Philips 74HC1G126, 74HCT1G126 Technical data

INTEGRATED CIRCUITS
DATA SH EET
74HC1G126; 74HCT1G126
Bus buffer/line driver; 3-state
Product specification Supersedes data of 2001 Apr 06
2002 May 15
Bus buffer/line driver; 3-state 74HC1G126; 74HCT1G126

FEATURES

Wide operating voltage from 2.0 to 6.0 V
Symmetrical output impedance
High noise immunity
Low power dissipation
Balanced propagation delays
Very small 5 pins package
Output capability: bus driver.

DESCRIPTION

The 74HC1G/HCT1G126 is a highspeed Si-gate CMOS device.
The 74HC1G/HCT1G126 provides one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input pin (OE). A LOW at pin OE causes the output as assume a high-impedance OFF-state.
The bus driver output currents are equal compared to the 74HC/HCT126.

QUICK REFERENCE DATA

GND = 0 V; T
=25°C; tr=rf≤6.0 ns.
amb
SYMBOL PARAMETER CONDITIONS
t
PHL/tPLH
C
I
C
PD
propagation delay A to Y CL= 15 pF; VCC= 5 V 9 10 ns input capacitance 1.5 1.5 pF power dissipation capacitance notes 1 and 2 30 27 pF
Notes
1. C
is used to determine the dynamic power dissipation (PDin µW).
PD
PD=CPD× V
2
× fi+(CL×V
CC
2
× fo) where:
CC
fi= input frequency in MHz; fo= output frequency in MHz;
= output load capacitance in pF;
C
L
VCC= supply voltage in Volts.
2. For HC1G the conditions is VI= GND to VCC. For HCT1G the conditions is VI= GND to VCC− 1.5 V.
TYPICAL
UNIT
HC1G HCT1G

FUNCTION TABLE

See note 1.
INPUTS OUTPUT
OE A Y
LXZ
Note
1. H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
2002 May 15 2
Bus buffer/line driver; 3-state 74HC1G126; 74HCT1G126

ORDERING INFORMATION

PACKAGES
TYPE NUMBER
74HC1G126GW 40 to +125 °C 5 SC88A plastic SOT353 HN 74HCT1G126GW 40to+125°C 5 SC88A plastic SOT353 TN 74HC1G126GV 40to+125°C 5 SC-74A plastic SOT753 H26 74HCT1G126GV 40 to +125 °C 5 SC-74A plastic SOT753 T26

PIN DESCRIPTION

PIN SYMBOL NAME AND FUNCTION
1 OE output enable input 2 A data input A 3 GND ground (0 V) 4 Y data output Y 5V
TEMPERATURE
RANGE
CC
PINS PACKAGE MATERIAL CODE MARKING
supply voltage
handbook, halfpage
handbook, halfpage
OE
GND
1
A
2
126
3
MNA124
V
5
Y
4
Fig.1 Pin configuration.
2 1
OE
MNA126
4
CC
handbook, halfpage
handbook, halfpage
OE
A
2
OE
1
Fig.2 Logic symbol.
A
Y
MNA125
4
Y
MNA127
Fig.3 IEC logic symbol.
2002 May 15 3
Fig.4 Logic diagram.
Bus buffer/line driver; 3-state 74HC1G126; 74HCT1G126

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER CONDITIONS
UNIT
MIN. TYP. MAX. MIN. TYP. MAX.
74HC1G 74HCT1G
V
CC
V
I
V
O
T
amb
supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V input voltage 0 V output voltage 0 V operating ambient
temperature
see DC and AC characteristicsper
40 +25 +125 40 +25 +125 °C
0 V
CC
0 V
CC
CC CC
V V
device
t
r,tf
input rise and fall times VCC= 2.0 V −−1000 −−−ns
= 4.5 V −−500 −−500 ns
V
CC
V
= 6.0 V −−400 −−−ns
CC

LIMITING VALUES

In accordancewith the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V); notes 1 and 2.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
I
IK
I
OK
I
O
I
CC
T
stg
P
D
supply voltage 0.5 +7.0 V input diode current VI< 0.5 V or VI>VCC+ 0.5 V −±20 mA output diode current VO< 0.5 V or VO>VCC+ 0.5 V −±20 mA output source or sink current 0.5V<VO<VCC+ 0.5 V −±35.0 mA VCC or GND current −±70 mA storage temperature 65 +150 °C power dissipation per package for temperature range from 40 to +125 °C;
200 mW
note 3
Notes
1. Stresses beyond those listed may cause permanent damage to the device. These are stress rating only and functional operation of the device at these or any other conditions beyond those under ‘recommended operating conditions’ is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
3. Above 55 °C the value of P
derates linearly with 2.5 mW/K.
D
2002 May 15 4
Bus buffer/line driver; 3-state 74HC1G126; 74HCT1G126
DC CHARACTERISTICS Family 74HC1G
At recommended operating conditions; voltages are referenced to GND (ground=0V).
SYMBOL PARAMETER
V
IH
V
IL
V
OH
HIGH-level input voltage 2.0 1.5 1.2 1.5 V
LOW-level input voltage 2.0 0.8 0.5 0.5 V
HIGH-level output voltage
V
OL
I
LI
I
OZ
LOW-level output voltage VI=VIHor VIL;
input leakage current VI=VCC or GND 6.0 −−1.0 1.0 µA 3-state output current
OFF-state
I
CC
quiescent supply current VI=VCC or GND;
TEST CONDITIONS T
OTHER
V
(V)
CC
40 to +85 40 to +125
MIN. TYP.
4.5 3.15 2.4 3.15 V
6.0 4.2 3.2 4.2 V
4.5 2.1 1.35 1.35 V
6.0 2.8 1.8 1.8 V
VI=VIHor VIL;
2.0 1.9 2.0 1.9 V
IO= 20 µA V
I=VIH
or VIL;
4.5 4.4 4.5 4.4 V
IO= 20 µA V
I=VIH
or VIL;
6.0 5.9 6.0 5.9 V
IO= 20 µA V
I=VIH
or VIL;
4.5 3.84 4.32 3.7 V
IO= 6.0 mA V
I=VIH
or VIL;
6.0 5.34 5.81 5.2 V
IO= 7.8 mA
2.0 0 0.1 0.1 V
IO=20µA V
I=VIH
or VIL;
4.5 0 0.1 0.1 V
IO=20µA V
I=VIH
or VIL;
6.0 0 0.1 0.1 V
IO=20µA V
I=VIH
or VIL;
4.5 0.15 0.33 0.4 V
IO= 6.0 mA V
I=VIH
or VIL;
6.0 0.16 0.33 0.4 V
IO= 7.8 mA
VI=VIHor VIL;
6.0 −−5−10 µA
VO=VCC or GND
6.0 −−10 20 µA
IO=0
(°C)
amb
(1)
MAX. MIN. MAX.
UNIT
Note
1. All typical values are measured at T
amb
=25°C.
2002 May 15 5
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