Philips 2sk2223 DATASHEETS

2SK2223-01R
N-channel MOS-FET
C
FUJI ELECTRIC GmbH; Lyoner Straße 26; D-60528 Frankfurt; Tel: 069-66 90 29-0; Fax: 069-66 90 29-56
FAP-IIA Series
500V 0,76Ω 10A 80W
> Features > Outline Drawing
- High Speed Switching
- Low On-Resistance
- Low Driving Power
- High Voltage
GS = ± 30V Guarantee
- V
- Avalanche Proof
> Applications
- Switching Regulators
- UPS
- DC-DC converters
- General Purpose Power Amplifier
> Maximum Ratings and Characteristics > Equivalent Circuit
- Absolute Maximum Ratings (TC=25°C), unless otherwise specified
Item Symbol Rating Unit Drain-Source-Voltage V Drain-Gate-Voltage (RGS=20K) Continous Drain Current I Pulsed Drain Current I Gate-Source-Voltage V Max. Power Dissipation P Operating and Storage Temperature Range T
V
T
DS DGR D D(puls) GS D ch stg
-55 ~ +150 °C
500 V 500 V
10 A 40 A
±30 V
80 W
150 °C
Electrical Characteristics (T
-
=25°C), unless otherwise specified
Item Symbol Test conditions Min. Typ. Max. Unit Drain-Source Breakdown-Voltage V Gate Threshhold Voltage V Zero Gate Voltage Drain Current I
Gate Source Leakage Current I Drain Source On-State Resistance R Forward Transconductance g Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Turn-On-Time t
Turn-Off-Time t
(ton=t
on
d(on)+tr
off (ton=td(off)+tf
)
)
Avalanche Capability I Continous Reverse Drain Current I Pulsed Reverse Drain Current I Diode Forward On-Voltage V Reverse Recovery Time t Reverse Recovery Charge Q
(BR)DSSID GS(th) DSS
GSS DS(on) fs iss oss rss
t
d(on)
t
r
t
d(off)
t
f AV DR DRM SD rr rr
=1mA VGS=0V
ID=1mA V
DS=VGS
VDS=500V Tch=25°C V
=0V Tch=125°C
GS
VGS=±30V VDS=0V ID=5A VGS=10V ID=5A VDS=25V
VDS=25V
VGS=0V f=1MHz 35 50 pF
VCC=300V
ID=10A
VGS=10V
RGS=10
=25°C
L = 100µH
T
ch
TC=25°C TC=25°C
IF=2xIDR VGS=0V Tch=25°C
IF=IDR VGS=0V
-dIF/dt=100A/µs Tch=25°C
500 V
2,5 3,0 3,5 V
10 500 µA
0,2 1,0 mA
10 100 nA
0,6 0,76
5 10 S
1500 2200 pF
160 240 pF
15 25 ns 40 60 ns 70 100 ns 60 90 ns
10 A
10 A 40 A
1,12 1,7 V
450 ns
3 µC
- Thermal Characteristics Item Symbol Test conditions Min. Typ. Max. Unit Thermal Resistance R
R
th(ch-a) th(ch-c)
channel to air 30 °C/W channel to case 1,56 °C/W
N-channel MOS-FET
FAP-IIA Series
Typical Output Characteristics
Drain-Source-On-State Resistance vs. T
Typical Transfer Characteristics
Typical Drain-Source-On-State-Resistance vs. I
Typical Forward Transconductance vs. I
Gate Threshold Voltage vs. T
Typical Capacitance vs. V
Typical Input Charge
Forward Characteristics of Reverse Diode
Allowable Power Dissipation vs. T
Safe operation area
This specification is subject to change without notice!
500V 0,76Ω 10A 80W
> Characteristics
2SK2223-01R
ch
1 2 3
[A]
D
I
VDS [V]
4 5 6
]
[
DS(ON)
R
ID [A]
DS
]
[
DS(ON)
R
Tch [°C]
D
[S]
fs
g
ID [A]
D
[A]
D
I
[V]
GS(th)
V
VGS [V]
Tch [°C]
ch
7 8 9
C [nF]
VDS [V]
[V]
DS
V
Qg [nC]
C
[V]
GS
V
[A]
F
I
VSD [V]
[K/W]
th(ch-c)
Z
Transient Thermal impedance
10 12 11
[W]
D
P
Tc [°C]
[A]
D
I
VDS [V]
t [s]
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