• Six copies PCI clock (synchronous with CPU clock) 3.3V
• One copy of Ref. clock @ 14.31818 MHz (3.3V
• 48 MHz USB Clock, 24 MHz Super I/O clock
2
• I
C Serial Configuration Interface
• Spread Spectrum Modulation for CPUCLK, and PCICLK
• Low-cost 14.31818 MHz crystal oscillator input
• Power management control
• Isolated core V
, VSS pins for noise reduction
DD
• 28-pin SSOP and SOIC package (H)
of 2.5V ±5%
DD
TTL
)
Block Diagram
Description
The PI6C105 is a high-speed, low-noise clock generator designed
to work with the PI6C18x family of clock buffers to meet all clock
needs for Mobile Intel Architecture platforms. CPU and chipset
clock frequencies of 66.6 MHz and 100 MHz are supported.
Split supplies of 3.3V and 2.5V are used. The 3.3V power supply
powers a portion of the I/O and the core. The 2.5V is used to power
the remaining outputs. 2.5V signaling follows JEDEC standard
8-X. Power sequencing of the 3.3V and 2.5V supplies is not
required.
An asynchronous PWR_DWN# signal may be used to power down
(or up) the system in an orderly manner.
The I2C interface permits individual enable/disable of each clock
output and test mode enable.
The PI6C105 is a slave receiver device. It can not be read back.
Sub addressing is not supported. To change one of the control
bytes, all preceding bytes must be sent.
Every byte put on the SDATA line must be 8-bits long (MSB first),
followed by an acknowledge bit generated by the receiving device.
During normal data transfers, SDATA changes only when SCLK is
LOW. Exceptions: A HIGH-to-LOW transition on SDATA while
SCLK is HIGH indicates a start condition. A LOW-to-HIGH
transition on SDATA, while SCLK is HIGH, is a stop condition
and indicates the end of a data transfer cycle.
PI6C105 I2C Address Assignment
7A6A5A4A3A2A1A0A
11010010
Each data transfer is initiated with a start condition and ended
with a stop condition. The first byte after a start condition is always
a 7-bit address byte followed by a read/write bit. (HIGH = read
from addressed device, LOW= write to addressed device). If the
devices own address is detected, PI6C105 generates an acknowledge by pulling SDATA line LOW during ninth clock pulse, then
accepts the following data bytes until another start or stop condition is detected.
Following acknowledgment of the address byte (D2), two more
bytes must be sent:
1. Command Code byte, and
2. Byte Count byte.
Although the data bits on these two bytes are dont care, they
must be sent and acknowledged.
1. Clock on/off latency is defined as the number of rising edges of free running PCICLKs
between when the clock disable goes low/high to when the first valid clock comes out of
the device.
2. Power-up latency is from when PWR_DWN# goes inactive (HIGH) to when the first valid
clocks are driven from the device.
CPU_STOP#, which is an input signal used to turn off the CPU
clocks for low power operation, is asserted asynchronously by the
external clock control logic with the rising edge of the free running
PCI clock and is internally synchronized to the external PCICLK_F
disabled. The CPU clocks are always stopped in a low state and
started guaranteeing that the high pulse width is a full pulse. CPU
clock on latency is 2 or 3 CPU clocks while the CPU clock off
latency is 2 or 3 CPU clocks.
output. All other clocks continue to run while the CPU clocks are
CPUCLK
(Internal)
CPUCLK
(Internal)
PCICLK_F
(Free-running)
CPU_STOP#
PCI_STOP#
PWR_DWN#
CPUCLK
External
Notes:
1. All timing is referenced to the CPUCLK.
2. The Internal label means inside the chip and is a reference only. This in fact may not be the way that the
control is designed.
3 CPU_STOP# is an input signal that must be made synchronous to the free running PCI_F.
4. ON/OFF latency shown in the diagram is 2 CPU clocks.
5. All other clocks continue to run undisturbed.
6. PWR_DWN# PCI_STOP# are shown in a high state.
7. Diagrams shown with respect to 66 MHz. Similar operation as CPU = 100 MHz.
CPU_STOP# Timing Diagram
PCI_STOP# is an input signal used to turn off the PCI clocks for low power operation. PCI clocks are stopped in the low state and started
with a guaranteed full high pulse width. There is ONLY one rising edge of external PCICLK after the clock control logic.
CPUCLK
(Internal)
PCICLK
(Internal)
PCICLK_F
(Free-running)
CPU_STOP#
PCI_STOP#
PWR_DWN#
PCICLK
External
Notes:
1. All timing is referenced to the CPUCLK.
2. PCI_STOP# signal is an input signal which must be made synchronous to PCI_F output.
3 Internal means inside the chip.
4. All other clocks continiue to run undisturbed.
5. PWR_DWN# CPU_STOP# are shown in a high state.
6. Diagrams shown with respect to 66 MHz. Similar operation as CPU = 100 MHz.
The PWR_DWN#, which is used to place the device in a very low
power state, is an asynchronous active low input. Internal clocks
are stopped after the device is put in power down mode.
CPUCLK
(Internal)
PCICLK
(Internal)
PWR_DWN#
CPUCLK
(External)
PCICLK
(External)
VCO
Crystal
Notes:
PWR_DWN# Timing Diagram
The power on latency is less than 3ms. PCI_STOP# and
CPU_STOP# are “don’t cares” during the power down operations.
The REF clock is stopped in the LOW state as soon as possible.
1. All timing is referenced to the CPUCLK.
2. The Internal label means inside the chip and is a reference only.
3. PWR_DWN# is an asynchronous input and metastable conditions could exist. The signal is synchronized inside the part.
4. The Shaded sections on the VCO and the Crystal signals indicate an active clock.
5. Diagrams shown wth respect to 66 MHz. Similar operations as CPU = 100 MHz.
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ............................................................65°C to +150°C
Ambient Temperature with Power Applied ............................. 0°C to +70°C
3.3V Supply Voltage to Ground Potential ............................. 0.5V to +4.6V
2.5V Supply Voltage to Ground Potential ............................. 0.5V to +3.6V
DC Input Voltage ................................................................... 0.5V to +4.6V
DC Electrical Characteristics (T
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Note:
Stresses greater than those listed under MAXIMUM
RATINGS may cause permanent damage to the device.
This is a stress rating only and functional operation of the
device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
1. Maximum rise/fall times are guaranteed at maximum specified load for each type of output buffer.
2. Minimum rise/fall times are guaranteed at minimum specified load for each type of output buffer.
3. Rise/fall times are specified with pure capacitive load as shown. Testing is done with an
additional 500Ω resistor in parallel.
Design Guidelines to Reduce EMI
1. Place series resistors and CI capacitors as close as possible to the respective clock pins. Typical value
for CI is 10pF. RS Series resistor value can be increased to reduce EMI provided that the rise and fall time
are still within the specified values.
2. Minimize the number of vias of the clock traces.
3. Route clock traces over a continuous ground plane or over a continuous power plane. Avoid routing clock
traces from plane to plane (refer to rule #2).
4. Position clock signals away from signals that go to any cables or any external connectors.
This is only a suggested layout. There may be alternate solutions
depending on actual PCB design and layout.
As a general rule, C2-C6 should be placed as close as possible to
their respective VDD.