The 74HC245; 74HCT245 is a high-speed Si-gate CMOS device and is pin compatible
with Low-Power Schottky TTL (LSTTL).
The 74HC245; 74HCT245 is an octal transceiver featuring non-inverting 3-state bus
compatible outputs in both send and receive directions. The 74HC245; 74HCT245
features an output enable input (OE) for easy cascading and a send/receive input (DIR)
for direction control. OE controls the outputs so that the buses are effectively isolated.
The 74HC245; 74HCT245 is similar to the 74HC640; 74HCT640 but has true
(non-inverting) outputs.
2.Features
■ Octal bidirectional bus interface
■ Non-inverting 3-state outputs
■ Multiple package options
■ Complies with JEDEC standard no. 7A
■ ESD protection:
◆ HBM EIA/JESD22-A114-B exceeds 2000 V
◆ MM EIA/JESD22-A115-A exceeds 200 V
■ Specified from −40 °Cto+85°C and from −40 °C to +125 °C
3.Quick reference data
Table 1:Quick reference data
GND = 0 V; T
SymbolParameterConditionsMinTypMaxUnit
Type 74HC245
, t
t
PHL
C
I
C
I/O
C
PD
Type 74HCT245
, t
t
PHL
amb
propagation delay
PLH
An to Bn or Bn to An
input capacitance-3.5-pF
input/output capacitance-10-pF
power dissipation
capacitance per
transceiver
propagation delay
PLH
An to Bn or Bn to An
=25°C; tr=tf= 6 ns.
CL=15pF;
V
=5V
CC
VI= GND to V
CL=15pF;
V
=5V
CC
CC
-7-ns
[1]
-30-pF
-10-ns
Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
Table 1:Quick reference data
GND = 0 V; T
=25°C; tr=tf= 6 ns.
amb
…continued
SymbolParameterConditionsMinTypMaxUnit
C
I
C
I/O
C
PD
input capacitance-3.5-pF
input/output capacitance-10-pF
power dissipation
capacitance per
VI= GND to
V
− 1.5 V
CC
[1]
-30-pF
transceiver
[1] CPDis used to determine the dynamic power dissipation (PD in µW):
PD=CPD× V
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC= supply voltage in V;
N = number of inputs switching;
∑ (CL× V
2
× fi× N+∑ (CL× V
CC
2
× fo) = sum of outputs.
CC
2
× fo) where:
CC
4.Ordering information
Table 2:Ordering information
Type numberPackage
Temperature range NameDescriptionVersion
74HC245N−40 °C to +125 °CDIP20plastic dual in-line package; 20 leads (300 mil)SOT146-1
74HC245D−40 °C to +125 °CSO20plastic small outline package; 20 leads;
body width 7.5 mm
74HC245PW−40 °C to +125 °CTSSOP20plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
74HC245DB−40 °C to +125 °CSSOP20plastic shrink small outline package; 20 leads;
body width 5.3 mm
74HC245BQ−40 °C to +125 °CDHVQFN20 plastic dual-in-line compatible thermal enhanced
very thin quad flat packageno leads; 20 terminals;
body 2.5 × 4.5 × 0.85 mm
74HCT245N−40 °C to +125 °CDIP20plastic dual in-line package; 20 leads (300 mil)SOT146-1
74HCT245D−40 °C to +125 °CSO20plastic small outline package; 20 leads;
body width 7.5 mm
74HCT245PW−40 °C to +125 °CTSSOP20plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
74HCT245DB−40 °C to +125 °CSSOP20plastic shrink small outline package; 20 leads;
body width 5.3 mm
74HCT245BQ−40 °C to +125 °CDHVQFN20 plastic dual-in-line compatible thermal enhanced
very thin quad flat package no leads; 20 terminals;