Philips 74HCT670U, 74HCT670N, 74HCT670DB, 74HC670U, 74HC670N Datasheet

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DATA SH EET
Product specification File under Integrated Circuits, IC06
December 1990
INTEGRATED CIRCUITS
74HC/HCT670
4 x 4 register file; 3-state
For a complete data sheet, please also download:
The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
December 1990 2
Philips Semiconductors Product specification
4 x 4 register file; 3-state 74HC/HCT670
FEATURES
Simultaneous and independent read and write operations
Expandable to almost any word size and bit length
Output capability: bus driver
ICC category: MSI
GENERAL DESCRIPTION
The 74HC/HCT670 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A.
The 74HC/HCT670 are 16-bit 3-state register files organized as 4 words of 4 bits each. Separated read and write address inputs (R
A
, RBand WA,WB) and enable inputs (RE andWE) are available, permitting simultaneous writing into one word location and reading from another location. The 4-bit word to be stored is presented to four data inputs (D0 to D3). The WA and WB inputs determine
the location of the stored word. When the WE input is LOW, the data is entered into the addressed location. The addressed location remains transparent to the data while the WE input is LOW. Data supplied at the inputs will be read out in true (non-inverting) form from the 3-state outputs (Q0 to Q3). Dnand Wninputs are inhibited when WE is HIGH.
Direct acquisition of data stored in any of the four registers is made possible by individual read address inputs (RAand RB). The addressed word appears at the four outputs when the RE is LOW. Data outputs are in the high impedance OFF-state when RE is HIGH. This permits outputs to be tied together to increase the word capacity to very large numbers.
Design of the read enable signals for the stacked devices must ensure that there is no overlap in the LOW levels which would cause more than one output to be active at the same time. Parallel expansion to generate n-bit words is accomplished by driving the enable and address inputs of each device in parallel.
QUICK REFERENCE DATA
GND = 0 V; T
amb
=25°C; tr=tf= 6 ns
Notes
1. C
PD
is used to determine the dynamic power dissipation (PD in µW):
PD=CPD× V
CC
2
× fi+∑ (CV
CC
2
× fo) where:
fi= input frequency in MHz fo= output frequency in MHz (CV
CC
2
× fo) = sum of outputs CL= output load capacitance in pF VCC= supply voltage in V
2. For HC the condition is VI= GND to VCC; for HCT the condition is VI= GND to VCC−1.5 V
ORDERING INFORMATION
See
“74HC/HCT/HCU/HCMOS Logic Package Information”
.
SYMBOL PARAMETER CONDITIONS
TYPICAL
UNIT
HC HCT
t
PHL
/ t
PLH
propagation delay Dn to Q
n
CL= 15 pF; VCC= 5 V 23 23 ns
C
I
input capacitance 3.5 3.5 pF
C
PD
power dissipation capacitance per package notes 1 and 2 122 124 pF
December 1990 3
Philips Semiconductors Product specification
4 x 4 register file; 3-state 74HC/HCT670
PIN DESCRIPTION
PIN NO. SYMBOL NAME AND FUNCTION
5, 4 R
A
, R
B
read address inputs 8 GND ground (0 V) 10, 9, 7, 6 Q
0
to Q
3
data outputs 11
RE 3-state output read enable input (active LOW)
12
WE write enable input (active LOW)
14, 13 W
A
, W
B
write address inputs 15, 1, 2, 3 D
0
to D
3
data inputs 16 V
CC
positive supply voltage
Fig.1 Pin configuration.
Fig.2 Logic symbol. Fig.3 IEC logic symbol. Fig.4 Functional diagram.
WRITE MODE SELECT TABLE
Note
1. The write address (WA and WB) to the “internal latches” must be stable while WE is LOW for conventional operation.
OPERATING MODE
INPUTS
INTERNAL LATCHES
(1)
WE D
n
write data
LLL
HLH
data latched H X no change
READ MODE SELECT TABLE
Notes
1. The selection of the “internal latches” by read address (RA and RB) are not constrained by WE or RE operation. H = HIGH voltage level L = LOW voltage level X = don’t care Z = high impedance OFF-state
OPERATING MODE
INPUTS OUTPUT
RE INTERNAL LATCHES
(1)
Q
n
read
L L
L
H
L
H
disabled H X Z
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