Photon Datasheet
Mode l numbe r: PHOTONH
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Photon Dat asheet v011
Contents
Photon Dat asheet
Contents
1. Functional description
1.1 Overview
1.2 Features
2. Interf aces
2.1 Po wer
2.2 RF
2.3 FCC Approved Antennas
2.4 Peripherals and GPIO
2.5 JTAG
2.6 External Coexistence Interf ace
3. Pin and butto n def inition
3.1 Pin markings
3.2 Pin description
3.3 Pin out diag rams
4. T echnical specification
4.1 Absolute maximum ratings
4.2 Recommended operating conditions
4.3 Wi-Fi Specificat ions
4.4 I/O Characteristics
5. Mechanical specifications
5.1 Dimensions and Weight
5.2 Mating connecto rs
5.3 Reco mmended pcb land pattern (Photon with headers)
5.4 Recommended pcb land pattern (Phot on without headers)
6. Layout
6.1 Photon v1.0.0 Top Layer (GTL)
6.2 Photon v1.0.0 GND Layer (G2L)
6.3 Photon v1.0.0 3V3 Layer (G15L)
6.4 Photon v1.0.0 Bottom Layer (GBL)
7. Recommended solder reflow prof ile
8. Bill of Materials
Build your own design based on the Photon!
9. Ordering informat ion
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10. Qualification and approvals
11. Product handling
11.1 Packaging
11.2 Moisture sensitivity levels
11.3 ESD Precautions
12. Def ault settings
13. Glossary
14. FCC IC CE Warnings and End Product Labeling Requirements
15. Revision history
16. Co ntact
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Photon Dat asheet v011
1. Functional description
1.1 Overview
Particle’s Internet of Things hardware development kit, the Photon, provides everything you need to build a
connected product. Part icle combines a powerf ul ARM Cortex M3 micro-controller with a Broadco m Wi-Fi chip in a tiny
thumbnail-sized module called the PØ (P-zero).
To get yo u start ed quickly, Particle adds a rock solid 3.3VDC SMPS power supply, RF and user interf ace components to
the PØ o n a small single-sided PCB called the Phot on. The design is open source, so when you’re ready to integ rate
the Photon into your product, you can.
The Photon comes in two physical forms: with headers and without . Prototyping is easy with headers as the Pho ton
plugs directly into standard breadboards and perf boards, and may also be mount ed with 0.1” pitch f emale headers on
a PCB. To minimize s pace required, the Phot on form f actor without headers has castellated edges. These make it
possible to surface mount the Photon directly onto your PCB.
1.2 Features
Particle PØ Wi-Fi module
Broadcom BCM43362 Wi-Fi chip
802.11b/g/n Wi-Fi
STM32F205 120Mhz ARM Cortex M3
1MB f lash, 128KB RAM
On-board RGB status LED (ext. drive provided)
18 Mixed-signal GPIO and advanced peripherals
Open so urce design
Real-time operating sys tem (FreeRTOS)
Sof t AP setup
FCC, CE and IC cert ified
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Photon Dat asheet v011
2. Interfaces
2.1 Power
Power to the Photo n is supplied via the on-board USB Micro B connector or directly via the VIN pin. If power is supplied
direct ly to the VIN pin, the voltag e sho uld be reg ulated bet ween 3.6VDC and 5.5VDC. When the Photon is powered via
the USB port, VIN will output a voltag e of approximat ely 4.8VDC due to a reverse polarity protection series scho ttky
diode between V+ of USB and VIN. When used as an output, the max load on VIN is 1A.
Typical current consumption is 80mA with a 5V input. Deep sleep quiescent current is 160uA. When powering the
Photon f rom t he USB connector, make sure to use a quality cable to minimize IR drops (current x resistance = voltage)
in the wiring. If a high resist ance cable (i.e., low current ) is used, peak currents drawn f rom the Photon when
transmitting and receiving will result in voltag e sag at the input which may cause a syst em brown out or intermittent
operation. Likewise, the power source should be suf f icient enough to source 1A of current to be on the saf e side.
2.2 RF
The RF sect ion of the Photo n is a f inely tuned impedance controlled network of component s that optimize the
ef ficiency and sensitivity of the Wi-Fi communications.
An RF feed line runs f rom t he PØ module into a SPDT RF-switch. Log ic level cont rol lines on the PØ module select which
of the t wo ports of the RF-switch is co nnected to the RF feed line. A 100pF decoupling capacito r is located on each
control line. One port is connected to a PCB ceramic chip antenna, and the other is co nnected to a u.FL connecto r f or
ext ernal antenna adaptation. The default port will be set to the chip antenna.
Additionally, a user API is available to switch bet ween internal, external and even an automatic mode which
continuously switches between each antenna and select s the bes t signal. All three RF ports on the RF-switch have a
10pF RF quality DC-blocking capacitor in series with them. These ef fectively pass 2.4 GHz f requencies f reely while
blocking unwanted DC voltag es f rom damag ing t he RF-switch. All RF traces are considered as tiny transmission lines
that have a contro lled 50 ohm impedance.
The chip antenna is impedance matched to the 50 o hm RF feed line via a Pi network comprised of three RF inductors (1
series, 2 shunt). Thes e values are quite specific to the Photon due to the PCB construct ion and layout of the RF
section. Even if the Photon’s layout design is copied exactly, to achieve the best perf ormance it would be wo rth reexamining the Pi network values on act ual samples of the PCB in question.
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Photon Dat asheet v011
2.3 FCC Approved Antennas
Ant enna T ype Manuf acture r MFG. Part # Gain
Dipole antenna LumenRadio 104 -1001 2.15dBi
Chip antenna Advanced Ceramic X AT7020-E3R0HBA 1.3dBi
2.4 Peripherals and GPIO
The Photon has to n of capability in a small foo tprint, with analog, digital and communication interf aces.
Peripheral Type Qty Input (I) / Out put (O) FT / 3V3
Digital 18 I/O FT/3V3
Analog (ADC) 8 I 3V3
Analog (DAC) 2 O 3V3
SPI 2 I/O 3V3
I2S 1 I/O 3V3
I2C 1 I/O FT
CAN 1 I/O FT
USB 1 I/O 3V3
PWM 9 O 3V3
Not es:
FT = 5.0V t olerant pins. All pins except A3 and DAC are 5V tolerant (when not in analog mode). If used as a 5V input
the pull-up/pull-down resistor must be disabled.
3V3 = 3.3V max pins.
PWM is available on D0, D1, D2, D3, A4, A5, WKP, RX, T X with a caveat: PWM timer peripheral is duplicated on two pins
(A5/D2) and (A4/D3) for 7 total independent PWM outputs. For example: PWM may be used on A5 while D2 is used as a
GPIO, or D2 as a PWM while A5 is used as an analog input. However A5 and D2 cannot be used as independently
controlled PWM outputs at the same t ime.
[1] [2 ]
3
[1]
[2 ]
[3 ]
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Photon Dat asheet v011
2.5 JTAG
Pin D3 throug h D7 are JTAG interf ace pins. These can be used to reprogram your Phot on bootloader or user f irmware
imag e with standard JTAG tools such as t he ST-Link v2, J-Link, R-Link, OLIMEX ARM-USB-TINI-H, and also the FTDI-based
Particle JTAG Prog rammer.
Photon Pin Description ST M32 Pin PØ Pin # PØ Pin Name De f ault Internal
D7 JTAG_TMS PA13 44 MICRO_JTAG_TMS ~40k pull-up
D6 JTAG_TCK PA14 4 0 MICRO_JTAG_TCK ~40k pull-down
D5 JTAG_TDI PA15 4 3 MICRO_JTAG_TDI ~40k pull-up
D4 JTAG_TDO PB3 41 MICRO_JTAG_TDO Floating
D3 JTAG_TRST PB4 42 MICRO_JTAG_TRSTN ~40k pull-up
3V3 Power
GND Ground
RST Reset
Not es:
Def ault state af ter reset f or a short period of time bef ore these pins are restored to GPIO (if JTAG debugging is not
required, i.e. USE_SWD_JT AG=y is not specified on the command line.
A standard 20-pin 0.1” shrouded male JTAG interface co nnector should be wired as f ollows:
[1]
[1]
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Photon Dat asheet v011
2.6 External Coexistence Interface
The Photon supports coexistence with Blueto oth and other external radios via the three g old pads o n the t op side of
the PCB near pin A3. These pads are 0.035” square, spaced 0.04 9” apart. This spacing supports the possibility of
tacking on a small 1.25mm - 1.27mm pitch 3-pin male header t o make it somewhat easier to interf ace with.
When two radios occupying the same f requency band are used in the same system, such as Wi-Fi and Bluetooth, a
coexistence interf ace can be used to coo rdinate transmit activity, to ensure optimal performance by arbitrating
conflicts between the two radios.
Pad # PØ Pin Name PØ Pin # I/O Description
1 BTCX_RF_ACTIVE 9 I Signals Bluetooth is active
2 BTCX_STATUS 10 I Signals Bluetoo th priority status and TX/RX direction
3 BTCX_TXCONF 11 O Output g iving Bluetoot h permission to TX
When thes e pads are prog rammed to be used as a Bluetooth coexist ence interf ace, they’re set as high impedance on
power up and reset. Alternatively, they can be individually programmed to be used as GPIOs throug h sof tware control.
They can also be prog rammed to have an internal pull-up or pull-down resist or.
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3. Pin and button definition
3.1 Pin markings
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3.2 Pin description
Pin De script ion
VIN This pin can be used as an input or output. As an input, supply 3.6 to 5.5VDC t o power t he Photon. When the
Photon is powered via the USB port, t his pin will output a voltag e of approximat ely 4.8VDC due to a
reverse polarity prot ection series schottky diode between VUSB and VIN. When used as an output, t he max
load on VIN is 1A.
RST Act ive-low reset input. On-board circuitry cont ains a 1k ohm pull-up resistor between RST and 3V3, and
0.1uF capacitor between RST and GND.
VBAT Supply to the internal RTC, backup registers and SRAM when 3V3 not present (1.65 to 3.6VDC).
3V3 T his pin is the out put of the o n-board reg ulator and is internally connected to the VDD of the WiFi module.
When powering the Photo n via VIN or the USB port, this pin will output a voltag e of 3.3VDC. This pin can
also be used to power the Phot on directly (max input 3.3VDC). When used as an output, the max load on
3V3 is 100mA. NOTE: When powering the Photon via this pin, ensure power is disconnect ed from VIN and
USB.
WKP Active-high wakeup pin, wakes the module f rom sleep/standby modes. When not used as a WAKEUP, this
pin can also be used as a digital GPIO, ADC input or PWM.
D0~D7 Digital only GPIO pins.
A0~A9 12-bit Analog -to-Digital (A/D) inputs (0-4095), and also digital GPIOs. A6 and A7 are co de convenience
mappings, which means pins are not actually labeled as such but you may use code like analogRead(A7) .
A6 maps t o the DAC pin and A7 maps to the WKP pin.
DAC 12-bit Digital-to-Analog (D/A) out put (0-4 095), and also a digital GPIO. DAC is used as DAC1 in sof tware,
and A5 is a second DAC out put used as DAC2 in sof tware.
RX Primarily used as UART RX, but can also be used as a digital GPIO or PWM.
TX Primarily used as UART TX, but can also be used as a digital GPIO or PWM.
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3.3 Pin out diagrams
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4. Technical specification
4.1 Absolute maximum ratings
Paramet e r Symbol Min T yp Max Unit
Supply Input Vo ltage V +6.5 V
Supply Output Current I 1 A
Supply Output Current I 100 mA
Sto rag e Temperat ure T -4 0 +85 ° C
Enable Voltag e V V +0.6 V
ESD Susceptibility HBM (Human Body Mode) V 2 kV
IN-MAX
IN-MAX-L
3V3 -MAX-L
s tg
EN IN
ES D
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Photon Dat asheet v011
4.2 Recommended operating conditions
Paramet e r Symbol Min Typ Max Unit
Supply Input Vo ltage V +3.6 +5.5 V
Supply Input Vo ltage V +3.0 +3.3 +3.6 V
Supply Output Voltag e V +4.8 V
Supply Output Voltag e V +3.3 V
Supply Input Vo ltage V +1.65 +3.6 V
Supply Input Current (VBAT) I 19 uA
Operating Current (Wi-Fi on) I 80 100 mA
Operating Current (Wi-Fi on) I 235 4 30 mA
Operating Current (Wi-Fi on, w/powersave) I 18 100 mA
Operating Current (Wi-Fi off ) I 30 40 mA
Sleep Current (5V @ VIN) I 1 2 mA
Deep Sleep Current (5V @ VIN) I 80 100 uA
Operating Temperature T -20 +60 °C
Humidity Range Non condensing, relative humidity 95 %
Not es:
These numbers represent the extreme range of short peak current bursts when transmitting and receiving in
802.11b/g/n modes at different power levels. Average T X current consumption in will be 80-100mA.
These are very short average current bursts when transmitting and receiving. On average if minimizing f requency
of TX/RX events, current consumption in powersave mode will be 18mA
IN
3V3
IN
3V3
VBAT
VBAT
IN avg
IN pk
[1] [1]
IN avg
[2 ]
IN avg
Qs
Qd s
op
[1]
[2 ]
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Photon Dat asheet v011
4.3 Wi-Fi Specifications
Feature Description
WLAN Standards IEEE 802 11b/g/n
Antenna Port Single Antenna
Frequency Band 2.412GHz – 2.462GHz (United States of America and Canada)
2.4 12GHz – 2.4 72GHz (EU)
Sub Channels 1 – 11 (United States of America and Canada)
1 – 13 (EU)
Modulation DSSS, CCK, OFDM, BPSK, QPSK,16QAM, 64 QAM
PØ module Wi-Fi output po wer Typ. T ol. Unit
RF Averag e Output Po wer, 802.11b CCK Mode 1M Avail. upon request +/- 1.5 dBm
11M - +/- 1.5 dBm
RF Averag e Output Po wer, 802.11g OFDM Mode 6M - +/- 1.5 dBm
54M - +/- 1.5 dBm
RF Averag e Output Po wer, 802.11n OFDM Mode MCS0 - +/- 1.5 dBm
MCS7 - +/- 1.5 dBm
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Photon Dat asheet v011
4.4 I/O Characteristics
These specif ications are based on the STM32F205RG datasheet, with ref erence to Photon pin nomenclature.
Paramet e r Symbol Conditions Min Typ Max Unit
Standard I/O input low level voltag e V -0.3 0.28*(V -
2)+0.8
V
I/O FT input low level voltag e V -0.3 0.32*(V -
2)+0.75
V
Standard I/O input high level voltag e V 0.41*(V -
2)+1.3
V +0.3 V
I/O FT input high level voltag e V V > 2V 0.4 2*(V -
2)+1
5.5 V
V V ≤ 2V 0.42*(V -
2)+1
5.2 V
Standard I/O Schmitt t rigg er voltage
hysteresis
V 200 mV
I/O FT Schmitt trigger voltag e
hysteresis
V 5% V mV
Input leakag e current I GND ≤ V ≤ V
GPIOs
±1 µA
Input leakag e current I R V = 5V, I/O
FT
3 µA
Weak pull-up equivalent resistor R V = GND 30 40 50 k Ω
Weak pull-down equivalent resistor R V = V 30 4 0 50 k Ω
I/O pin capacitance C 5 pF
Not es:
FT = Five-volt tolerant . In order to sust ain a voltage higher than V +0.3 the internal pull-up/pull-down resist ors
must be disabled.
Hysteres is voltage between Schmitt trigg er switching levels. Based on characterization, not tested in production.
With a minimum of 100mV.
Leakag e could be higher than max. if neg ative current is injected on adjacent pins.
IL 3V3
[1]
IL 3V3
IH 3V3 3V 3
[1]
IH 3V3 3V3
IH 3V3 3V3
[2 ]
hys
[2 ]
hys 3V3
[3 ]
[4 ]
lkg io 3V3
[4 ]
lkg PU io
[5 ]
PU io
[5 ]
PD io 3V3
IO
[1] 3V3
[2 ]
[3 ]
[4 ]
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Photon Dat asheet v011
Pull-up and pull-down resistors are designed with a true resistance in series with switchable PMOS/NMOS. This
PMOS/NMOS contribution to t he series resistance is minimum (~10% o rder).
5. Mechanical specifications
5.1 Dimensions and Weight
Heade rs Dimensions in inche s (mm) We ight
With 1.4 4 x 0.8 x 0.27 (36.58 x 20.32 x 6.86) 5 grams
Without 1.44 x 0.8 x 0.17 (36.58 x 20.32 x 4.32) 3.7 g rams
5.2 Mating connectors
The Photon (with headers) can be mounted with (qty 2) 12-pin single row 0.1” f emale headers. Typically these are
0.335” (8.5mm) tall, but yo u may pick a taller one if desired. When you search for parts like thes e it can be diff icult to
navigate t he thousands of parts available.
On Digikey.com, this sect ion Rect angular Connect ors - Headers, Receptacles, Female Socket s
contains 36,000 of them. Narrow the search with: 12 positions, 1 row, 0.1” (2.54 mm) pitch, Through Hole mo unting
types (unless you want SMT), and sort by Price Ascending. Yo u may f ind something like this:
De script ion MFG MFG Part Number
12-pin 0.1” Female Header (Tin) Sullins Connector Solutions PPTC121LFBN-RC
12-pin 0.1” Female Header (Gold) Sullins Co nnector Solutions PPPC121LFBN-RC
You may also search f or other t ypes, such as reverse mounted (bottom side SMT) female headers, low prof ile types,
machine pin, et c..
[5 ]
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Photon Dat asheet v011
5.3 Recommended pcb land pattern (Photon with headers)
The Photon (with headers) can be mounted with 0.1” 12-pin female header receptacles using the f ollowing PCB land
pattern:
This land pattern can be found in the Spark.lbr Eagle library, as a Device named PHOTON . Note: Clone or Download
the complete repository as a ZIP file to avoid corrupt ed data in Eagle f iles.
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Photon Dat asheet v011
5.4 Recommended pcb land pattern (Photon without headers)
The Photon (without headers) can be surface mounted directly in an end application PCB using the f ollowing PCB land
pattern:
Solder mask aro und exposed co pper pads should be 0.1mm (4 mils) larger in all directions. E.g., a 0.08” x 0.10” pad
would have a 0.088” x 0.108” solder mask.
This land pattern can be found in the Spark.lbr Eagle library, as a Device named PHOTON_SMD . Not e : Clone or
Download t he complete re pository as a ZIP file to avoid corrupt ed data in Eagle f iles.
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6. Layout
6.1 Photon v1.0.0 Top Layer (GTL)
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6.2 Photon v1.0.0 GND Layer (G2L)
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6.3 Photon v1.0.0 3V3 Layer (G15L)
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6.4 Photon v1.0.0 Bottom Layer (GBL)
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7. Recommended solder reflow profile
Phase Temperat ures and Rat e s
A-B. Ambient~150°C, Heating rate: < 3°C/s
B-C. 150~200°C, soak time: 60~120 s
C-D. 200~24 5°C, Heating rat e: < 3°C/s
D. Peak temp.: 235~245°C, Time above 220°C: 4 0~90 s
D-E. 24 5~220°C, Cooling rate: < 1°C/s
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8. Bill of Materials
Build your own design based on the Photon!
Qt y Device
Minimum
Specif ication Package/Case Part De signat or MFG. MFG. PN
1 ANTENNA 2.4 GHz
Ceramic
5.0mm ×
2.0mm x
2.6mm
ANT1 Advanced
Ceramic X
AT7020-E3R0HBA
2 CERAMIC
CAPACITOR
22uF Ceramic
6.3V 10% X5R
0603 C4 ,C5 Samsung CL10A226MQ8NRNC
6 CERAMIC
CAPACITOR
0.1uF Ceramic
6.3V 10% X5R
04 02 C6,C7,C8,C11,C12,C16 RongFu 0402B104K01A
2 CERAMIC
CAPACITOR
100pF
Ceramic 6.3V
10% X5R
04 02 C2,C3 Feng hua 04 02CG101J500NT
4 CERAMIC
CAPACITOR
10uF Ceramic
6.3V 10% X5R
0603 C9,C11,C13,C15 Sumsung CL10A106MQ8NNNC
3 CERAMIC
CAPACITOR
(RF)
10pF Ceramic
6.3V 10% X5R
04 02 C1,C14,C17 Murata GJM1555C1HR80BB01D
1 CONNECTOR USB Micro-B
w/tabs & slots
USB-MICROB X1 Kaweei CMCUSB-5BFM2G-01-D
1 CONNECTOR uFL
Connect or
SMD X2 Kaweei P1163-014 0R
2 HEADER Single String
1.2” Mating
Length
0.1” 12-pin JP1,JP2 Kaweei CP25411-12G-S116-A
1 DIODE Diode
Schott ky 30V
3A
DO-220AA D1 Vishay SS3P3-M3/84 A
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1 DIODE (LED) Blue SMD 0603 LED1 Everlight 19-217/BHC-
ZL1M2RY/3T
1 DIODE (LED) LED RGB
Common
Anode
Diff used SMD
4-PLCC
(2.0mm x
2.0mm)
LED2 Cree CLVBA-FKA-
CAEDH8BBB7A363
1 INDUCTOR 2.2uH 1.5A 3mm x 3mm L4 Taiyo
Yuden
NR3015T2R2M
1 INDUCTOR
(RF)
3.9nH RF
inductor
04 02 L3 Johanson L-07C3N9SV6T
1 INDUCTOR
(RF)
4.7nH RF
inductor
04 02 L1 Johanson L-07C4N7SV6T
1 INDUCTOR
(RF)
6.8nH RF
inductor
04 02 L2 Johanson L-07C6N8JV6T
1 WI-FI + MCU Broadcom Wi-
FI + STM32
MCU
Custo m USI
SMD
U1 USI WM-N-BM-09-S
1 RF SWITCH RF Switch
SPDT
UQFN-6
(1x1mm)
U3 Skyworks SKY13350-385LF
1 POWER
REGULATOR
3.3V 1.5MHz
600mA High
Eff iciency
PWM Step-
Down DC/DC
Converter
SOT23-5 U2 Richtek RT8008-33GB
1 RESISTOR 100k 5% 04 02 R4 Fenghua RC-02W104FT
2 RESISTOR 22R 5% 04 02 R5,R6 Fenghua RC-02W220JT
1 RESISTOR 10k 5% 04 02 R8 Fenghua RC-02W103JT
4 RESISTOR 1k 5% 0402 R1,R2,R3,R7 Feng hua RC-02W102JT
2 SWITCH Button 160g f 3.6mm x
3.1mm
SETUP,RESET Haoyu TS-1185A-C
Qt y Device
Minimum
Specif ication Package/Case Part De signat or MFG. MFG. PN
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Photon Dat asheet v011
9. Ordering information
Photons are available f rom store.particle.io in single quantities with and without headers, and also included in
diff erent maker kits.
10. Qualification and approvals
Mode l numbe r: PHOTONH
RoHS
CE
FCC ID: 2AEMI-PHOTON
IC: 20127-PHOTON
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11. Product handling
11.1 Packaging
The Photon comes in two primary st yles of packag ing: Matchbox and Kit Bo x. The Matchbox contains the bare
essentials to g et you started, while the kit box contains a breadboard, Micro B USB cable, sticker, prot otyping card and
a couple sensors to build your first internet connected project!
Photons witho ut headers are also available in JEDEC style trays f or automated pick and place machines. Request
more details from us on t his in the Contact section below.
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Photon Dat asheet v011
11.2 Moisture sensitivity levels
The Moisture Sensitivity Level (MSL) relates to the packag ing and handling precautions required. The PØ mo dule on
the Photons dominate the MSL requirements and are rat ed level 3. In general, this precaution applies f or Photons
without headers. If reflowing a Photo n direct ly ont o an application PCB, increased moist ure levels prior to ref low can
damage s ensitive electronics on the Photon. A bake process to reduce moisture may be required.
For mo re information reg arding moist ure sensitivity levels, labeling, st orage and drying see the MSL standard see
IPC/JEDEC J-STD-020 (can be downloaded from www.jedec.org ).
11.3 ESD Precautions
The phot on contains highly sensitive electronic circuitry and is an Elect rostatic Sensitive Device (ESD). Handling a
photon without proper ESD protection may destroy or damag e it permanently. Proper ESD handling and packaging
procedures must be applied throug hout t he processing, handling and operation of any application that incorporates
photons. ESD precaut ions should be implemented on the application board where the photon is mounted. Failure to
observe these precautions can result in severe damag e to t he photon!
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Photon Dat asheet v011
12. Default settings
The Photon comes preprog rammed with a bootloader and a user application called Tinker. This application works
with an iOS and Android app also named Tinker that allows you to very easily tog gle digital pins, take analog and
digital readings and drive variable PWM outputs.
The boot loader allows you t o easily update the user application via several diff erent metho ds, USB, OTA, Serial YModem, and also internally via the Factory Reset procedure. All of thes e methods have multiple to ols associated with
them as well.
You may use t he online Web IDE Particle Build to code, co mpile and flash a user application OTA (Over The Air). Particle
Dev is a local tool that uses the Cloud to co mpile and flash OTA as well. There is also a packag e Spark DFU-UTIL f or
Particle Dev that allows for Cloud compiling and local f lashing via DFU over USB. This requires dfu-util to be
installed on your syst em. ‘df u-util’ can also be used with Particle CLI for Cloud compiling and local flashing via the
command line. Finally the lowes t level of development is available via the GNU GCC toolchain for ARM, which of fers
local compile and flash via dfu-util. This gives the user co mplete control of all source co de and flashing methods. T his
is an extensive list, however not exhaustive.
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Photon Dat asheet v011
13. Glossary
SMPS
Switched-Mode Power Supply
RF
Radio Frequency
Cast ellated
The edg e of the PCB has plated holes that are cut in half which resemble the top of a castle. These make it
easy to solder the Phot on down to another PCB with a SMT ref low process .
SMT
Surface Mount Technolog y (of ten associated with SMD which is a surf ace mount device).
AP
Access Point
LED
Light-Emitt ing Diode
RGB LED
Red green and blue LEDs combined and diff used in one package.
USB
Universal Serial Bus
Quiesce nt current
Current consumed in the deepest sleep stat e
FT
Five-to lerant; Ref ers to a pin being tolerant to 5V.
3V3
+3.3V; The reg ulated +3.3V supply rail. Also used to not e a pin is only 3.3V tolerant .
RTC
Real Time Clock
OT A
Over The Air; describing how f irmware is transf erred to t he device.
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Photon Dat asheet v011
14. FCC IC CE Warnings and End Product
Labeling Requirements
Fede ral Communicat ion Commission Inte rf ere nce St at ement
This equipment has been tested and f ound to comply with the limits f or a Class B digital device, pursuant to Part 15 of
the FCC Rules. These limits are designed to provide reaso nable protection ag ainst harmf ul interf erence in a residential
installation. This equipment g enerates , uses and can radiate radio f requency energy and, if not inst alled and used in
accordance with the inst ructions, may cause harmf ul interference to radio communications. However, t here is no
guarantee that interf erence will not occur in a particular installation. If this equipment does cause harmf ul
interf erence t o radio or t elevision reception, which can be determined by turning the equipment of f and on, the user is
encourag ed to try to co rrect the interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet o n a circuit diff erent from t hat to which the receiver is connected.
Consult t he dealer or an experienced radio/TV technician f or help.
FCC Caut ion:
Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate t his equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the f ollowing t wo co nditions:
1. This device may not cause harmf ul interf erence, and
2. This device must accept any interf erence received, including interf erence that may cause undesired operation.
FCC Radiation Exposure Statement :
This equipment complies with FCC radiation exposure limits set f orth f or an uncontrolled environment. This
transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. T his
End equipment should be installed and operated with a minimum dist ance of 20 centimeters between t he radiator and
your body.
IMPORTANT NOT E:
In the event that these conditions can not be met (f or example certain laptop conf igurations or co-location with
another transmitt er), then the FCC authorization is no long er considered valid and the FCC ID can not be used on the
final product . In these circumstances, the OEM integ rator will be responsible f or re-evaluating the end product
(including t he transmitter) and obtaining a separate FCC authorization.
(continued on next page)
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Photon Dat asheet v011
End Product Labeling
The f inal end product must be labeled in a visible area with t he f ollowing:
Contains FCC ID: 2AEMI-PHOTON
Manual Inf ormation t o the End User
The OEM integ rator has to be aware not to provide information to the end user reg arding how to install or remove
this RF module in the user’s manual of the end product which integ rates this module.
Canada St ate ment
This device complies with Indust ry Canada’s licence-exempt RSSs. Operat ion is subject to t he f ollowing two
conditions:
1. This device may not cause interf erence; and
2. This device must accept any interf erence, including interf erence that may cause undesired operation of the
device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’ e xploitation est autorisée aux deux condit ions suivant es:
1. l’appareil ne doit pas produire de brouillage;
2. l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible
d’en compromettre le f onctionnement .
Caut ion Exposure:
This device meets the exemption from the ro utine evaluation limits in section 2.5 of RSS102 and users can obtain
Canadian informat ion on RF exposure and compliance.
Le dispositif répond à l’exemption des limites d’évaluation de routine dans la section 2.5 de RSS102 et les utilisateurs
peuvent obtenir des renseignements canadiens sur l’exposition aux RF et le respect.
The f inal end product must be labelled in a visible are a with t he f ollowing :
The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device,
ot herwise the host device must be labelled to display the Industry Canada certification number of the module,
preceded by the words “Contains transmitter mo dule”, or the wo rd “Contains”, or similar wording expressing t he
same meaning, as f ollows:
Contains transmitt er module IC: 20127-PHOTON
(continued on next page)
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Photon Dat asheet v011
This End equipment should be installed and operated with a minimum distance of 20 centimet ers between the
radiator and your body.
Cet équipement devrait être installé et act ionné avec une distance minimum de 20 centimètres entre le radiateur et
vot re corps.
The end user manual shall include all required reg ulatory informat ion/warning as shown in this manual.
15. Revision history
Revision Date Aut hor Comment s
- 30Mar2015
BW Initial release
v003 7-Apr-
2015
BW Updated template
v004 8-Apr-
2015
BW Updated Overview, Block diagram, Power, RF, and Pin markings sections
v005 9-Apr-
2015
BW Updated BOM
v006 21-
Apr2015
BW Added JTAG, BT CO-EX, I/O Charact eristics, Schematic, Layout, Reflow Profile,
Glossary, Updated Operat ing Conditions
v007 28-
Apr2015
BW Added Layout, Updated analog pins, Land patterns, Packag ing, Mating Connectors
v008 11-
May2015
BW Updated BT CO-EX, PWM info, Qualifications
v009 31-
May2015
BW Updated Pinouts, DAC info , Height dimensions, So lder mask info, Recommended
operating conditions
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v010 1-
June-
2015
BW Updated VBAT info
v011 22-
June-
2015
BW Added FCC IC CE Warnings and End Product Labeling Requirements , Updated power
out put, removed block diagram and schematics, added approved antennas
Revision Date Aut hor Comment s
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Photon Dat asheet v011
16. Contact
Web
htt ps://www.particle.io
Communit y Forums
htt ps://community.particle.io
Email
hello@particle.io
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