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1PS10SB82
Schottky barrier diode
Product specification 2003 Aug 20
Philips Semiconductors Product specification
Schottky barrier diode 1PS10SB82
FEATURES
• Low forward voltage
• Low diode capacitance
• Leadless ultra small plastic package
DESCRIPTION
An epitaxial Schottky barrier diode encapsulated in a
SOD882 leadless ultra small plastic package.
ESD sensitive device, observe handling precautions.
(1.0 mm × 0.6 mm × 0.5 mm)
• Boardspace 1.17 mm2 (approx. 10% of SOT23)
• Power dissipation comparable to SOT23.
handbook, halfpage
APPLICATIONS
• UHF mixers
Bottom view
MDB391
• Sampling circuits
• Modulators
• Phase detectors
• Mobilecommunication,digital(still)cameras,PDA’sand
PCMCIA cards.
Marking code: S5.
The marking bar indicates the cathode.
Fig.1 Simplified outline (SOD882), pin
configuration and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER MIN. MAX. UNIT
V
R
I
F
T
stg
T
j
continuous reverse voltage − 15 V
continuous forward current − 30 mA
storage temperature −65 +150 °C
junction temperature − 150 °C
2003 Aug 20 2
Philips Semiconductors Product specification
Schottky barrier diode 1PS10SB82
ELECTRICAL CHARACTERISTICS
T
=25°C unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
V
F
r
D
I
R
C
d
Note
1. Pulse test: t
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
forward voltage see Fig.2
I
=1mA − 340 mV
F
I
=30mA − 700 mV
F
differential diode forward resistance f = 1 MHz; IF= 5 mA; see Fig.5 12 −Ω
continuous reverse current VR= 1 V; see Fig.3; note 1 − 0.2 µA
diode capacitance VR= 0 V; f = 1 MHz; see Fig.4 1 − pF
= 300 µs; δ = 0.02.
p
thermal resistance from junction to ambient note 1 500 K/W
Note
1. Refer to SOD882 standard mounting conditions (footprint), FR4 with 60 µm copper strip line.
Soldering
Reflow soldering is the only recommended soldering method.
2003 Aug 20 3
Philips Semiconductors Product specification
Schottky barrier diode 1PS10SB82
GRAPHICAL DATA
3
10
handbook, halfpage
I
F
MLE112
(mA)
2
10
(1) (3)
(2)
10
(1)
(2)
(3)
(1) T
(2) T
(3) T
1
amb
amb
amb
= 125 °C.
=85°C.
=25°C.
0.4 0.8 1.2
VF (V)
Fig.2 Forward current as a function of forward
voltage; typical values.
3
10
handbook, halfpage
I
R
MLE113
(µA)
2
10
(1)
10
(2)
1
−1
10
−2
1.60
10
(1) T
(2) T
(3) T
amb
amb
amb
(3)
= 125 °C.
=85°C.
=25°C.
50
VR (V)
1510
Fig.3 Reverse current as a function of reverse
voltage; typical values.
1.2
handbook, halfpage
C
d
MLE114
(pF)
1
0.8
0.6
0.4
02 10
f = 1 MHz; T
amb
=25°C.
4
68
VR (V)
Fig.4 Diode capacitance as a function of reverse
voltage; typical values.
3
10
handbook, halfpage
r
D
MLE115
(Ω)
2
10
10
1
−1
10
f = 1 MHz; T
amb
1
=25°C.
10 10
IF (mA)
Fig.5 Differential diode forward resistance as a
function of forward current; typical values.
2
2003 Aug 20 4
Philips Semiconductors Product specification
Schottky barrier diode 1PS10SB82
PACKAGE OUTLINE
Leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm SOD882
L
1
e
1
E
L
2
b
A
A
1
(2)
DIMENSIONS (mm are the original dimensions)
A
(1)
UNIT
A
0.50
mm
0.46
Notes
1. Including plating thickness
2. The marking bar indicates the cathode
OUTLINE
VERSION
SOD882
1
be
max.
0.03
DE
0.55
0.62
1.02
0.47
0.55
IEC JEDEC JEITA
0.95
0.65
L
1
0.30
0.22
REFERENCES
2003 Aug 20 5
D
0 0.5 1 mm
scale
EUROPEAN
PROJECTION
ISSUE DATE
03-04-16
03-04-17
Philips Semiconductors Product specification
Schottky barrier diode 1PS10SB82
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
I Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers,the highest-levelproduct status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or at any otherconditionsabove those given inthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarranty that such applications will be
suitable for the specified use without further testing or
modification.
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result inpersonal injury. Philips
Semiconductorscustomersusingor selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. Whenthe product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2003 Aug 20 6
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands 613514/01/pp7 Date of release: 2003 Aug 20 Document order number: 9397 750 11309
SCA75
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