Peiker acustic V1140-101, V1140-103 User Manual

User manual

LTE-NAD V1140-xxx

Peiker product ID: 2189-140-xxx-00 (V1140-xxx)

Revision: 0.9
Date: June 2014

Status: Draft

_______________________________________________________________________________________________________________ Seite 1

peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897

phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369

Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe

Date

Revision

Name

Comment

15.09.2013

0.5

wlo

Initial document

13.12.2013

0.6

phse

Some additions to sections 2.1 and 3.3
Some corrections to section 2.2, Figure 4 updated

16.12.2013

0.7

phse

Some additions to section 8

01.04.2014

0.8

phse

Modifications/additions to section 8

17.06.2014

0.9

phse

Updated Max Antenna Gain Values in section 8.3

History:

_______________________________________________________________________________________________________________ Seite 2

peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897

phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369

Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe

Content

1 Introduction .......................................................................................................................................... 4

1.1 Scope .................................................................................................................................................. 4

1.2 Audience ............................................................................................................................................ 4

1.3 Contact information, Support ......................................................................................................... 4

1.4 Related Documents .......................................................................................................................... 4

2 Overview ............................................................................................................................................... 5

2.1 Product Variants................................................................................................................................ 5

2.2 Features ............................................................................................................................................. 6

2.3 Approvals ........................................................................................................................................... 6

3 Overview ............................................................................................................................................... 7

3.1 HW Features ...................................................................................................................................... 7

3.2 Connectors ......................................................................................................................................... 7

3.2.1 Module Signal and RF Connectors .......................................................................................... 7

3.2.2 Ground and Heat Dissipation Connectors.............................................................................. 7

3.3 Main Interfaces ................................................................................................................................. 7

3.3.1 USB .............................................................................................................................................. 7

3.3.2 SIM Interface ............................................................................................................................. 8

3.3.3 Power on ..................................................................................................................................... 8

3.3.4 Reset ........................................................................................................................................... 8

3.3.5 GPIOs .......................................................................................................................................... 8

3.3.6 GSBIs ........................................................................................................................................... 9

3.3.7 Module Pin-out ......................................................................................................................... 10

3.4 Supply Voltage ................................................................................................................................ 14

3.5 Power Consumption ....................................................................................................................... 14

3.6 Transmitter ...................................................................................................................................... 15

3.7 Receiver ........................................................................................................................................... 15

3.8 Environmental Specification .......................................................................................................... 15

3.8.1 Temperature Range ................................................................................................................ 15

4 Evaluation Kit ..................................................................................................................................... 16

5 AT Command interface ..................................................................................................................... 19

6 Safety Recommendations according to EN60950-1 ..................................................................... 21

7 List of Acronyms ................................................................................................................................ 22

8 Regulatory Certifications .................................................................................................................. 23

8.1 USA (FCC)

............................................................................................................................................ 23

_______________________________________________________________________________________________________________ Seite 3

peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897

phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369

Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe

1 Introduction

1.1 Scope

This document gives an overview about electrical, mechanical and functional detail of the peiker LTE­NAD v1140-xxx.

1.2 Audience

Information to integrate the module in other applications.

1.3 Contact information, Support

peiker acustic GmbH & Co KG
Max-Planck Street 32
D-61381 Friedrichsdorf / Ts.
Germany

http://www.peiker.de
[e-mail]

1.4 Related Documents

None.

_______________________________________________________________________________________________________________ Seite 4

peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897

phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369

Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe

2 Overview

2.1 Product Variants

The LTE-NAD is available in multiple product variants:

Peiker product # Module configuration

2189-140-100-00 (V1140-100) LTE EU configuration
2189-140-101-00 (V1140-101) LTE North America configuration
2189-140-103-00 (V1140-103) 2G/3G EU/RoW configuration
2189-140-104-00 (V1140-104) LTE Asia Pacific configuration
2189-140-105-00 (V1140-105) 2G/3G North America configuration
2189-140-106-00 (V1140-106) 2G/3G China configuration

All variants include Quad band GSM/GPRS/EDGE (850, 900, 1800, 1900 MHz)

V1140-100

LTE Bands B3, B7, B20
WCDMA Bands FDD1, FDD8

V1140-101

LTE Bands B2, B4, B5, B17
WCDMA Bands FDD2, FDD5

V1140-103

LTE Bands No LTE support
WCDMA Bands FDD1, FDD2, FDD5, FDD6, FDD8

V1140-104

LTE Bands B1, B3, B5, B7, B19
WCDMA Bands FDD1, FDD5, FDD6, FDD8

V1140-105

LTE Bands No LTE support
WCDMA Bands FDD2, FDD5

V1140-106

LTE Bands No LTE support
WCDMA Bands FDD1

_______________________________________________________________________________________________________________ Seite 5

peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897

phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369

Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe

2.2 Features

Features

- Same footprint and pin-out for all modules

- Voice and data calls are supported in all modules

- GSM (R99, GPRS and EDGE) for all modules

- WCDMA (R99, R5 HSDPA, R6 HSUPA and R7 HSPA+) for all modules

- WCDMA (R8 DC-HSPA+) for all modules except for V1140-101 and V1140-105

- LTE (Rel.9 Cat3 FDD) for LTE capable modules

- DTM/eDTM

- eCall inband modem

- Standalone GPS, GLONASS, AGPS (MS-Assisted and MS-Based)

Data rates

- GSM: DL/UL – 14.4kbps / 14.4kbps

GPRS: Multislot class 12, DL/UL – 85.6kbps / 42.8kbps
EDGE: Multislot class 12, DL/UL – 236.8kbps / 118.4kbps

- WCDMA: DL/UL up to 384kbps

HSPA+:

Category 24 in DL using 64 QAM and Dual-Cell; Up to 42 Mbps – Not supported by
V1140-101 and V1140-105
Category 14 in DL using 64 QAM; Up to 21 Mbps
Category 6 in UL using 16 QAM; Up to 5.76 Mbps

- LTE-FDD Category 3: Up to 100 Mbps in DL, up to 50 Mbps in UL

Power Classes

- LTE: All supported bands, Power Class 3

- WCDMA: All supported bands, Power Class 3

- EDGE: 850 MHz / 900 MHz / 1800 MHz/ 1900MHz, Power Class E2

- GSM / GPRS: 850 MHz / 900MHz, Power Class 4

- GSM / GPRS: 1800 MHz / 1900MHz, Power Class 1

Dimension and Weight

- Dimensions: 31mm x 46mm x 4mm

- Weight < 10 grams

2.3 Approvals

- R&TTE directive

- CE, GCF

- FCC, IC, PTCRB

- AT&T

_______________________________________________________________________________________________________________ Seite 6

peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897

phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369

Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe

3 Overview

3.1 HW Features

- Qualcomm SoC (system on chip)
o LTE capable modules V1140-100, V1140-101 and V1140-104

MDM9215 Baseband / PMIC8018 Power management / WTR1605L

o Non-LTE modules V1140-103, V1140-105 and V1140-106

MDM8215 Baseband / PMIC8018 Power management / WTR1605

- Cortex A5 Core up to 550 MHz

- 3 DSPs for modem and low power audio sub systems

- RPM Resource and power manager

- 2Gb NAND Flash x16,

- 2Gb Low Power Mobile DDR SDRAM x32

- 19.2MHz clock reference

- Dedicated heat sink in center area underneath the PCB

- GPS/GLONASS operation, GPS antenna biasing and diagnostics

3.2 Connectors

3.2.1 Module Signal and RF Connectors

The LTE-NAD has 172 signal pins (2xAA and 2xBB) connector pads with 1.0mm pitch. The signal pads
are located close to the board edges.

There are three antenna pads, each collocated by RF GND connectors

- Main transmit and receive antenna – pin LGA_PRX_ANT

- Diversity antenna for WCDMA respective MIMO antenna for LTE – pin LGA_DRX_ANT_IN

- GNSS antenna for both GPS and GLONASS – pin LGA_GPS_DRX_ANT

3.2.2 Ground and Heat Dissipation Connectors

To support the usage of module under complicated thermal conditions, there are a number of large
grounded pads in the center of PCB. These pads are dedicated ground pads to transfer heat dissipation
to a carrier board.

This should be especially considered by customer designs. A reference design showing landing patterns
and PCB stack-up is available on request.

3.3 Main Interfaces

3.3.1 USB

The NAD has one USB2.0 OTG high speed (480MBit) compliant interface including the PHY. The IF
consists of 5 signals:

_______________________________________________________________________________________________________________ Seite 7

peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897

phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369

Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe

- USB_D_P: USB Data Plus signal

- USB_D_M: USB Data Minus signal

- USB_ID: Master/Slave Configuration1

- USB_VBUS: USB Voltage Supply

- VREG_USB3_3V075 USB Voltage Output

A dynamic reconfiguration between USB-Host or USB-Device is not foreseen, the NAD can be configured

to USB-Host or USB-Device by the insertion of a resistor on the USB_ID line.

3.3.2 SIM Interface

The NADs SIM interface is compatible to 1.8V and 3V SIM Cards, the necessary voltage and level shifting
is handle by LTE-NAD automatically. The IF consists of the following signals:

VREG_USIM
USIM_CLK
USIM_DATA
USIM_RESET

The data speed on the SIM IF is up to 4 Mbps, so HW designers should take care of the length and
routing of the SIM IF to prevent potential EMC problems.

3.3.3 Power on

The signal PON_N is used switch on the NAD-Module. PON_N is pulled against VMAIN on the
LTE-NAD internally.

Due to this fact it is recommended to pull this input against GND using an open collector or
open drain output only.

3.3.4 Reset

EXT_RESIN_N is used to reset the LTE-NAD-Module, see table of LTE-NAD signal pins.
There are further reset signals available, please check .

RES_IN is pulled against VMAIN power on the LTE-NAD internally. Therefore, it is
recommended to pull this input against GND using an open collector or open drain output only.

3.3.5 GPIOs

1

The LTE-NAD is configured in the slave mode. For other configuration of the USB – Interface please contact

peiker acustic GmbH & Co.KG.

_______________________________________________________________________________________________________________ Seite 8

peiker acustic GmbH & Co. KG, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897

phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369

Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer Ein Unternehmen der peiker Firmengruppe