Page 1
INTEGRATED CIRCUITS
DATA SH EET
74HC1G14; 74HCT1G14
Inverting Schmitt-triggers
Product specification
Supersedes data of 2001 Mar 02
2002 May 15
Page 2
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
FEATURES
• Wide operating voltage range from 2.0 to 6.0 V
• Symmetrical output impedance
• High noise immunity
• Low power dissipation
• Balanced propagation delays
• Very small 5 pins package
• Applications
DESCRIPTION
The 74HC1G/HCT1G14 is a high-speed Si-gate CMOS
device.
The 74HC1G/HCT1G14 provides the inverting buffer
function with Schmitt-trigger action. These devices are
capable oftransformingslowly changing input signals into
sharply defined, jitter-free output signals.
The standard output currents are1⁄2 compared to the
74HC/HCT14.
– Wave and pulse shapers
– Astable multivibrators
– Monostable multivibrators
• Output capability: standard.
QUICK REFERENCE DATA
GND = 0 V; T
=25°C; tr=tf= 6.0 ns.
amb
SYMBOL PARAMETER CONDITIONS
t
PHL/tPLH
C
I
C
PD
propagation delay A to Y CL= 15 pF VCC= 5 V 10 15 ns
input capacitance 1.5 1.5 pF
power dissipation capacitance notes 1 and 2 20 22 pF
TYPICAL
UNIT
HC1G HCT1G
Notes
1. C
is used to determine the dynamic power dissipation (PDin µW).
PD
PD=CPD× V
2
× fi+ ∑ (CL× V
CC
2
× fo) where:
CC
fi= input frequency in MHz;
fo= output frequency in MHz;
= output load capacitance in pF;
C
L
VCC= supply voltage in Volts;
∑ (CL× V
2
× fo) = sum of outputs.
CC
2. For HC1G the condition is VI= GND to VCC.
For HCT1G the condition is VI= GND to VCC− 1.5 V.
FUNCTION TABLE
See note 1.
INPUT OUTPUT
AY
LH
HL
Note
1. H = HIGH voltage level;
L = LOW voltage level.
2002 May 15 2
Page 3
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
ORDERING AND PACKAGE INFORMATION
OUTSIDE NORTH
PACKAGES
AMERICA
TEMPERATURE
RANGE
PINS PACKAGE MATERIAL CODE MARKING
74HC1G14GW −40 to +125 °C 5 SC-88A plastic SOT353 HF
74HCT1G14GW −40 to +125 °C 5 SC-88A plastic SOT353 TF
74HC1G14GV −40 to +125 °C 5 SC-74A plastic SOT753 H14
74HCT1G14GV −40 to +125 °C 5 SC-74A plastic SOT753 T14
PINNING
PIN SYMBOL DESCRIPTION
1 n.c. not connected
2 A data input A
3 GND ground (0 V)
4 Y data output Y
5V
handbook, halfpage
n.c
GND
CC
1
A
2
14
3
MNA022
V
5
CC
Y
4
supply voltage
handbook, halfpage
AY
2
4
MNA023
Fig.1 Pin configuration.
handbook, halfpage
24
MNA024
Fig.3 IEC logic symbol.
2002 May 15 3
handbook, halfpage
Fig.2 Logic symbol.
A
Fig.4 Logic diagram.
Y
MNA025
Page 4
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS
UNIT
MIN. TYP. MAX. MIN. TYP. MAX.
74HC1G 74HCT1G
V
CC
V
I
V
O
T
amb
supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V
input voltage 0 − V
output voltage 0 − V
operating ambient
temperature
see DC and AC
characteristics per device
−40 +25 +125 −40 +25 +125 °C
0 − V
CC
0 − V
CC
CC
CC
V
V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
I
IK
I
OK
I
O
I
CC
T
stg
P
D
supply voltage −0.5 +7.0 V
input diode current VI<−0.5 V or VI> VCC+ 0.5 V; note 1 −±20 mA
output diode current VO<−0.5 V or VO> VCC+ 0.5 V; note 1 −±20 mA
output source or sink current −0.5 V < VO< VCC+ 0.5 V; note 1 −±12.5 mA
VCC or GND current note 1 −±25 mA
storage temperature −65 +150 °C
power dissipation per package for temperature range from −40 to +125 °C;
− 200 mW
note 2
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. Above 55 °C the value of PD derates linearly with 2.5 mW/K.
2002 May 15 4
Page 5
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
DC CHARACTERISTICS
Family 74HC1G
At recommended operating conditions; voltages are referenced to GND (ground=0V).
SYMBOL PARAMETER
V
OH
HIGH-level output
voltage
V
OL
LOW-level output
voltage
I
LI
I
CC
input leakage current VI=VCCor GND 6.0 −− 1.0 − 1.0 µA
quiescent supply
current
TEST CONDITIONS T
−40 to +85 −40 to +125
OTHER VCC (V)
MIN. TYP.
VI=VIHor VIL;
2.0 1.9 2.0 − 1.9 − V
IO= −20 µA
V
I=VIH
or VIL;
4.5 4.4 4.5 − 4.4 − V
IO= −20 µA
V
I=VIH
or VIL;
6.0 5.9 6.0 − 5.9 − V
IO= −20 µA
V
I=VIH
or VIL;
4.5 4.13 4.32 − 3.7 − V
IO= −2.0 mA
V
I=VIH
or VIL;
6.0 5.63 5.81 − 5.2 − V
IO= −2.6 mA
VI=VIHor VIL;
2.0 − 0 0.1 − 0.1 V
IO=20µA
V
I=VIH
or VIL;
4.5 − 0 0.1 − 0.1 V
IO=20µA
V
I=VIH
or VIL;
6.0 − 0 0.1 − 0.1 V
IO=20µA
V
I=VIH
or VIL;
4.5 − 0.15 0.33 − 0.4 V
IO= 2.0 mA
V
I=VIH
or VIL;
6.0 − 0.16 0.33 − 0.4 V
IO= 2.6 mA
VI=VCCor GND;
6.0 −− 10 − 20 µA
IO=0
(°C)
amb
(1)
MAX. MIN. MAX.
UNIT
Note
1. All typical values are measured at T
amb
=25°C.
2002 May 15 5
Page 6
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
Family 74HC1G14
At recommended operating conditions; voltages are referenced to GND (ground=0V).
SYMBOL PARAMETER
V
T+
positive-going threshold see Figs 5 and 6 2.0 0.7 1.09 1.5 0.7 1.5 V
TEST CONDITIONS T
−40 to +85 −40 to +125
WAVEFORMS VCC (V)
MIN. TYP.
amb
(1)
4.5 1.7 2.36 3.15 1.7 3.15 V
6.0 2.1 3.12 4.2 2.1 4.2 V
V
T−
negative-going threshold see Figs 5 and 6 2.0 0.3 0.60 0.9 0.3 0.9 V
4.5 0.9 1.53 2.0 0.9 2.0 V
6.0 1.2 2.08 2.6 1.2 2.6 V
V
H
hysteresis (VT+− VT−) see Figs 5 and 6 2.0 0.2 0.48 1.0 0.2 1.0 V
4.5 0.4 0.83 1.4 0.4 1.4 V
6.0 0.6 1.04 1.6 0.6 1.6 V
Note
1. All typical values are measured at T
amb
=25°C.
Family 74HCT1G
At recommended operating conditions; voltages are referenced to GND (ground=0V).
SYMBOL PARAMETER
V
OH
HIGH-level output
voltage
TEST CONDITIONS T
OTHER VCC (V)
MIN. TYP.
VI=VIHor VIL;
4.5 4.4 4.5 − 4.4 − V
IO= −20 µA
V
I=VIH
or VIL;
4.5 4.13 4.32 − 3.7 − V
−40 to +85 −40 to +125
amb
(1)
IO= −2.0 mA
V
OL
LOW-level output
voltage
VI=VIHor VIL;
IO=20µA
I=VIH
or VIL;
V
4.5 − 0 0.1 − 0.1 V
4.5 − 0.15 0.33 − 0.4 V
IO= 2.0 mA
I
I
∆I
LI
CC
CC
input leakage current VI=VCCor GND 5.5 −−1.0 − 1.0 µA
quiescent supply
current
additional supply
current per input
VI=VCCor GND;
IO=0
VI=VCC− 2.1 V;
IO=0
5.5 −−10.0 − 20.0 µA
4.5 to 5.5 −−500 − 850 µA
(°C)
UNIT
MAX. MIN. MAX.
(°C)
UNIT
MAX. MIN. MAX.
Note
1. All typical values are measured at T
amb
=25°C.
2002 May 15 6
Page 7
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
Family 74HCT1G14
At recommended operating conditions; voltages are referenced to GND (ground=0V).
SYMBOL PARAMETER
V
T+
V
T−
V
H
positive-going threshold see Figs 5 and 6 4.5 1.2 1.55 1.9 1.2 1.9 V
negative-going threshold see Figs 5 and 6 4.5 0.5 0.76 1.2 0.5 1.2 V
hysteresis (VT+− VT−) see Figs 5 and 6 4.5 0.4 0.80 − 0.4 − V
Note
1. All typical values are measured at T
AC CHARACTERISTICS
Type 74HC1G14
GND = 0 V; tr=tf= 6.0 ns; CL=50pF.
SYMBOL PARAMETER
t
PHL/tPLH
propagation delay
see Figs 12 and 13 2.0 − 25 155 − 190 ns
AtoY
TEST CONDITIONS T
−40 to +85 −40 to +125
WAVEFORMS VCC (V)
MIN. TYP.
5.5 1.4 1.80 2.1 1.4 2.1 V
5.5 0.6 0.90 1.4 0.6 1.4 V
5.5 0.4 0.90 − 0.4 − V
=25°C.
amb
TEST CONDITIONS T
−40 to +85 −40 to +125
WAVEFORMS VCC (V)
MIN. TYP.
4.5 − 12 31 − 38 ns
6.0 − 11 26 − 32 ns
(°C)
amb
(1)
MAX. MIN. MAX.
(°C)
amb
(1)
MAX. MIN. MAX.
UNIT
UNIT
Note
1. All typical values are measured at T
amb
=25°C.
Type 74HCT1G14
GND = 0 V; tr=tf= 6.0 ns; CL=50pF.
TEST CONDITIONS T
SYMBOL PARAMETER
WAVEFORMS VCC(V)
t
PHL/tPLH
propagation delay
see Figs 12 and 13 4.5 − 17 43 − 51 ns
AtoY
Note
1. All typical values are measured at T
amb
=25°C.
2002 May 15 7
(°C)
amb
−40 to +85 −40 to +125
MIN. TYP.
(1)
MAX. MIN. MAX.
UNIT
Page 8
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
TRANSFER CHARACTERISTIC WAVEFORMS
handbook, halfpage
100
handbook, halfpage
I
CC
(µA)
V
O
V
H
V
T−
V
T+
MNA026
Fig.5 Transfer characteristic.
V
I
MNA028
handbook, halfpage
V
V
V
O
T+
I
V
T−
V
MNA027
Fig.6 The definitions of VT+, VT− and VH; where
VT+ and VT− are between limits of 20%
and 70%.
1.0
handbook, halfpage
I
CC
(mA)
0.8
MNA029
H
50
0
0 2.0
1.0
VI (V)
Fig.7 Typical HC1G14 transfer characteristics;
VCC= 2.0 V.
2002 May 15 8
0.6
0.4
0.2
0
0 5.0
2.5
VI (V)
Fig.8 Typical HC1G14 transfer characteristics;
VCC= 4.5 V.
Page 9
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
1.6
handbook, halfpage
I
CC
(mA)
0.8
0
0 3.0 6.0
MNA030
VI (V)
Fig.9 Typical HC1G14 transfer characteristics;
VCC= 6.0 V.
2.0
handbook, halfpage
I
CC
(mA)
1.0
0
0 5.0
2.5
MNA031
VI (V)
Fig.10 Typical HCT1G14 transfer characteristics;
VCC= 4.5 V.
3.0
handbook, halfpage
I
CC
(mA)
2.0
1.0
0
0
3.0 6.0
MNA032
VI (V)
Fig.11 Typical HCT1G14 transfer characteristics;
VCC= 5.5 V.
2002 May 15 9
handbook, halfpage
A input
Y output
For HC1G: VM= 50%; VI= GND to VCC.
For HCT1G: VM= 1.3 V; VI= GND to 3.0 V.
V
M
t
PHL
V
M
Fig.12 The input (A) to output (Y) propagation
delays.
t
PLH
MNA033
Page 10
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
handbook, halfpage
V
PULSE
GENERATOR
Definitions for test circuit:
CL= load capacitance including jig and probe capacitance (See “AC characteristics” for values).
RT= termination resistance should be equal to the output impedance Zo of the pulse generator.
I
V
CC
V
D.U.T.
R
T
O
C
L
Fig.13 Load circuitry for switching times.
50 pF
MNA034
2002 May 15 10
Page 11
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
APPLICATION INFORMATION
The slow input rise and fall times cause additional power
dissipation, this can be calculated using the following
formula:
Pad=fi×(tr× I
CCa+tf×ICCa
) × V
CC
Where:
Pad= additional power dissipation (µW)
fi= input frequency (MHz)
tr= input rise time (ns); 10% to 90%
tf= input fall time (ns); 90% to 10%
I
= average additional supply current (µA).
CCa
Average I
differs with positive or negative input
CCa
transitions, as shown in Fig.14 and Fig.15.
HC1G/HCT1G14 used in relaxation oscillator circuit,
see Fig.14 and Fig.16.
Note to the application information:
1. All values given are typical unless otherwise specified.
200
handbook, halfpage
I
CC(AV)
(µA)
150
positive-going
100
50
negative-going
0
0 2.0 4.0 6.0
Fig.14 Average ICC for HC1G Schmitt-trigger
devices; linear change of VI between
0.1VCCto 0.9VCC.
MNA036
edge
edge
VCC (V)
200
handbook, halfpage
I
CC(AV)
(µA)
150
100
50
0
0462
positive-going
negative-going
MNA058
edge
edge
V
(V)
CC
Fig.15 Average ICC for HCT1G Schmitt-trigger
devices; linear change of VI between
0.1VCCto 0.9VCC.
2002 May 15 11
handbook, halfpage
For HC1G:
For HCT1G:
1
f
≈=
---
-----------------------
T
0.8 RC×
1
f
≈=
---
-------------------------- -
T
0.67 RC×
R
C
MNA035
1
1
Fig.16 Relaxation oscillator using the
HC1G/HCT1G14.
Page 12
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
PACKAGE OUTLINES
Plastic surface mounted package; 5 leads SOT353
D
y
45
132
e
1
e
b
p
wBM
A
A
1
E
H
E
detail X
Q
L
p
AB
X
v M
A
c
0 1 2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
mm
A
1.1
0.8
OUTLINE
VERSION
SOT353
max
0.1
1
b
cD
p
0.30
0.20
IEC JEDEC EIAJ
0.25
0.10
2.2
1.8
(2)
E
1.35
1.3
1.15
REFERENCES
e
e
1
0.65
2002 May 15 12
H
2.2
2.0
L
Qywv
p
E
0.45
0.15
0.25
0.15
0.2 0.10.2
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28SC-88A
Page 13
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
Plastic surface mounted package; 5 leads SOT753
D
y
E
H
E
AB
X
v M
A
45
Q
A
A
1
c
132
L
p
3.1
2.7
b
p
wBM
0 1 2 mm
scale
H
e
E
1.7
0.95
1.3
REFERENCES
E
3.0
2.5
e
DIMENSIONS (mm are the original dimensions)
A
UNIT
mm
A
0.100
1.1
0.013
0.9
OUTLINE
VERSION
SOT753 SC-74A
b
cD
p
1
0.40
0.26
0.25
0.10
IEC JEDEC JEITA
2002 May 15 13
L
Qywv
p
0.6
0.33
0.2
0.23
0.2 0.10.2
detail X
EUROPEAN
PROJECTION
ISSUE DATE
02-04-16
Page 14
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
SOLDERING
Introduction to soldering surface mount packages
Thistext gives averybriefinsight to acomplextechnology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurface mount ICs, butitis not suitable forfinepitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardby screen printing,stencillingor
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
Wave soldering
Conventional single wave soldering is not recommended
forsurface mount devices (SMDs)orprinted-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• Forpackages with leads onfoursides, the footprint must
be placedat a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering,the packagemust
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2002 May 15 14
Page 15
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
(1)
SOLDERING METHOD
WAVE REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
not suitable
(3)
suitable
HVSON, SMS
(4)
PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended
, SO, SOJ suitable suitable
(4)(5)
suitable
(6)
suitable
Notes
1. Formore detailed informationon the BGApackagesrefer to the
“(LF)BGAApplication Note
”(AN01026); order acopy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitablefor LQFP, TQFP and QFPpackages with a pitch (e) larger than0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2002 May 15 15
Page 16
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS
Objective data Development This data sheet contains data from the objective specification for product
Preliminary data Qualification This data sheet contains data from the preliminary specification.
Product data Production This data sheet contains data from the product specification. Philips
(1)
STATUS
(2)
DEFINITIONS
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given arein
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or atanyother conditions abovethosegiven in the
Characteristics sections of the specificationis not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationor warranty thatsuchapplicationswill be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expectedto result in personal injury.Philips
Semiconductorscustomersusing or selling theseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuse of any oftheseproducts, conveys no licenceortitle
under any patent, copyright, or mask work right to these
products,and makes norepresentationsor warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2002 May 15 16
Page 17
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
NOTES
2002 May 15 17
Page 18
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
NOTES
2002 May 15 18
Page 19
Philips Semiconductors Product specification
Inverting Schmitt-triggers 74HC1G14; 74HCT1G14
NOTES
2002 May 15 19
Page 20
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2002
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands 613508/03/pp20 Date of release:2002 May 15 Document order number: 9397 750 09721
SCA74
Loading...