Philips 2PD2150 User Manual

2PD2150

2PD2150

20 V, 3 A NPN low VCEsat (BISS) transistor

Rev. 01 — 22 April 2005

Product data sheet

 

 

 

 

 

 

1.Product profile

1.1General description

NPN low VCEsat Breakthrough in Small Signal (BISS) transistor in a SOT89 (SC-62/

TO-243) SMD plastic package.

PNP complement: 2PB1424.

1.2Features

Low collector-emitter saturation voltage VCEsat

High collector current capability: IC and ICM

High collector current gain (hFE) at high IC

High efficiency due to less heat generation

Smaller required Printed-Circuit Board (PCB) area than for conventional transistors

1.3Applications

DC-to-DC conversion

MOSFET gate driving

Motor control

Charging circuits

Power switches (e.g. motors, fans)

Thin Film Transistor (TFT) backlight inverter

1.4Quick reference data

Table 1:

Quick reference data

 

 

 

 

 

 

 

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

VCEO

collector-emitter voltage

open base

-

-

 

20

V

ICM

peak collector current

single pulse;

-

-

 

3

 

A

 

 

tp 1 ms

 

 

 

 

 

 

hFE

DC current gain

VCE = 2 V;

180

-

 

390

 

 

 

IC = 0.1 A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Philips Semiconductors

2PD2150

 

 

 

20 V, 3 A NPN low VCEsat (BISS) transistor

2. Pinning information

Table 2:

Pinning

 

 

 

 

 

Pin

Description

Simplified outline

Symbol

1

emitter

 

 

 

 

 

 

 

 

 

 

2

2

collector

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3

base

 

 

 

3

 

 

 

 

 

 

1

 

 

3

2

1

sym042

3. Ordering information

Table 3: Ordering information

Type number

Package

 

 

 

Name

Description

Version

2PD2150

SC-62

plastic surface mounted package; collector pad for

SOT89

 

 

good heat transfer; 3 leads

 

 

 

 

 

4. Marking

Table 4: Marking codes

Type number

Marking code

2PD2150

M2

 

 

9397 750 14987

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 01 — 22 April 2005

2 of 11

Philips Semiconductors

2PD2150

 

 

 

20 V, 3 A NPN low VCEsat (BISS) transistor

5. Limiting values

Table 5: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

 

Min

Max

Unit

VCBO

collector-base voltage

open emitter

 

-

40

V

VCEO

collector-emitter voltage

open base

 

-

20

V

VEBO

emitter-base voltage

open collector

 

-

5

V

IC

collector current (DC)

 

 

 

-

1

A

ICM

peak collector current

single pulse;

 

-

3

A

 

 

tp 1 ms

 

 

 

 

Ptot

total power dissipation

Tamb 25 °C

[1]

-

500

mW

 

 

 

 

 

[2]

-

850

mW

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

[3]

-

1200

mW

 

 

 

 

 

 

 

 

 

 

 

 

 

Tj

junction temperature

 

 

 

-

150

°C

Tamb

ambient temperature

 

 

 

65

+150

°C

Tstg

storage temperature

 

 

 

65

+150

°C

[1]Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.

[3]Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.

1600

 

 

 

 

 

 

006aaa449

 

 

 

 

 

 

 

 

Ptot

 

 

 

 

 

 

 

 

(mW)

 

 

 

 

 

 

 

 

1200

 

 

(1)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(2)

 

 

 

 

 

800

 

 

 

 

 

 

 

 

 

 

 

(3)

 

 

 

 

 

400

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

65

35

5

25

55

85

115

145

175

 

 

 

 

 

 

Tamb (°C)

(1)FR4 PCB; mounting pad for collector 6 cm2

(2)FR4 PCB; mounting pad for collector 1 cm2

(3)FR4 PCB; standard footprint

Fig 1. Power derating curves

9397 750 14987

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 01 — 22 April 2005

3 of 11

Philips 2PD2150 User Manual

Philips Semiconductors

2PD2150

 

 

 

20 V, 3 A NPN low VCEsat (BISS) transistor

6. Thermal characteristics

Table 6:

Thermal characteristics

 

 

 

 

 

 

 

Symbol

Parameter

Conditions

 

Min

Typ

Max

Unit

Rth(j-a)

thermal resistance from

in free air

[1]

-

-

250

K/W

 

 

junction to ambient

 

 

 

 

 

 

 

 

 

 

[2]

-

-

147

K/W

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

[3]

-

-

104

K/W

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Rth(j-sp)

thermal resistance from

 

 

 

-

-

20

K/W

 

junction to solder point

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

[1]Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.

[3]Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 m2.

103

006aaa450

 

 

Zth(j-a)

(K/W)

duty cycle =

 

 

 

 

 

 

 

 

102

1.00

 

 

 

 

 

 

 

 

0.75

 

 

 

 

 

 

 

 

 

0.50

 

 

 

 

 

 

 

 

 

0.33

 

 

 

 

 

 

 

 

 

0.20

 

 

 

 

 

 

 

 

10

0.10

 

 

 

 

 

 

 

 

 

0.05

 

 

 

 

 

 

 

 

 

0.02

 

 

 

 

 

 

 

 

1

0.01

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.00

 

 

 

 

 

 

 

 

101

 

104

103

102

101

 

 

102

103

105

1

10

 

 

 

 

 

 

 

 

 

tp (s)

FR4 PCB; mounting pad for collector 1 cm2

Fig 2. Transient thermal impedance from junction to ambient as a function of pulse time; typical values

9397 750 14987

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 01 — 22 April 2005

4 of 11

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