Peiker acustic V1140 101 1 Users Manual
User manual
LTE-NAD V1140-10x-1
Peiker product IDs: 2189-140-133-00 (V1140-103-1)
2189-140-170-00 (V1140-100-1)
2189-140-174-00 (V1140-104-1)
2189-140-176-00 (V1140-106-1)
2189-140-181-00 (V1140-101-1)
Revision: 1.3
Date: March 2016
Status: Release
_______________________________________________________________________________________________________________ Seite 1
peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897
phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369
Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe
Date
Revision
Name
Comment
30.11.2015
1.0
Phse
Initial document based on V1140-xxx documents
12.01.2016
1.1
Phse
Added some missing Product IDs on the cover page
Corrected the FCC ID and IC ID of V1140-103-1 in section 8.3
20.01.2016
1.2
Phse
Removed LTE B8 support for V1140-100-1
22.03.2016
1.3
Phse
Updated sections 2.3 and 8.3
History:
_______________________________________________________________________________________________________________ Seite 2
peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897
phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369
Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe
Content
1 Introduction .......................................................................................................................................... 4
1.1 Scope .................................................................................................................................................. 4
1.2 Audience ............................................................................................................................................ 4
1.3 Contact information, Support ......................................................................................................... 4
1.4 Related Documents .......................................................................................................................... 4
2 Overview ............................................................................................................................................... 5
2.1 Product Variants................................................................................................................................ 5
2.2 Features ............................................................................................................................................. 6
2.3 Approvals ........................................................................................................................................... 6
3 Overview ............................................................................................................................................... 7
3.1 HW Features ...................................................................................................................................... 7
3.2 Connectors ......................................................................................................................................... 7
3.2.1 Module Signal and RF Connectors .......................................................................................... 7
3.2.2 Ground and Heat Dissipation Connectors.............................................................................. 7
3.3 Main Interfaces ................................................................................................................................. 8
3.3.1 USB .............................................................................................................................................. 8
3.3.2 SIM Interface ............................................................................................................................. 8
3.3.3 Power on ..................................................................................................................................... 8
3.3.4 Reset ........................................................................................................................................... 8
3.3.5 GPIOs .......................................................................................................................................... 9
3.3.6 GSBIs ........................................................................................................................................... 9
3.3.7 Module Pin-out ......................................................................................................................... 10
3.4 Supply Voltage ................................................................................................................................ 14
3.5 Power Consumption ....................................................................................................................... 14
3.8 Environmental Specification .......................................................................................................... 15
3.8.1 Temperature Range ................................................................................................................ 15
4 Evaluation Kit ..................................................................................................................................... 16
5 AT Command interface ..................................................................................................................... 19
6 Safety Recommendations according to EN60950-1 ..................................................................... 21
7 List of Acronyms ................................................................................................................................ 22
8 Regulatory Certifications .................................................................................................................. 23
8.1 USA (FCC)
8.2 Canada (IC)
8.3 OEM Responsibilities
........................................................................................................................................ 23
..................................................................................................................................... 23
...................................................................................................................... 24
_______________________________________________________________________________________________________________ Seite 3
peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897
phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369
Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe
1 Introduction
1.1 Scope
This document gives an overview about electrical, mechanical and functional detail of the peiker LTENAD V1140-10x-1 modules.
1.2 Audience
Information to integrate the module in other applications.
1.3 Contact information, Support
peiker acustic GmbH & Co KG
Max-Planck Street 32
D-61381 Friedrichsdorf / Ts.
Germany
http://www.peiker.de
info@peiker.de
1.4 Related Documents
None.
_______________________________________________________________________________________________________________ Seite 4
peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897
phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369
Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe
2 Overview
2.1 Product Variants
LTE-NAD module is available in multiple variants:
Peiker product # Module configuration
2189-140-170-00 (V1140-100-1) LTE EU configuration
2189-140-181-00 (V1140-101-1) LTE North America configuration
2189-140-133-00 (V1140-103-1) 2G/3G EU/RoW configuration
2189-140-154-00 (V1140-104-1) LTE Asia Pacific configuration
2189-140-176-00 (V1140-106-1) 2G/3G China configuration
V1140-100-1
GSM Bands 900MHz and 1800MHz
WCDMA Bands FDD1 and FDD8
LTE Bands eFDD3, eFDD7 and eFDD20
V1140-101-1
GSM Bands 850MHz and 1900MHz
WCDMA Bands FDD2 and FDD5
LTE Bands eFDD2, eFDD4, eFDD5 and eFDD17
V1140-103-1
GSM Bands 850MHz, 900MHz, 1800MHz and 1900MHz
WCDMA Bands FDD1, FDD2, FDD5, FDD6 and FDD8
LTE Bands No LTE support
V1140-104-1
GSM Bands 850MHz, 900MHz, 1800MHz and 1900MHz
WCDMA Bands FDD1, FDD5, FDD6 and FDD8
LTE Bands eFDD1, eFDD3, eFDD5, eFDD7 and eFDD19
V1140-106-1
GSM Bands 900MHz and 1800MHz
WCDMA Bands FDD1
LTE Bands No LTE support
_______________________________________________________________________________________________________________ Seite 5
phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369
peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897
Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe
GCF
R&TTE
PTCRB
FCC/IC
AT&T
MNO Approval
V1140-100-1
Planned
Planned
V1140-101-1
Planned
Planned
Planned
V1140-103-1
Planned
Planned
Planned
V1140-104-1
Planned
Planned
V1140-106-1
Planned
2.2 Features
Features
- Same footprint and pin-out for all modules
- Voice and data calls are supported in all modules
- GSM (R99, GPRS and EDGE) for all modules
- WCDMA (R99, R5 HSDPA, R6 HSUPA and R7 HSPA+) for all modules
- WCDMA (R8 DC-HSPA+) for all modules except for V1140-101-1
- LTE (Rel.9 Cat3 FDD) for LTE capable modules
- DTM/eDTM
- eCall inband modem
- Standalone GPS/GALILEO/GLONASS, A-GPS CP (MS-Assisted and MS-Based)
- IMS/VoLTE supported by V1140-101-1 only
Data rates
- GSM: DL/UL – 14.4kbps / 14.4kbps
GPRS: Multislot class 12, DL/UL – 85.6kbps / 42.8kbps
EDGE: Multislot class 12, DL/UL – 236.8kbps / 118.4kbps
- WCDMA: DL/UL up to 384kbps
HSPA+:
Category 24 in DL using 64 QAM and Dual-Cell; Up to 42 Mbps – Not supported by
V1140-101-1
Category 14 in DL using 64 QAM; Up to 21 Mbps
Category 6 in UL using 16 QAM; Up to 5.76 Mbps
- LTE-FDD Category 3: Up to 100 Mbps in DL, up to 50 Mbps in UL
Power Classes
- LTE: All supported bands, Power Class 3
- WCDMA: All supported bands, Power Class 3
- EDGE: 850/900/1800/1900, Power Class E2
- GSM/GPRS: 850/900, Power Class 4
- GSM/GPRS: 1800/1900, Power Class 1
Dimension and Weight
- Dimensions: 31mm x 46mm x 4mm
- Weight < 10 grams
2.3 Approvals
_______________________________________________________________________________________________________________ Seite 6
phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369
peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897
Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe
3 Overview
3.1 HW Features
- Qualcomm SoC (system on chip)
MDM9215 Baseband / PMIC8018 Power management / WTR1605L
- Cortex A5 Core up to 550 MHz
- 3 DSPs for modem and low power audio sub systems
- RPM Resource and power manager
- 2Gb NAND Flash x16,
- 2Gb Low Power Mobile DDR SDRAM x32
- 19.2MHz clock reference
- Dedicated heat sink in center area underneath the PCB
- GPS/GLONASS operation, GPS antenna biasing and diagnostics
3.2 Connectors
3.2.1 Module Signal and RF Connectors
The LTE-NAD has 172 signal pins (2xAA and 2xBB) connector pads with 1.0mm pitch. The signal pads
are located close to the board edges.
There are three antenna pads, each collocated by RF GND connectors
- Main transmit and receive antenna – pin LGA_PRX_ANT
- Diversity antenna for WCDMA respective MIMO antenna for LTE – pin LGA_DRX_ANT_IN
- GNSS antenna for both GPS and GLONASS – pin LGA_GPS_DRX_ANT
3.2.2 Ground and Heat Dissipation Connectors
To support the usage of module under complicated thermal conditions, there are a number of large
grounded pads in the center of PCB. These pads are dedicated ground pads to transfer heat dissipation
to a carrier board.
This should be especially considered by customer designs. A reference design showing landing patterns
and PCB stack-up is available on request.
_______________________________________________________________________________________________________________ Seite 7
peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897
phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369
Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe
3.3 Main Interfaces
3.3.1 USB
The NAD has one USB2.0 OTG high speed (480MBit) compliant interface including the PHY. The IF
consists of 5 signals:
- USB_D_P: USB Data Plus signal
- USB_D_M: USB Data Minus signal
- USB_ID: Master/Slave Configuration1
- USB_VBUS: USB Voltage Supply
- VREG_USB3_3V075 USB Voltage Output
A dynamic reconfiguration between USB-Host or USB-Device is not foreseen, the NAD can be configured
to USB-Host or USB-Device by the insertion of a resistor on the USB_ID line.
3.3.2 SIM Interface
The NADs SIM interface is compatible to 1.8V and 3V SIM Cards, the necessary voltage and level shifting
is handle by LTE-NAD automatically. The IF consists of the following signals:
VREG_USIM
USIM_CLK
USIM_DATA
USIM_RESET
The data speed on the SIM IF is up to 4 Mbps, so HW designers should take care of the length and
routing of the SIM IF to prevent potential EMC problems.
3.3.3 Power on
The signal PON_N is used switch on the NAD-Module. PON_N is pulled against VMAIN on the
LTE-NAD internally.
Due to this fact it is recommended to pull this input against GND using an open collector or
open drain output only.
3.3.4 Reset
EXT_RESIN_N is used to reset the LTE-NAD-Module, see table of LTE-NAD signal pins.
There are further reset signals available, please check.
1
The LTE-NAD is configured in the slave mode. For other configuration of the USB – Interface please contact
peiker acustic GmbH & Co.KG.
_______________________________________________________________________________________________________________ Seite 8
peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897
phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369
Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe
Loading...