Philips 32TA1000/93, 32TA1600/93, 26TA1600/98 Schematic

Published by JH 671 TV Service Printed in the Netherlands Subject to modification EN 3122 785 16081

rieval system or transmitted, in any form or by any means, electronic,

mecha

nical, photocopying, or otherwise without the prior permission of Philips.

Colour Television

assis

TPF1.4A

Contents Page

1. Technical Specifications and Connections(32 2~3

2. Safety Instructions, Warnin gs and Notes 4

3. Directions for User 6

4. Mechanical Instructions 7~8

Aging and Factory Model 9

6. Wiring D ia gr am 10 Blo

ck Diagram 11~14

7. Circuits Diagrams & PWB La youts

is Overview & Ex pl oded View 15~16

Chass

Diagr

ER (Diagram S-A)17 32~33

POW DVI HDCP IN (Diagram S-B)18 32~33 PC ANALOG IN (Diagram S-C)19 32~33 AV IN/OUT (Diagram S-D) 20 32~33

ART I/O (Diagram S-E) 21 32~33

SC Tuner (Diagram S-F) 22 3 2~33

EO DECODER (Diagram S-G)23 32~33

VID T/T DECODER (Diagram S-H)24 32~33 COLUMB SCAL SDR SCAL AUD AUD AUD

Pow SI HD PCB (Diagram H)40 41~42 IR PCB (Diagram I)43 44~45 KEY PCB (Diagram K)46 47~48

US (Diagram S-I ) 2 5 32~33

R MST551512L (Diagram S-J )26 32~33

AM (Diagram S-K)27 32~33

ER MCU (Diagram S-L)28 32~33 IO DECODER (Diagram S-M)29 32~33 IO DELAY (Diagram S-N)30 32~33 IO AMP (Diagram S-O)31 32~33

er Board (Diagram P)34 35~36

DE AV (Diagram A)37 38~39

m PWB

32TA1000/93 32

TA1000/98 TA1600/93

TA1600/98

32 32

TA1000/79

TA1000/93

TA1000/98 TA1000/79

26 26

TA1600/98

Contents Page

8. Alignments l Instructions 49~53

Electric DDC Instructions & Serial NO.Definition 54~60 DD Firmwa Display adjustment 65 Trouble Shooting 66

9. Circu IC Data Sh eets 69~73 Repa

10.Spa Spa

11. 26TA1000 Supplement Material Technical Specifications and Connections( DDC DATA(26 ) 86~87

12.D

13.R

C DATA(32 ) 61~62

e Upgrade for CP U

t Description 67~68

r Flow C ha rt 74~75

e Parts Li st 76~79

e Parts Li st(26 ) 80~83

fferent Part List

evision List 91

2 )

26 84~85

63~64

88~

TPF1.4A LA

1. Technical Specifications and Connections

Index of this chapter:

1.1 Technical Specifications(32 )

1.2 Connections

Note: Figures below can deviate slightly from the actual

situation, due to the different set executions.

1.1 Technical Specifications(32 )

1. Vision

Type NO : CLAA320WA01 C (Supplier CPT)

Outline dimensions : 743.0 mm(H) x 447.0 mm(V) x

Pitch (mm) : 510.75um(H) x 510.75um(V) Pixel format : 1366 horiz. by 768 vert. pixels Color pixel arrangement : RGB vertical stripe Display surface : Hard coating(3H),Anti-glare

Number of color : 16,777,216 colors(8bits) Backlight : 16 CCFL Active area (WxH) : 697.68mm x 392.25mm Luminance of white : 550 cd/m (Center 1 points, Typ.)

Display type LCD WXGA Active Matrix TFT Screen size : 32"(81cm), 16:9 Resolution : 1280X768@60Hz Contrast ratio : 800:1 Response time (ms) : 8 Viewing angle (HxV degrees) : 170/170 Tuning system : PLL TV color systems : PAL Video playback : Multisystem Supported inputs : IBM VGA(640*480)

Channel selections : 99 presets

" TPF1.4A LA

44.0(D) mm (Typ.)

treatment of the front polarizer

VESA(800*600) VESA(1024*768) WXGA(1280*720) WXGA(1280*768) 480i 480P 576i 576P 720P/50Hz 720P/60Hz 1080i/50Hz 1080i/60Hz

Humidity : 20- 90% (No condensation) Air pressure : 600-1100 mBAR

Note: recommend at 0 to 35 C, Humidity less than 60 %

Shipping Temperature : ( -20 to 60 C)

Humidity : 5- 90% (non condensing ) Altitude : 0-40000 feet ( non operating ) Air pressure : 600-1100 mBAR

1.2 Connections

1. Tuner: China / AP

2. DVI IN: DVI input (TV digital interface support HDCP) with audio R/L(RCA jack ).

3. PC IN: VGA input (D-SUB 15 pin connector ) with audio R/L(mini-jack).

4. HD IN: YPbPr component video ( RCA jack ) and audio R/L(RCA jack ).

5. AV IN3:YPbPr component video ( RCAjack ) and Video3 (CVBS , RCA jack ) share with same audio R/L ( RCAjack ).

6. AV OUT: Video (CVBS , RCA jack ) and audio R/L(RCA jack ).

7. AV IN1: Video1 (CVBS , RCA jack ) and S-Video 1 share with same audio R/L (RCA jack ).

8. AV IN2: Video2 (CVBS, RCA jack ) and S-Video 2 share with same audio R/L (RCA jack).

9. Headphone OUT : Audio R/L out ( mini-jack )

Fig.1-1

Fig.1-2

. Sound

Sound systems FM-Stereo

BTSC-stereo SAP

3. Miscellaneous

Power supply:

AC-input : 90V ~ 264VAC,50/60 2Hz Power consumption : 80W/Typ(at PC mode),

135W/Typ(at TV mode).

Standby power : < 1.0 Watts. (Power source: 110VAC)

< 1.5 Watts. (Power source: 230VAC) Power cord type : 3 lead with earth plug , plugable Power indicator : LED (On: Green ,Sleeping mode: Amber ) Auto power saving : EPA, Nutek, VESA DPMS

Operating: Temperature : 0 to 40 C

Humidity : 10 to 90%() Altitude : 0-14,000 feet Air pressure : 600-1100 mBAR (guaranteed optical performance) : 5 to 35 C (guaranteed functional performance):5to40 C

Storage Temperature : -20 to 50 C

Fig.1-3

1.2.1 PC input connectors

(1) PC Analog Video input with D-SUB connector

D-SUB Pin assignment

PIN No. SIGNAL 1Red 2 Green 3 Blue 4GND 5 Self test 6RedGND 7 Green GND 8 Blue GND 9 +5V (Supply from PC) 10 Sync GND 11 G ND 12 Bi-directional data 13 H-sync 14 V-sync 15 Data clock

1. Technical Specifications and Connections

Signal interface

- 1.8M 15 Pins, D-SUB male.

Sync polarity

-Hori. sync positive/negative

-Vert. sync positive/negative

(2) PC Audio input with 3.5 Mini stereo jack

Specification

Audio L/R input

- Nominal : 0.5 V rms.

- Maximum : 1.5 V rms.

- Impedance > 10 k

(3) Headphone / Audio line-out with 3.5 mm stereo jack

Specifications : L/R Output 10 mW / 32

Note : Headphones with impedance between 8 ~ 600 when headphone plug is connected, loudspeaker sound is muted.

1.2.2 Video input /output connectors

(1) TV Tuner with RF connector ( TV Input from Aerial or Cable )

Specification

-AerialorCable

- Impedance 75

(2) HD / Component Y Pb Pr with RCA connector ( Video , Audio input )

Specification

Video - Y : 700mV, Pb, Pr, : ± 350mV,

- Impedance : 75

Audio: L/R input

- Nominal : 0.5 V rms.

- Maximum : 1.5 V rms.

- Impedance > 10 k

Note : the input will be overloaded when the signal > 1.5 V rms.

(3) S-Video with S terminal (Video, Audio input)

Specification

Video - Y : 1Vpp , C : 300 mV pp

- Impedance : 75

Audio L/R input (share with Composite Audio input)

- Nominal : 0.5 V rms.

- Maximum : 1.5 V rms.

- Impedance > 10 k

Note : the input will be overloaded when the signal > 1.5 V rms.

TPF1.4A LA

DVI-D Pin assignment

Pin No. Description

RX2-

2RX2+

3GND

4GND

5GND

6 DDC clock

7 DDC data

8GND

9RX1-

10 RX1+

11 GND

12 GND

13 GND

14 +5V

15 DVI-D self test

16 +5V

17 RX0-

18 RX0+

19 GND

20 GND

21 GND

22 GND

23 RXC+

24 RXC-

Signal interface - 1.8M 24 Pins, DVI-D male Signal type - Digital interface with 4 channels TMDS signal

(4) Composite with RCA Jack (Video, Audio input)

Specification

Video - CVBS Source signal 1 Vpp

- Impedance : 75

Audio L/R input (share with S-Video Audio input)

- Nominal : 0.5 V rms.

- Maximum : 1.5 V rms.

- Impedance > 10 k

Note : the input will be overloaded when the signal > 1.5 V rms.

(5) PVR with RCA Jack (Video, Audio output from TV Tuner CVBS)

Specification

Video - CVBS output. 1 Vpp ( from TV Tuner )

- Impedance : 75

Audio L/R output ( from TV Tuner )

- Nominal : 0.5 V rms.

- Maximum : 1.5 V rms.

-Impedance < 1K

TPF1.4A LA

2. Safety Instructions, Warnings and Notes

index of this chapter:

2.1 Safety Instructions

2.2 Warnings

2.3 Notes

2.1 Safety Instructions

Safety regulations require that during a repair:

Connect the set to the AC Power via an isolation transformer (> 800 VA).

Replace safety components, indicated by the symbol , only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard.

Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention to the following points:

Route the wire trees correctly and fix them with the mounted cable clamps.

Check the insulation of the AC Power lead for external damage.

Check the strain relief of the AC Power cord for proper function.

Check the electrical DC resistance between the AC Power plug and the secondary side (only for sets which have a AC

Power isolated power supply):

1. Unplug the AC Power cord and connect a wire between the two pins of the AC Power plug.

2. Set the AC Power switch to the "on" position (keep the

AC Power cord unplugged!).

3. Measure the resistance value between the pins of the

AC Power plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be between 4.5 Mohm and 12 Mohm.

4. Switch "off" the set, and remove the wire between the two pins of the AC Power plug.

Check the cabinet for defects, to avoid touching of any inner parts by the customer.

2.2 Warnings

All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD ). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are connected with the same potential as the mass of the set by a wristband with resistance. Keep components and tools also at this same potential.

Be careful during measurements in the high voltage section.

Never replace modules or other components while the unit is switched "on".

When you align the set, use plastic rather than metal tools. This will prevent any short circuits and the danger of a circuit becoming unstable.

2.3 Notes

2.3.1 General

1. Measure the voltages and waveforms with regard to the chassis (= tuner) ground ( ), or hot ground ( ), depending on the tested area of circuitry. The voltages and waveforms shown in the diagrams are indicative. Measure them in the Service Default Mode (see chapter 5) with a color bar signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated otherwise) and picture carrier at 475.25 MHz for PAL, or

61.25 MHz for NTSC (channel 3).

2. Where necessary, measure the waveforms and voltages with ( ) and without ( ) aerial signal. Measure the voltages in the power supply section both in normal operation ( ) and in stand-by ( ). These values are indicated by means of the appropriate symbols.

3. The semiconductors indicated in the circuit diagram and in

the parts lists, are interchangeable per position with the semiconductors in the unit, irrespective of the type indication on these semiconductors.

4. Manufactured under license from Dolby Laboratories. "Dolby" and the "double-D symbol", are trademarks of Dolby Laboratories.

2.3.2 Schematic Notes

1. All resistor values are in ohms and the value multiplier is often used to indicate the decimal point location (e.g. 2K2 indicates 2.2 kohm).

2. Resistor values with no multiplier may be indicated with either an "E" or an "R" (e.g. 220E or 220R indicates 220 ohm).

3. All capacitor values are given in micro-farads (u= x10 ), nano-farads (n= x10 ), or pico-farads (p= x10 ).

4. Capacitor values may also use the value multiplier as the decimal point indication (e.g. 2p2 indicates 2.2 pF).

5. An "asterisk" (*) indicates component usage varies. Refer to the diversity tables for the correct values.

6. The correct component values are listed in the Electrical Replacement Parts List. Therefore, always check this list when there is any doubt.

-9

-12

-6

2.3.3 Rework on BGA (Ball Grid Array) Ics

General Although (LF)BGA assembly yields are very high, there may still be a requirement for component rework. By rework, we mean the process of removing the component from the PWB and replacing it with a new component. If an (LF)BGA is removed from a PWB, the solder balls of the component are deformed drastically so the removed (LF)BGA has to be discarded.

Device Removal As is the case with any component that, it is essential when removing an (LF)BGA, the board, tracks, solder lands, or surrounding components are not damaged. To remove an(LF)BGA, the board must be uniformly heated to a temperature close to the reflow soldering temperature. A uniform temperature reduces the chance of warping the PWB.To do this, we recommend that the board is heated until it is certain that all the joints are molten. Then carefully pull the component off the board with a vacuum nozzle. For the appropriate temperature profiles, see the IC data sheet.

Area Preparation When the component has been removed, the vacant IC area must be cleaned before replacing the (LF)BGA.Removing an IC often leaves varying amounts of solder on the mounting lands. This excessive solder can be removed with either a solder sucker or solder wick. The remaining flux can be removed with a brush and cleaning agent.After the board is properly cleaned and inspected, apply flux on the solder lands and on the connection balls of the (LF)BGA. Note: Do not apply solder paste, as this has shown to result in problems during re-soldering.

Device Replacement

The last step in the repair process is to solder the new component on the board. Ideally, the (LF)BGAshould be aligned under a microscope or magnifying glass. If this is not possible, try to align the (LF)BGA with any board markers. To reflow the solder, apply a

temperature profile according to the IC data sheet. So as not to damage neighbouring components, it may be necessary to reduce some temperatures and times.

More Information

For more information on how to handle BGA devices, visit this

URL: (needs subscription,

www.atyourservice.ce.philips.com

not available for all regions). After login, "select Magazine", then go to "Workshop Information". Here you will find Information on how to deal with BGA-ICs.

2. Safety Instructions, Warnings and Notes

TPF1.4A LA

2.3.4 Lead Free Solder

Philips CE is going to produce lead-free sets (PBF) from

1.1.2005 onwards. Lead-free sets will be indicated by the PHILIPS-lead-free logo on the Printed Wiring Boards (PWB):

Fig 2-1 Lead-free logo

This sign normally has a diameter of 6 mm, but if there is less space on a board also 3 mm is possible. In case of doubt wether the board is lead-free or not (or with mixed technologies), you can use the following method:

1. Always use the highest temperature to solder, when using SAC305 (see also instructions below).

2. De-solder thoroughly (clean solder joints to avoid mix of two alloys).

Caution

which is coupled to the 12NC. For an overview of these profiles, visit the website (needs subscription, but is not available for all regions) You will find this and more technical information within the "Magazine", chapter "Workshop information". For additional questions please contact your local repairhelpdesk.

: For BGA-ICs, you must use the correct temperatureprofile,

www.atyourservice.ce.philips.com

2.3.5 Practical Service Precautions

It makes sense to avoid exposure to electrical shock.

While some sources are expected to have a possible dangerous impact, others of quite high potential are of limited current and are sometimes held in less regard.

2. While some may not be

Always respect voltages.

dangerous in themselves, they can cause unexpected reactions - reactions that are best avoided. Before reaching into a powered TV set, it is best to test the high voltage insulation. It is easy to do, and is a good service precaution.

Due to lead-free technology some rules have to be respected by the workshop during a repair:

1. Use only lead-free soldering tin . If lead-free solder paste is required,please contact the manufacturer of your soldering equipment. In general, use of solder paste within workshops should be avoided because paste is not easy to store and to handle.

2. Use only adequate solder tools applicable for lead-free soldering tin. The solder tool must be able

-To reach at least a solder-tip temperature of 400 C.

-To stabilise the adjusted temperature at the solder-tip.

-To exchange solder-tips for different applications.

3. Adjust your solder tool so that a temperature around 360 C

- 380 C is reached and stabilised at the solder joint. Heating time of the solder-joint should not exceed~4sec. Avoid temperatures above 400 C, otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips, switch "off" unused equipment or reduce heat.

4. Mix of lead-free soldering tin/parts with leaded soldering tin/parts is possible but PHILIPS recommends strongly to avoid mixed regimes. If not to avoid, clean carefully the solder-joint from old tin and re-solder with new tin.

5. Use only original spare-parts listed in the Service-Manuals. Not listed standard material (commodities) has to be purchased at external companies.

6. Special information for lead-free BGA ICs: these ICs will be delivered in so-called "dry-packaging" to protect the IC against moisture. This packaging may only be opened short before it is used (soldered). Otherwise the body of the IC gets "wet" inside and during the heating time the structure of the IC will be destroyed due to high (steam-) pressure inside the body. If the packaging was opened before usage, the IC has to be heated up for some hours (around 90C)fordrying (think of ESD-protection !).

Do not re-use BGAs at all!

7. For sets produced before 1.1.2005, containing leaded soldering tin and components, all needed spare parts will be available till the end of the service period. For the repair of such sets nothing changes.

TPF1.4A LA

3. Directions for Use

You can download this information from the following websites:

http://www.philips.com/support

http://www.p4c.philips.com

4. Mechanical Instructions

Index of this chapter:

4.1 Assy/Panel Removal

4.2 Set Re-assembly

4. Mechanical Instructions

TPF1.4A LA

4.1 Assy/Panel Removal

Front view

Back view

Step 1. Remove the stand.

Remove the three screws as Fig.3 and Fig.4

Fig.1

Fig.2

Fig.6

Fig.7

Fig.8

Fig.9

Fig.3

Step 2. Remove the Back cover and Main shield assy as Fig.5~12.

Remove the seven screws on the sides and the other

two screws as Fig.5

b. Use thin "I" type screwdriver to open 4 clicks on bottom

side as Fig.6

Use thin "I" type screwdriver to open 2 clicks on right side as Fig.7

e. Use thin "I" type screwdriver to open 2 clicks on left

side as Fig.8

f. Use thin "I" type screwdriver to open 6 clicks on top

side as Fig.9 g. Remove the back cover as Fig.10 . h. Remove the 15 screws as Fig.10,Fig.11,Fig.12 , then remove the

Main shield assy.

Fig.4

Fig. 10

Fig. 11

Fig. 12

Step 3. Remove the Scaler, HD and Power board.

Remove the 15 screws and disconnect the 10 cables as Fig. 13 and Fig.14

Fig.5

TPF1.4A LA

4. Mechanical Instructions

Fig. 17

Fig. 13

Fig. 18

Fig. 14

Step 4. Disconnect the HD PCB, the Side AV PCB, the KEY PCB , the

IR PCB, as Fig.15the Scaler PCB and power PCB

Fig. 15

Step 5 Remove the MAIN Frame ASSY as Fig.16~Fig.18

Remove the 19 screws and one connector as Fig.16~17

Step 6 Remove the Bezel assy as Fig.18~Fig.19

Remove the 8 screws

a. as Fig.18

Remove the Bezel assy

b . as Fig.19

Fig. 19

4.2 Set Re-assembly

To re-assemble the whole set, execute all processes in reverse order.

Notes:

a. While re-assembling, make sure that all cables are placed

and connected in their original position.

b. Pay special attention not to damage the EMC foams at the

SSB shielding. Check that EMC foams are put correctly on their places.

In warranty, it is not allowed to disassembly the LCD panel, even the

backlight unit defect.

Out of warranty, the replacment of backlight unit is a correct way

when the defect is cused by backlight (CCFL,Lamp).

Fig. 16

5. Aging and Factory Mode

TPF1.4A LA

index of this chapter:

5.1 Access Aging Mode

5.2 Access Factory Mode

Top Control

Volume

Left

Right

Channel

UpDown

Front Control

Power SW

<A>

LED

RC sensor

5.1 Access Aging Mode

Step1:D Step 2 :

quickly push"+"and"-"ofVolume ,and hold this two buttons

comes out " AGING screen"] => then release all buttons. Bring up:

After 52 seconds, bring up:

isconnect Interface Cable between Monitor and PC.

Turn off LCD monitor.Then press power " " button.Then

AGING...

untill

5.2 Access Factory Mode

1). Turn off monitor.

Press power " " button.Then quickly push"+"and"-"of

2).

Volume ,and hold this two buttons , then the screen comes out

"Waiting For Automatic Adjustment ",then the screen will be black

for one second untill comes out "Windows screen"] => then

release this two buttons.

3). Press "MENU" button, wait until the OSD menu with Characters "CHINA MAGNAVOX32 V0.2.0 051012 CLAA320WA01" (below OSD menu) come on the Screen of the monitor.

Factory Mode indicator

Factory Menu Cursor can move on gray color area Hot key function: at factory mode , press "MENU" button,then press "+"and"-"ofChannel to the factory mode indicator ,then press "+"ofVolume .Press the"+"and"-"ofChannel to "exit " and press "MENU" to exit factory adjust menu. (PS: The OffsetRGBfunction can be used on reduce or eliminate snowy noise on the background when the resolution of video signal is 1280*768 vertical 75Hz. Slightly increase or decrease the value until snowy noise completely disappear.

After 60 seconds, bring up:

AGING...

After 52 seconds, bring up:

----------

---------repeatly Connect Signal cable again=> go back to normal display

TPF1.4A LA

6. Block Diagram

Index of this chapter:

6.1

Wiring Diagram

6.2 Block Diagram

6.1 Wiring Diagram

6. Block Diagram

6.2 Block Diagram

6. Block Diagram

Architecture

Tuner

TPF1.4A LA

Inverter Board

(Panel)

S-F

Vcc,

Bright_ADJ

Inverter ON_OFF

PWR_SAVING

Tuner

1811

FQ1256

S-M

AV1-audio

AV3-audio

DVI audio

PC audio

HD YPbPr

S-G

Power Board

Mains

AV2-audio

HD-audio

MUX 7711

S-I

Scalar Board

SAA7119 +

MSP34X0 +

Columbus +

MST51512 +

TPA3008D2

Side AV Board

Block Diagram of Main Board

S-M

Sound

S-N

AUDIO delay

decoder

7714

MSP3410

DVI HDCP

PC D_SubTuner_CVBS

SDRAM 7523

M12L16161

S-B

DDC 7101

M24C02

S-C

DDC 7124

M24C02

S-J

MST51512L

Columbus

7522

T6TU5XB

Scalar

7403

Control Board

S-O

Audio AMP

7814

TPA3008D

32" TFT Panel

CLAA320WA01 C

Speaker

2X10W

HD Board

Panel

CLAA320WA01 C

Component_YPbPr

S-Video1/ S-Video2

AV1/AV2/AV3-CVBS

Video Decoder

7302

SAA7119

S-L

S-K

SDRAMx2 7411/7412

M12L16161

MCU

7502

NT68F632A

I&K

IR and Control Board

TPF1.4A LA

6. Block Diagram

Block Diagram of Power Supply

AC to DC GBU6J

EMI

FILTER

AC Inlet

AC Input 90 ~ 264V

PFC control

L6562 &

STP60NM60

PWM control

TEA1507P &

STP10NK80Z

Photo-coupler

TCET1103(G)

Protection &

feedback network

Transformer

EQ40

24V 2.5A

Inverter

AC to DC

STPS20H100

16V 2A Panel/scalar/Audio

AC to DC

MBRF10H100

180mm

10 pin s

AC/inlet

PCB Dimension(Back View)

Power

10 pin s

SDRAM

LVD S

control

MST51512

SDRAM

CPU

Main Board

Columbus

Scart 1

Audio AMP

HD wafer

MSP 34X0G

SDRAM

Scart 2DVI VGA

SAA5630

SAA7119

Tuner

145mm

Y/C

C V B S, Yp

Side AV wafer

bp r/L /R

130m m

DVI audio

PC audio

250mm

Scaler

MCU

6. Block Diagram

Scalar board

SDRAM

TPF1.4A LA

Comb

Decoder

Video

Audio

AMP

Decoder

Sound

SDRAM

Decoder

Tuner

TPF1.4A LA

Relay

6. Block Diagram

Power board

Diode

MOS MOS

Diode

Transformer

TEA1507

PFC

capacitor

Filter

Choke

Line

Bridge Diode

choke

Line

Index of this chapter:

7.1 Chassis Overview

7.2 Exploded View

7.3 Scaler Schematic Diagram & Layouts

7.4 Power Schematic Diagram & Layouts

7.5 SIDE AV Schematic Diagram & Layouts

7.6 HD PCB Schematic Diagram & Layouts

7.7 IR PCB Schematic Diagram & Layouts

7.8 KEY PCB Schematic Diagram & Layouts

7.1 Chassi Overview

7.Circuit Diagram & PWB Layouts

TPF1.4A LA

IR Board

Power Board

Key Board

HD Board

Side AV Board

Scaler Board

TPF1.4A LA

7.2 Exploded View

7. Circuit Diagrams and PWB Layouts

1052

0007 BASE ASSY

0040 BACK COVER

0041 CABLE COVER

MAIN FRAME

0051

ASSY(CPT)

0053 GASKET (50x30x15t)

0056 MAIN SHIELD ASSY

0091 CONTROL BUTTON

0105 SCR HI-LO

0107 NUT-AUDIO JACK

1051

1050 LCD CLAA320WA01 C

SCALER PCB

1051

ASSY(32TA)/CPT

1052 POWER PCB ASSY

1053 KEY BOARD ASSY

1054 IR PCB ASSY

1056 HD PCB ASSY(FL1-NA)

1056 HD PCB ASSY

7.3.1 Scaler Schematic Diagram - power

7.Circuit Diagrams and PWB Layouts

TPF 1.4A LA

S-A

7.3.2 Scaler Schematic Diagram - DVI HDCP IN

TPF 1.4A LA

7. Circuit Diagrams and PWB Layouts

S-B

7.3.3 Scaler Schematic Diagram - PC ANALOG IN

7. Circuit Diagrams and PWB Layouts

TPF 1.4A LA

S-C

7.3.4 Scaler Schematic Diagram - AV IN/OUT

TPF 1.4A LA

7. Circuit Diagrams and PWB Layouts

S-D

7.3.5 Scaler Schematic Diagram - SCART I/O

7. Circuit Diagrams and PWB Layouts

S-E

TPF 1.4A LA

7.3.6 Scaler Schematic Diagram - Tuner

TPF 1.4A LA

S-F

7.Circuit Diagrams and PWB Layouts

7.3.7 Scaler Schematic Diagram - VIDEO DECODER

S-G

7. Circuit Diagrams and PWB Layouts

TPF 1.4A LA

7.3.8 Scaler Schematic Diagram - T/T DECODER

TPF 1.4A LA

7. Circuit Diagrams and PWB Layouts

S-H

7.3.9 Scaler Schematic Diagram - COLUMBUS

7. Circuit Diagrams and PWB Layouts

S-I

TPF 1.4A LA

7.3.10 Scaler Schematic Diagram - SCALER MST551512L

TPF 1.4A LA

S-J

7. Circuit Diagrams and PWB Layouts

7.3.11 Scaler Schematic Diagram - SDRAM

7. Circuit Diagrams and PWB Layouts

S-K

TPF 1.4A LA

7.3.12 Scaler Schematic Diagram - SCALER MCU

TPF 1.4A LA

S-L

7. Circuit Diagrams and PWB Layouts

+ 63 hidden pages