION TABLE
INPUTS OUTPUT
OE1 OE2 nA nY
L L L L
L L H H
X H X Z
H X X Z
H = HIGH voltage level
L = LOW voltage level
X = Don’t care
Z = High impedance OFF-state
1998 May 29 853–1932 19466
2
Philips Semiconductors Product specification
74LV365Hex buffer/line driver (3-State)
PIN CONFIGURATION
1
OE1
1A
2
3
1Y
4
2A
5
2Y
6
3A
7
3Y
8
GND
LOGIC SYMBOL
2
4
6
LOGIC SYMBOL (IEEE/IEC)
16
15
14
13
12
11
10
9
SV00644
V
OE
6A
6Y
5A
5Y
4A
4Y
1
CC
2
15
2
4
6
10
12
14
&
EN
3
5
7
9
11
13
SV00646
FUNCTIONAL DIAGRAM
2
1A
2A
3A
1Y
3
2Y
5
3Y
7
1A
2A
4
6
3A
1Y
3
5
2Y
7
3Y
10
4A
10
5A
12
6A
14
1
OE
1
OE
2
15
4Y
5Y
6Y
9
11
13
SV00645
4A
5A
12
6A
14
1
OE
1
OE
2
15
4Y
5Y
6Y
SV00647
9
11
13
1998 May 29
3
Philips Semiconductors Product specification
P
mW
74LV365Hex buffer/line driver (3-State)
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT
V
CC
V
V
T
amb
tr, t
NOTE:
1. The LV is guaranteed to function down to V
DC supply voltage See Note 1 1.0 3.3 3.6 V
Input voltage 0 – V
I
Output voltage 0 – V
O
Operating ambient temperature range in free air
Input rise and fall times
f
CC
See DC and AC
characteristics
VCC = 1.0V to 2.0V
VCC = 2.0V to 2.7V
V
= 2.7V to 3.6V
CC
= 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 3.6V.
–40
–40
–
–
–
–
–
–
–
CC
CC
+85
+125
500
200
100
V
V
°C
ns/V
ABSOLUTE MAXIMUM RATINGS
1, 2
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to GND (ground = 0V).
SYMBOL
V
CC
±I
IK
±I
OK
±I
O
±I
GND
±I
CC
T
stg
DC supply voltage –0.5 to +4.6 V
DC input diode current VI < –0.5 or VI > VCC + 0.5V 20 mA
DC output diode current VO < –0.5 or VO > VCC + 0.5V 50 mA
DC output source or sink current
– bus driver outputs
DC VCC or GND current for types with
,
–bus driver outputs
Storage temperature range –65 to +150 °C
PARAMETER CONDITIONS RATING UNIT
–0.5V < VO < VCC + 0.5V 35 mA
70 mA
Power dissipation per package for temperature range: –40 to +125°C
–plastic DIL above +70°C derate linearly with 12mW/K 750
tot
–plastic mini-pack (SO) above +70°C derate linearly with 8 mW/K 500
–plastic shrink mini-pack (SSOP and TSSOP) above +60°C derate linearly with 5.5 mW/K 400
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 May 29
4
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