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PG-1810 Service Manual
PG-1810 Service Manual
(GSM Cellular Phone)
Pantech Co., Ltd., Korea
February 22, 2006
1st Edition
For Use by Authorized Service/Maintenance Personal Only
Documents to Receive This Addendum:
PG-1810 Maintenance/Repair/Operating Manual
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CONTENTS
SECTION 1 INTRODUCTION .............................................................................................................3
1.1 INTRODUCTION..............................................................................................................................3
1.2 FREQUENCY ALLOCATION AND ITS USE ........................................................................................... 3
1.3 ITEM NAME AND USE ..................................................................................................................... 4
1.4 CHARACTERISTICS ........................................................................................................................4
SECTION 2 ELECTRICAL SPECIFICATIONS....................................................................................5
2.1 GENERAL ......................................................................................................................................5
2.2 TRANSMITTER…………………………………………………………………………………………….5
2.3 RECEIVER…………………………………………………………………………………………………5
SECTION 3 OPERATION....................................................................................................................6
3.1 NAME OF EACH PART…..……………………………….…………………………………………………6
3.2.DISPLAY ..………………….…………………………….………………………………………………..7
3.3 KEYPAD …………………………………….………….………………………………………………..7
3.4 BLUETOOTH MODULE…………………………………………………………………………………8
SECTION 4 THEORY OF OPERATION..............................................................................................9
4.1 LOGIC SECTION.............................................................................................................................9
4.1.1 DC DISTRIBUTION AND REGULATION PART…………………………………………………………….9
4.1.2 LOGIC PART…………………………………………………………………………………………….9
4.1.2.1 SUMMARY…………………………………………………………………………………………….10
4.1.2.2 BASEBAND DIGITAL SIGNAL PROCESSING…………………………………………………………11
4.1.3 MEMORY PART………………………………………………………………………………………..14
4.1.4 NOTIFICATION PART..................................................................................................................14
4.1.5 KEY PAD PART .........................................................................................................................14
4.1.6 LCD MODULE(DISPLAY PART) ..................................................................................................14
4.2 RADIO TRANSCEIVER SECTION.....................................................................................................15
4.2.1 DC DISTRIBUTION AND REGULATION PART.................................................................................16
4.2.2 TRANSCEIVER PIN DESCRIPTION…………………………………………………….……….16
4.2.3 RECEIVE SECTION………………………………………………………………………………….…17
4.2.3.1 AN OVERVIEW OF RECEIVE SECTION ......................................................................................17
4.2.3.2 RECEIVER PART……………………………………………………………………………….……19
4.2.4 TRANSMIT SECTION ..................................................................................................................20
4.2.4.1 AN OVERVIEW OF TRANSMIT SECTION....................................................................................20
4.2.4.2 TRANSMITTER PART...............................................................................................................21
4.2.5 OFFSET PLL……………………………………………………………………………….…………..22
4.2.5.1 AN OVERVIEW OF OFFSET PLL............................................................................................22
4.2.5.2 VCTCXO(VOLTAGE CONTROLLED TEMPERATURE COMPENSATED CRYSTAL OSCILLATOR):V801….22
SECTION 5 ALIGNMENT PROCEDURE..........................................................................................24
5.1 RECOMMENDED TEST EQUIPMENT ...............................................................................................24
5.2 CONNECTION OF TEST EQUIPMENT ..............................................................................................24
SECTION 6 EQUIPMENT REPAIR PROCEDURE...........................................................................25
6.1 NO POWER ON WITH BATTERY APPLIED ..........................................................................................25
6.1.1 POWER CHECK.........................................................................................................................25
6.1.2 OSCILLATION CHECK ...............................................................................................................28
6.1.3 KEYPAD LED NOT IN OPERATION(3-COLOR AND BLUE)..............................................................29
6.1.4 LCD EL BACKLIGHT LED NOT IN OPERATION(WHITE)..………………………………………… …30
6.2 AUDIO PART(EARPIECE, HANDS FREE EARPHONE, MICROPHONE, HANDS FREE MIC)..................31
6.2.1 NO RECEIVING TONE HEARD (EARPIECE) .................................................................................31
6.2.2 MELODY OR MP3 IS NOT RINGING .............................................................................................32
6.2.3 NO RECEIVNG TONE AND MELODY OR MP3 HEARD ( HANDS-FREE EARPHONE )...........................34
6.2.4 HOOK SWITCH NOT WORKING....................................................................................................35
6.2.5 SIDE TONE NOT TRANSMITTED (MIC).........................................................................................36
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6.2.6 Side Tone Not transmitted (Hands-free Mic) ………………………………………………...…37
6.2.7 Vibrator not working ………………………………….……………………………………………..38
6.3 SIM AND MINI SD MEMORY PART……………………………………………………………………….39
6.3.1 SIM error……………………………………………….……………………………………………..39
6.3.2 MINI SD MEMORY ERROR…………………………..…………………………………………………40
6.4 Charger part…………………………………………………………………………………………….41
6.4.1 Charging error………………………………………………………………………………………..41
6.5. CAMERA SENCE PART ……………………………..…………………………………….……………43
6.5.1. CAMERA PREVIEW ERROR ( ALL ITEMS ARE ON LCD MODULE )……………………….…………...43
6.6 Blutooth……………….………………………………………………………………………………...45
6.7 RF PART…………….………………………………………………………………………………….47
6.7.1 TEST CONDITIONS……………………………………………………………………………………..47
6.7.2 POWER SUPPLY CHECK POINT_TEST CONDITION1…………………………………………………..48
6.7.3 RF Transceiver _ TEST CONDITION 2, 3, 4, 5, 6 ……………………………………………....51
6.5.3 POWER AMPLIFIER MODULE _TEST CONDITION 2,3,4,5,6……………………………..…………....51
6.7.5 ANTENNA SWITCH MODULE WITH SAW FILTER _ TEST CONDITION 2, 3, 4, 5, 6.… …………..53
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SECTION 1. INTRODUCTION
1.1 An Introduction of GSM Digital Cellular Mobile Communication System
GSM (Global System for Mobile communication) concluded that digital technology working in
the Time Division Multiple Access (TDMA) mode would provide the optimum solution for the
future system. Specifically , a TDMA system has the following advantage
► Offers a possibility of channel splitting and advanced speech coding, resulting in improved
spectrum efficiency.
► Allows considerable improvements to be made with regards to the protection of information.
The GSM system is basically designed as a combination of three major subsystems;
The network subsystem, the radio subsystem, and the operation support system.
The functional architecture of a GSM system can be divided into the Mobile Station (MS), the Base
Station (BS), and the Network Subsystem (NS). The MS is carried by the subscriber, the BS
subsystem controls the radio link with the MS and the NS performs the switching of calls between
the mobile and other fixed or mobile network users as well as mobility management. The MS and
the BS subsystem communicate across the Um interface also known as radio link
The specifications relating to MS are as follows:
TS 100 607-1 : Digital cellular telecommunication system(Phase2+)Mobile Station (MS) con
Formance specification Part1: Conformance specification
1.2 Frequency Allocation and Its Use
Transmit frequency band : 824 MHz ~ 849 MHz(For GSM850), 1850 MHz ~ 1910 MHz (For
PCS1900), 1710 ~ 1785 MHz (For DCS)
Receive frequency band: 869 MHz ~ 894 MHz(For GSM850) , 1930 MHz ~ 1990 MHz (For
PCS1900), 1805 MHz ~ 1880 MHz(For DCS)
Channel spacing : 200 KHz
ARFCN(Absolute Radio Frequency Channel Number) : 128~251 (For GSM850), 512~810 (For
PCS1900), 512~885 (For DCS).
Separation between Transmit and Receive channels [MHz] : GSM850 : 45 MHz, DCS : 95 MHz,
PCS ;80 MHz
For GSM850 Band Fl(n)=824.2+0.2*(n-128) 128 ≤n≤ 251 Fu(n)=Fl(n)+45
824 MHz ~849 MHz : Mobile Transmit,Base receive
869 MHz ~894 MHz : Base Transmit, Mobile receive
For PCS Band Fl(n)=1850.2+0.2*(n-512) 512 ≤n≤ 810 Fu(n)=Fl(n)+80
1850 MHz ~1910 MHz : Mobile Transmit,Base receive
1930 MHz ~1990 MHz : Base Transmit, Mobile receive
** Fl(n)= frequency value of the carrier , Fu(n)= corresponding frequency value in upper band
For DCS Band Fl(n)=1710.2+0.2*(n-512) 512 ≤n≤ 885 Fu(n)=Fl(n)+95
1710 MHz ~1785 MHz : Mobile Transmit,Base receive
1805 MHz ~1880 MHz : Base Transmit, Mobile receive
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1.3 Item Name and Usage
PG-1810, GSM digital cell phone, is supercompact, superlight mobile communication terminal for
personal use. It has a GSM850 850MHz and DCS 1800MHz/PCS 1900MHz frequency band and
adopts GSM850 and DCS/PCS mode having excellent spectrum efficiency, economy, and
portability.
This product is GSM Cellular type portable phone, adopting 1-cell Li-ion battery and power saving
circuit to maximize its operation time. Also, it is equipped with a monoful intena and color TFT main
LCD and CSTN sub LCD with font built in enables both Russia and English text service. And power
control (basic feature of GSM), security feature, voice symbol feature, and variable data rate feature
are used appropriately to ensure its best performance. This product consists of a handset, battery
pack, and Travel charger.
1.4 Characteristics
1) All the active devices of PG-1810 are made of semiconductors to ensure excellent performance
and semi-permanent use.
2) Surface mounting device (SMD) is used to ensure high reliability, compactness and lightness.
3) PG-1810 adopts the Silabs’s AEROⅡ RF transceiver(Si4210), which is CMOS RF front-end for
multi-band GSM digital cellular handsets. The Aero's highly-integrated architecture eliminates
the IF SAW filter, low noise amplifiers (LNAs) for three bands, transmit and RF voltage-controlled
oscillator (VCO) modules, and more than 60 other discrete components found in conventional
GSM handsets to deliver smaller, more cost effective GSM solutions that are easier to design
and manufacture.
4) PG-1810 is designed to perform excellently even in the worst environment
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Section 2. Electrical Specifications
2.1 General GSM850 / PCS1900 / DCS1800 Band
Mobile Transmit Frequency 824 ~ 849MHz / 1850 ~1910MHz / 1710 ~ 1785MHz
Mobile Receive Frequency 869 ~ 894MHz/ 1930 ~1990MHz / 1805 ~ 1880 MHz
The Number of Time Slot 8
The Number of Channels 124 / 299 / 375
Channel Spacing 200 kHz
Power Supply Rechargeable Li-Ion Battery 3.7V/720mAH
Operating Temperature -10℃ ∼ +55℃
Dimension 95.5(H) ×46(W) ×18.7(D) mm
Weight 90 g
2.2 Transmitter GSM850 / PCS1900 / DCS1800 Band
Maximum Output Power 33±2 / 30±2dBm / 30±2dBm
Frequency Error ±90Hz / ±180Hz/ ±190Hz
Phase Error RMS < 5°, PEAK < 20°
Minimum Output Power 5±5 / 0±5dBm
Power Control 5~19 / 0~15 (2 dB Step)
Output RF Spectrum TS 100 910V6.2.0
Switching Transient TS 100 910V6.2.0
Intermodulation attenuation
Idle Mode
GSM850
-57dBm 9KHz~824M / 849MHz~1GHz
-59dBm 824MHz~849MHz
-47dBm 1GHz ~ 12.75GHz
PCS
-57dbm 9kHz ~ 1GHz
-53dBm 1.850GHz ~ 1.910GHz
-47dBm 1GHz ~ 1.850GHz / 1.910GHz ~ 12.75GHz
Conducted Spurious Emissions
Allocated Channel
-36dBm 9KHz~ 1GHz
-30dBm 1GHz~ 12.75GHz
2.3 Receiver
Reference Sensitivity -102dBm
C/Ic 9 dB
C/Ia1 -9 dB
C/Ia2 -41 dB
For Adjacent interference
For Adjacent(200KHz) interference
For Adjacent(400KHz) interference
For Adjacent(600KHz) interference
C/Ia3 -49 dB
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Section 3 Operation
3.1 Name of each part
Main
Display
Screen
Speaker
Intenna
Sub Display
Screen
330K Pixel
Camera
Battery
MIC
Receiver
KEY PAD
Ear Jack
Micro SD CARD
Side Key
(Camera)
Side Key
( MP3 Play )
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3.2 Display
3.2.1. Main LCD
Parameter Projected Actual (MAIN LCD)
Display 260K Colors TFT LCD with white LED back lighting
Character : (font size : 16×16) 10 lines x 8 characters
Driver CL761AP (Core Logic)
Module Dimen. 34.2(H) x 54.13(V) x 3.35(D)
Active Area 1.8 “ inches
Resolution(pixels) 128 x 160 pixels
Color Display Depth 16 bits + 2 bits
3.2.1. Sub LCD
Parameter Projected Actual (SUB LCD)
Display 65K Colors CSTN LCD with white LED back lighting
Character : (font size : 16×16) 6 lines x 6 characters
Driver CL761AP (Core Logic)
Module Dimen. 34.4(H) x 54.13(V) x 3.5(D)
Active Area 1.04 “ inches
Resolution(pixels) 96 x 96 pixels
Color Display Depth 16 bits
3.3 Keypad
Market Goal Projected Actual Comments
English
Keypad
0-9, *,#
Send (Color)
End/Pwr (Color)
OK.
Up (Porfile),
Down (Phonebook),
Left (Favorites),
Right (SMS),
Soft1 ( Menu ),
Soft2 ( Phonebook ),
C ( Cancel / Back ),
* Key: Etiquette Mode
# Key: Keypad Lock
0 Key: International
1 Key: Voice Mail key
0-9, *,#
Send (Color)
End/Pwr (Color)
OK.
Up (Porfile),
Down (Phonebook),
Left (Favorites),
Right (SMS),
Soft1 ( Menu ),
Soft2 ( Phonebook ),
C ( Cancel / Back ),
* Key: Etiquette Mode
# Key: Keypad Lock
0 Key: International
1 Key: Voice Mail key
Meets Goal.
(Industrial design
sample required)
Meets Goal
Keys for VR and
Lock
International
Volume up/down
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3.4 BLUETOOTH MODULE
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Section 4. Theory of Operation
4.1 Logic Section
4.1.1 DC Distribution and Regulation Part
Applying battery voltage and pressing “END” key on the key pad short-circuits “Ground” and “_
PowerON”. AD6535(U202) control that power manage regarding power on/off in handset
Pressing POWERKEY on the key pad is active on the handset.
This will turn on all the LDOs, when POWERKEY is held low. The power of RF Tx power amplifier is
supplied directly by the battery.
4.1.2 Logic part
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4.1.2.1 Summary
The logic part consists of AD6528D ARM7 microprocessor-combined GSM-ASIC, COMBO(flash
ROM & SRAM), AD6535 VBC Chip. AD6528D is GSM-ASIC chipset implemented for GSM
terminal’s system control and baseband digital signal processing.
Major parts used in the logic part are as follows:
1) AD6528D : U201, [ARM7 Processor Core + GSM Signal Processing] ASIC
2) AD6535 : U202, Analog Baseband Codec
3) COMBO MEMORY(Flash ROM : U203, 256Mbit Flash Memory + 64Mbit SRAM )
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4.1.2.2 Baseband Digital Signal Processing
AD6528D is a GSM core device containing ARM7 CPU core. AD6535 is 148 pin BGA package,
consisting of terminal chips. The function and characteristics of clock are as follows:
1) Complete single chip GSM Processor
2) Channel codec sub-system
• Channel coder and decoder
• Interleaver and Deinterleaver
• Encryption and Decryption
3) Control Processor Subsystem including
• Parallel and serial Display interface
• Keypad Interface
• SIM Interface
• Control of RADIO subsystem
• Real Time Clock with Alarm
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☞ Configuration by Function of AD6528D
1 Microprocessor Core
AD6528D has a built-in ARM7 microprocessor core, including microprocessor interrupt controller,
timer/counter, and DMA controller. And besides, 32bit data path is included, and up to 8Mbyte
addressing is enabled and can be extended up to 16Mbyte. Although external clock should be
provided to operate the microprocessor, this core uses 26MHz VCTCXO to provide clock.
2 Input Clock
1) Main Clock(26 MHz):
This is the clock needed for the microprocessor built in AD6528D to operate.
2) VC-TCXO(26MHz) , 32.768KHz Clock:
This is the system reference clock to control SLEEP mode.
This is the clock derived from 26MHz VC-TCXO clock, provided by RF part. It is the timing
reference clock for GSM signal processing.
3 DSP Subsystem
This is a GSM signal processing part in GSM mode, consisting of speech transcoding and
Channel equalization as follows:
1) Speech transcoding
In full rate, the DSP receives the speech data stream from VBC and encodes data from 104kbps to
13kbps. Using algorithm is Regular Pulse Excitation with Long Term Prediction (RPE-LTP).
2) Equalization
The Equalizer recovers and demodulates the received signal
The Equalizer establishes local timing and frequency references for mobile terminal as well as
RSSI calculation.
The equlization algorithm is a version of Maximum Likelihood Sequency Estimation (MLSI)
using Viterbi Algorithm.
☞ GSM Core and RF Interface
1) Transmitter:
AD6535 VBC receive data at 270kbps and use an on chip lock-up table to perform GMSK
modulation. A pair of 10bit matched differential DACs converts the modulated data and pass
I and Q analog data to the transmit section of the radio system.
2) Receiver:
The receiver I and Q signals are sampled by a pair of ADCs at 270kbps.
The I and Q samples are transferred to the EGSMP through a dedicated receive path serial port.
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4 RF Interface
This interfaces the RF part to control power amplifier, Tx LO buffer amplifier, VC-TCXO, and
AGC-end on transmit/receive paths in the RF part.
1) Transmitter Interface:
This transmits TX_AGC signal to Tx AGC amplifier to adjust transmit power level and sends
Ramp_DAC signal to the RF part to control power amplifier.
2) Receiver Interface:
This transmits RX_AGC signal to Rx AGC amp. to adjust receive path gain.
5 General Purpose ADC Support
The AD6535 includes a general purpose 10bit auxiliary ADC with four multiplexed input channel
These are used for measurment of battery voltage ID , temperature and accessory ID.
6 USC(Universal System Connector) Interface
A Typical GSM handset requires serial connections to provide data during normal phone operation
Manufacturing, testing and debugging.
7 General Purpose Interface
The AD6528D provides 32 interface pin for control of peripheral devices.
All GPIO pins start up as inputs. Additional purpose inputs and outputs are available under SW
control.
8 Speech Transcoding
In full rate mode, the DSP receive the speech data stream from the VBC and encodes data from
104kbps to 13kbps.Using algorithm is Regular Pulse Exitation with Long Term Prediction as
specified GSM Recommandation
9 Power Down Control Section
1) Idle Mode Control:
If IDLE/ signal turns ‘Low’, transmitter section becomes disabled.
2) Sleep Mode Control:
If IDLE/ and SLEEP/ signals turn ‘Low’, all the sections except for VC-TCXO circuit become
disabled.
3) Receiver & Transmitter Mode Control:
If IDLE/ and SLEEP/ signals turn ‘High’, all the sections become enabled to perform
transmit/receive operation
.
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4.1.3 Memory Part
Memory consists of COMBO (flash ROM & SRAM).
1 Flash ROM
Flash ROM has a capacity of 256Mbit(32MByte). The main programs of the terminal(call processing,
user interface, and diagnostic task) and supplemental programs (NAM program and test program)
are stored in the flash ROM. Even if the program version may be changed in the future, customers
can download the program.
2 Static RAM
SRAM has a capacity of 64Mbit(8MByte) and stores system parameters, data buffer, and stack of
each task in it.
3 Key Tone Generation
All alert signals are generated by the DSP and output to the EVBC.
These alert can be used for the earpiece.
4.1.4 Notification Part
The notification of incoming call is given by melody, vibrator.
1) Melody:
This is a device sounding alert/melody tones.
The melody datas are stored in flash memory (U203) And generated by Melody IC(U117).
2) Vibrator:
This is a device enabling vibration. The vibrator data is stored in flash memory(U203)
And generated by AD6535(U202).
4.1.5 Key Pad Part
To enable key operation to input information, the key matrix is configured using strobe signal of
KEYPADROW(0-4) and 5 input ports of KEYPADCOL(0-4). Also, to use the key even at light, the
backlight circuit is provided for LED 17s.
4.1.6 LCD Module(Display Part)
LCD module consists of LCD, controller, LED-Backlight, and LCD reflector.using dual LCD
Main LCD: 1S/W Icon x 1 lines[(128x3)x160] can be displayed on the LCD panel. 6 icons could be
provided by S/W. Controller with English font built in has been used.
Sub LCD: 1S/W Icon x 1 lines[(128x3)x160] can be displayed on the LCD panel. 6 icons are
provided. Controller with English font built in has been used.
LED-backlight Using illuminates the LCD panel, and LCD reflector enhances LCD display effect.
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4.2 Radio Transceiver Section
Fig.4-1. RF Transceiver block diagram
The PG-1810’s RF Transceiver, which is AEROⅡ(SI4210) transceiver is the industry’s most
integrated
RF front end for multi-band GSM/GPRS digital cellular handsets and wireless data modems.
The highly integrated solution eliminates the IF SAW filter, external low noise amplifiers (LNAs)
for three bands, transmit and RF voltage controlled oscillator (VCO) modules, and more than 70
other discrete components found in conventional designs. The receive section uses a digital low-IF
architecture that avoids the difficulties associated with direct conversion while delivering lower
solution cost and reduced complexity. The baseband interface is compatible with any supplier’s
baseband subsystem. The transmit section is a complete up-conversion path from the baseband
subsystem to the power amplifier, and uses an offset phase-locked loop (PLL) with a fully integrated
transmit VCO. The frequency synthesizer uses Silicon Laboratories’ proven technology, which
includes integrated RF and IF VCOs, varactors, and loop filters.The unique integer-N PLL
architecture produces a transient response that is superior in speed to fractional-N architectures
without suffering the high phase noise or spurious modulation effects often associated with those
designs. This fast transient response makes the AEROⅡ(SI4210) transceiver well suited to GPRS
multi-slot applications where channel switching and settling times are critical.
The following Figure shows of RF Transceiver PCB Layout
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Fig.4-2. Top view of RF Transceiver PCB Layout
4.2.1 DC Distribution and Regulation Part
The battery voltage, in return, is applied to the logic part and RF part via LDO(Low Drop-Out)
regulator. As several LDO regulators are used, power can be supplied for each necessary part
efficiently. Audio/Logic parts use +2.8V. Si4210 RF Transceiver (U306) also use +2.8V DC voltage.
4.2.2 Transciever pin description
Fig.4-3. Top View of Si4210-GM
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Table 4-1. Pin Description of Si4210-GM
4.2.3 Receiver Section
4.2.3.1 An Overview of Receive section
Fig.4-6. Receiver block diagram
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PG-1810’s Aero II transceiver uses a digital low-IF receiverar chitecture that allows for the on-chip
integration of the channel selection filters, eliminating the external RF image reject filters, and the IF
SAW filter required in conventional superheterodyne architectures. Compared with direct-conversion
architectures, the digital low-IF architecture has a much greater degree of immunity to dc offsets that
can arise from RF local oscillator (RFLO) self-mixing, second-order distortion of blockers (AM
suppression), and device 1/f noise.
The digital low-IF receiver's immunity to dc offsets has the benefit of expanding part selection and
improving manufacturing. At the front end, the common-mode balance requirements on the input SAW
filters are relaxed, and the PCB board design is simplified. At the radio's opposite end, the BBIC is one
of the handset's largest BOM contributors. It is not uncommon for a direct conversion solution to be
compatible only with a BBIC from the same supplier in order to address the complex dc offset issues.
However, since the Aero II transceiver has no requirement for BBIC support of complex dc offset
compensation, it is able to interface to all of the industry leading baseband ICs.
The receive (RX) section integrates four differentialinput low noise amplifiers (LNAs) supporting the
GSM 850 (869–894 MHz), E-GSM 900 (925–960 MHz), DCS 1800 (1805–1880 MHz), and PCS 1900
(1930– 1990 MHz) bands. The LNA inputs are matched to 150 or 200 Ω balanced-output SAW filters
through external LC matching networks. The active LNA input is automatically selected by the
ARFCN[9:0] bits and the BANDIND bit in Register 21h. If performing LNA swapping, the LNASWAP bit
in Register 05h is also needed. The LNA gain is controlled with the LNAG bit in Register 20h. A
quadrature image-reject mixer downconverts the RF signal to a low intermediate frequency (IF). The
mixer output is amplified with an analog programmable gain amplifier (PGA) that is controlled with the
AGAIN[2:0] bits in Register 20h. The quadrature IF signal is digitized with high resolution
analog-to-digital converters (ADCs).
The ADC output is downconverted to baseband with a digital quadrature local oscillator signal. Digital
decimation and FIR filters perform digital filtering, and remove ADC quantization noise, blockers, and
reference interferers. The response of the FIR filter is programmable to a flat passband setting
(FILTSEL = 0, Register 08h) and a linear phase setting (FILTSEL = 1, Register 08h). After filtering, the
digital output is scaled with a PGA, which is controlled with the DGAIN[5:0] bits in Register 20h.
The LNAG, AGAIN[2:0], and DGAIN[5:0] register bits should be set to provide a constant amplitude
signal to the baseband receive inputs.
Digital-to-analog converters (DACs) drive differential I and Q analog signals onto the BIP, BIN, BQP,
and BQN pins to interface to standard analog-input baseband ICs. The receive DACs are updated at
1.083 MHz and have a first-order reconstruction filter with a 1 MHz bandwidth. No special processing is
required in the baseband for dc offset compensation. The receive and transmit baseband I/Q pins are
multiplexed together in a 4-wire interface (BIP, BIN, BQP, and BQN). The common mode level at the
receive I and Q outputs is programmable with the DACCM[1:0] bits, and the fullscale level is
programmable with the DACFS[1:0] bits in Register 05h.
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PG-1810’s Aero II LNA inputs may be swapped. The low-band LNA inputs, RFIA and RFIE, are
interchangeable and may be used to receive either the GSM 850 or E-GSM 900 band. The high-band
inputs, RFID and RFIP, are interchangeable and may be used to receive either the DCS 1800 or PCS
1900 band. This flexibility enables radio designers to use one PCB layout for a phone design with only a
bill of materials and software change to address different regions.
For normal operation, the LNA swap bit should be set to zero; this is the default setting. In this default
mode, the native pin inputs and LNA are used for the corresponding frequency band. As an example,
the RFIA inputs and GSM 850 LNA are used for GSM 850 operation.
To implement LNA swapping with the Aero II transceiver, the LNA swap bit in register 05h is used.
The LNA swap bit should then be set to one. In LNA swapping mode, the non-native pin inputs and LNA
are used for the frequency band. As an example, the RFIA inputs and GSM 850 LNA are used for
E-GSM 900 operation.
4.2.3.2 Receiver Part
Antenna Swithch Module with SAW Filter : U301
FEM ( Front End Module ) consists of Tx filter, having an antenna port, and dual configuration with the
transmitting path isolated from the receiving path, and Rx saw filter. A signal receives from the antenna
of frequency band which is 881.5±12.5MHz for GSM850 bands, 1842.5±37.5 MHz for DCS bands, and
1960±30 MHz for PCS bands and transmits it to the saw filter for each band. The Tx filter passes
through the output signals of frequency band that is 836.5MHz ±12.5MHz for GSM850 bands,
1747.5±37.5 MHz for DCS bnads, and 1880 ±30 MHz for PCS bands from the power amplifier and
transmits it to the antenna. The maximum insertion loss is about 1.5 dB for the receiving bands at 25
o
C
and about 1.5 dB for the transmitting bands at 25
o
C.
SAW filter consist of the GSM850 band signals which range 881.5±12.5MHz, the DCS band signals
which range 1842.5±37.5, and the PCS bands that cover 1960±30MHz. it degrade other band signals
with high passing loss of 30~60 dB and maximum insertion loss is 2.6 dB
Fig.4-7. Receiver part PCB Layout
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4.2.4 Transmit Section
4.2.4.1 An Overview of Transmit Section
Fig.4-8. Transmitter block diagram
The transmit section consists of an I/Q baseband upconverter, an offset phase-locked loop (OPLL),
and two output buffers that can drive an external power amplifier (PA). One output is for the GSM 850
(824 – 849 MHz) and E-GSM 900 (880–915 MHz) bands and one output is for the DCS 1800
(1710–1785 MHz) and PCS 1900 (1850–1910 MHz) bands.
The OPLL requires no external filtering to attenuate transmitter noise and spurious signals in the
receive band, saving both cost and power. The output of the transmit VCO (TXVCO) is a
constant-envelope signal that reduces the problem of spectral spreading caused by non-linearity in the
PA. Additionally, the TXVCO benefits from isolation provided by the transmit output buffers. This
significantly minimizes any load pull effects and eliminates the need for off-chip isolation networks.
A quadrature mixer upconverts the differential in-phase (BIP, BIN) and quadrature (BQP, BQN)
baseband signals to an intermediate frequency (IF) that is filtered and which is used as the reference
input to the OPLL. The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully
integrated TXVCO.
Low-pass filters before the OPLL phase detector reduce the harmonic content of the quadrature
modulator and feedback mixer outputs.
The transmit I/Q interface must have a non-zero input no later than 94 quarter bits after PDN is
asserted for proper operation. If the baseband is unable to provide a sufficient TX I/Q non-zero input
preamble, then the CWDUR bits in Register 05h can be used to provide a preamble extension.
The receive and transmit baseband I/Q pins are multiplexed together in a 4-wire interface (BIP, BIN,
BQP, and BQN). In transmit mode, the BIP, BIN, BQP, and BQN pins provide the analog I/Q input from
the baseband subsystem. The full-scale level at the baseband input pins is programmable with the
BBG[1:0] bits in Register 05h. The transmit output path is automatically selected by the ARFCN[9:0] bits
and the BANDIND bits in Register 21h. As an option for multislot applications, direct control of the
output transmit buffers during a burst is offered through the PDTXO bit in Register 23h.
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4.2.4.2 Transmitter Part
A. 6dB attenuators : U304, U305
These passive components are adopted for PAM to operate in a stable output power.
B. Antenna Switch Module With SAW Filter : U301
These filters pass through the signals of which frequency band of 824~849MHz,
1710MHz~1785MHz, 1850MHz~1910MHz which is the transmit frequency of GSM850, DCS,
PCS system terminal, and it suppresses other images and spurious frequencies when the
terminal transmits GMSK modulated frequencies.
C. Power AMP Module(PAM) : U303
This device amplifies signals ahead of transmiting them through the antenna to provide a
sufficient RF power. It has amplification factor of 28dB and efficiency of about 53% typically in GSM
band and amplification of 27dB and efficiency of about 53% typically DCS/PCS band.
D. RF Switch connector : J301
RF Switch connector used to test Mainboard’s RF characteristics and to calibrate.
E. Antenna: Antenna Contact Plate : INT301
This device enables signals to be transmitted and received from BTS by Um interface.
External Antenna can be contacted with Mainboard through Antenna Contact Plate.
Fig.4-9. Transmit part PCB Layout
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4.2.5 Offset PLL
4.2.5.1 An Overview of Offset PLL
Fig.4-10. Si4210 Frequency Synthesizer Block Diagram
The Aero II transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop
filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs.
The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode. The IF PLL is
used only during transmit mode. All VCO tuning inductors are also integrated.
The IF and RF output frequencies are set by programming the N-Divider registers, NRF1, NRF2
and NIF. Programming the N-Divider register for either RF1 or RF2 automatically selects the proper
VCO. The output frequency of each PLL is as follows:
fOUT= N×fφ
The DIV2 bit in register 31h controls a programmable divider at the XIN pin to allow either a 13 or 26
MHz reference frequency. For receive mode, the RF1 PLL phase detector update rate (fφ ) should
be programmed fφ = 100 kHz for DCS 1800 or PCS 1900 bands, and fφ = 200 kHz for GSM 850
and E-GSM 900 bands. For transmit mode, the RF2 and IF PLL phase detector update rates are
always fφ =200 kHz.
4.2.5.2 VC-TCXO(Voltage Controlled Temperature Compensated Crystal Oscillator): U307
This is the mobile station’s reference frequency source. Its frequency is 26MHz, this signal is
applied to the XOUT Buffer in Si4210 and the XOUT Buffer provides the 26MHz system reference
clock.
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Fig.4-11. Top view of VCTCXO part on the PCB artwork
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Section 5. Alignment Procedure
5.1 Recommended Test Equipment
Model No. Description Maker Remark
E5515C
GSM Mobile Station
Test Set
Agilent Technologies
8593E Spectrum Analyzer Hewlett Packard
TDS 3054B Oscilloscope Tektronix
FLUKE 87 Digital Multimeter Fluke
E3630A DC Power Supply Hewlett Packard
Others Accessory
Interface Connectors
RF Connectors
5.2 Connection of Test Equipment
Fig.5-1. Test Set Configuration
RS-232C
PHONE
Coupler
8960 Test Set
8593E Spectrum
A
nalyzer
Power Supply
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SECTION 6. Equipment Repair Procedure
6.1.1 Power CHECK
1. Check battery power : 3.5V~4.2V.
2. Check to see if U202. CC201 pin voltage is same with battery power : CP100
BATTERY PACK
GND
Terminal
CP100
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3. Check to see if U202. A4_B4,T2_T3,P1_N1,D16 and T7 pin is 2.8V, 2.8V,1.8V, 2.75V and 1.8V :
CP101
CP101
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4. Check to see if U202.T14 and R121 pin becomes to 0V : CP102
Pressing “END” key to turn on equipment.
CP102
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6.1.2 Oscillation CHECK
1. Check to see if U201. A3 and B3 pin is oscillated(32.768KHz) : CP103
NO Check R205 and then replace X1
2. Check to see if U201.N10 and C201 pin Master Clock(26MHz). : CP104
NO Check C1.2 pin and then check the PCB pattern, soldering
CP103
CP104
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6.1.3 KEYPAD LED Not in Operation
1. Check to see if U121. 6 pin is around 2.8V : CP105
NO Check U201.
2. Check to see if U121. 3 pin or CC119 are around 3.3V : CP106
NO Check to see if U121. 1 pin is around : 3.5V ~ 4.2V .
NO Replace U121.
3. Check to see if D101~119 or around resistor are well operated by multimeter : CP107
NO Replace the LEDs or resistor.
CP105
CP106
CP107
CP105
CP106
CP107
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6.1.4 LCD Backlight Not in Operation (White)
1. Check to see if RV1’s Voltage (On LCD Module) is 2.8V and
C16’s Voltage (On LCD Module) is 3.5V~4.2V : CP108
Check to see if RV1’s Voltage (On LCD Module) is 4V : CP109
NO Replace U4 (On LCD Module)
Replace LCD Module.
CP108
CP109
CP109
CP108
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6.2 Audio Part ( Earpiece, Speaker, Hands-free Earphone, Microphone, Hands-free Mic )
6.2.1 No receiving tone heard ( Ear-piece )
1. Check C243, U202.J15(R219) and K15(R220) pins, C237 (Ear Signal) for waveform : CP110
NO Replace U202, and C243, C237.
2. Check to see Earpice and Mani FPCB
If you find out any defect, you replace them
CP110
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6.2.2 Melody or MP3 is not ringing
1. Check to see U117.D7, E1, J3 are 1.8V : CP 111
NO Check to see U201 or U114 cold solder,broken,short to the other PCB pattern or not
If you find out any defect, you replace it
2. Check to see L102, U302.C8 pin is Vbatt and C1, E8, H3 pin, CC106 are 2.8V : CP 112
NO Check to see U201 and U302 cold solder,broken,short to the other PCB pattern or not
If you find out any defect, you replace it
3. Check to see U117.E2 pin’s input Clock (26MHz) : CP113
NO Check to see U116 and U307 cold solder, broken,short to the other PCB pattern or not
If you find out any defect, you replace it
4. Check to see U117.B6, A65 pin’s output and C164, C166 ( 20 ~ 2000Hz ) : CP114
NO Check to see U117 cold solder, broken,short to the other PCB pattern or Not.
If you find out any defect, you replace it
5. Check to see U107 and U108.A1, B3 pin’s output ( 20 ~ 2000Hz ) : CP115
NO Check to see U107 and U108 cold solder, broken,short to the other PCB pattern or Not.
If you find out any defect, you replace it
6. Check to listen to sound : CP116
NO Check to see Speaker cold solder, broken,short to the other PCB pattern or Not.
CP112
CP113
CP114
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CP111
CP115
CP116
CP113
CP112
CP114
CP115
CP115 CP116
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6.2.3 No Receivng tone and melody or MP3 heard ( Hands-free Earphone )
Repeat CP 110 ~ 114
1. Check to see if U102.10 and C125 pins are 2.8V : CP117
2. Check U102.1, 2, 3, 4 pin for waveform : CP118
NO Check that U201 or U117 is cold solder, broken, short to the other
PCB pattern or not.
3. Check U102.5, 9 pin for waveform : CP119
NO Check that U102 is cold solder, broken, short to the other
PCB pattern or not.
4. Check R233 and R230, R231 is around 2.8V : CP120
5. Check R224 and R225 pin for waveform : CP121
NO Check that some R and C are cold solder, broken, short to the other
PCB pattern or not.
CP117
CP118 CP119
CP120
CP121
CP121
CP120
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6.2.4 Hook Switch not working
1. Check to see if R227 is 2.8V and Q203.B pin is around 1.56V : CP122
NO Check that U201, R227, Q203, R234, R235 are cold solder, broken, short to the other
PCB pattern or not.
If you find out any defect, you replace it
2. Check to see if Q203 .E and C pin are 0V during pressing Hook Switch : CP123
NO Check that Q203 is cold solder, broken, short to the other PCB pattern or not
If you find out any defect, you replace it
CP122
CP123
CP123
CP122
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6.2.5 Side Tone Not transmitted (Mic)
Repeat 6-2-1 No receiving tone heard.( Ear-piece )
1. Check to see if C250, R228 voltage is around 2.5V : CP124
2. Check to see if Mic + pin(S216, C257) is around 1.5V : CP125
NO Check that S216, C257, C250 and R228 are cold solder, broken, short to the other
PCB pattern or not
If you find out any defective part, you replace it.
Set to HP8960 to connect a call and tell to mic.
2. Check U201.P16 or C228 pin for wave form : CP126
NO Check that U201 is cold solder, broken, short to the other PCB pattern or not
or Replace MIC
If you find out any defective part, you replace it.
CP124
CP124
CP125
CP125
CP126
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6.2.6 Side Tone Not transmitted ( Hands-free Mic )
Repeat 6-2-2 No receiving tone heard.( Hands-free Earphone ).
1. Check that if R223 and C252 pin’s voltage is around 1.77V when the hands-set is connected:
CP127 ( If the hands-set is not connected that Voltage is around 0V. )
NO Check to see U202.N16 or R223, C252 cold solder, broken, short to the other
PCB pattern or not.
If you find out any defective part, you replace it.
Set to HP8960 to connect a call and tell to Hands-free mic.
2. Check to seeL201 and S213 pins for wave form : CP128
NO Check that U201 or L201 are cold solder, broken, short to the other PCB pattern or not
or Replace MIC
If you find out any defective part, you replace it.
CP127
CP128
CP128
CP127
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6.2.7 Vibrator not working
1. Check to see if U111.2 pin is 2.8V : CP129
NO Check to see U201
2. Check to see if U111.3 pin is 3.5 ~ 4.2V : CP130
NO Check to see U111 cold solder, broken, short to the other PCB pattern or not
If you find out any defect, you replace it
3. Check to see Vibrator and Mani FPCB
If you find out any defect, you replace them
CP129 CP130
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6.3 SIM and mini SD memory part
6.3.1 SIM error
1. Check to see if U109.17 pin is around 2.85V : CP131
NO Check to see U202.T6 pin and C239 cold solder, broken, short to the other PCB pattern
or not.
If you find out any defect, you replace it
2.Check to see U109.12, 13, and 15 pin for wave form : CP132
NO Check to see U109 , R151 and C159 cold solder, broken, short to the other PCB
pattern or not.
If you find out any defect, you replace it
CP131
CP132
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6.3.2 Mini SD memory error
1.
Check to see if J103.6 pin is around 2.8V : CP133
NO Check to see U202.B4 and A4 pin cold solder, broken, short to the other PCB pattern or
not.
If you find out any defect, you replace it
2. Check to see if J103.1 pin is around GND : CP134
NO Check to see U109 and R143 cold solder, broken, short to the other PCB pattern or not.
If you find out any defect, you replace it
3. Check to see J103.7, 5, 9, 10, 3 and 4 for wave form : CP135
NO Check to see U109, R137 , R138, R139, R140, R141 and R143 cold solder, broken,
short to the other PCB pattern or not
If you find out any defect, you replace it
CP135
CP133
CP134
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6.4 Charger part
6.4.1 Charging error
Insert adaptor into I/O jack and Battery.
1. Check to see if Q103.1, 5, 8, 9, 4 and Q201.1, 2 pin are 5.2V : CP136
NO Check to see J102.23, 24 pin and Q103 cold solder, broken, short to the other PCB
pattern or not.
If you find out any defect, you replace it.
2. Check to see Q201.3, 4, 7 and 8 are low (0V) : CP137
NO Check to see U202 and R121 cold solder, broken, short to the other PCB pattern or not
If you find out any defect, you replace it.
3. Check to see if Q201.5, 6 pin and R211 voltage are 3.5V ~ 4.2 : CP138
NO Check to see Q201 and R211 cold solder, broken, short to the other PCB pattern or not
If you find out any defect, you replace it.
CP136
CP137
CP138
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CP137
CP138
CP136
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6.5 Camera Sensor Part
6.5.1 Camera Preview error ( All items are On LCD Module )
1. Check to see if J1 and J01 connet correct
NO replace the J1 and J01
2. Check to see if U3.6 pin is around 2.8V : CP139
NO Check to see U1 cold solder, broken, short to the other PCB pattern or not.
If you find out any defect, you replace it.
3. Check to see if U3.3 pin and L2 are around 2.8V : CP140
NO Check to see U3, L2 and C24 cold solder, broken, short to the other PCB pattern or not.
If you find out any defect, you replace it.
4. Check to see if U2.1, 3 pin is oscillated (27MHz) : CP141
NO NO Check to see U2, C9, C10 and R5 cold solder, broken, short to the other PCB
pattern or not.
If you find out any defect, you replace it.
CP139
CP141
CP140
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CP140
CP139
CP141
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6.6 Bluetooth
1. Check to see U118.6 pin is 2.8V : CP 142
NO Check to see U201 cold solder,broken,short to the other PCB pattern or not
If you find out any defect, you replace it
2. Check to see U118.3 pin and CC109 voltage are 2.8V : CP 143
NO Check to see U118 and CC109 cold solder,broken,short to the other PCB pattern or not
If you find out any defect, you replace it
3. Check To see Audio Gateway is enabled.Check to see if U113.8,9 and U115.8,9 pin are low
and U113.2 pin(PCM CLK), U110.4 pin(PCM SYNC) : CP144
NO Check to see cold solder, broken,short to the other PCB pattern or not
If you find out any defect, you replace it
4. Check to see R157 Clock (32.768KHz) : CP145
NO Check to see X101 cold solder,broken,short to the other PCB pattern or not
If you find out any defect, you replace it
5. Check to see U119 cold solder,broken,short to the other PCB pattern or not
If you find out any defect, you replace it
CP143
CP142
CP144
CP144
CP144
CP144
CP144
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CP145
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6.7 RF Part
6.7.1 Test conditions
1. Test condition 1 : VBAT = 3.8V during all tests
2. Test condition 2 : Traffic channel :GSM850 Band
Tx mode
Ch190
Power Level : 13
3. Test condition 3 : Traffic channel : DCS Band
Tx mode
Ch698
Power Level : 10
4. Test condition 4 : Traffic channel :GSM850 Band
Rx mode
Ch190
Input power : -70dBm
5. Test condition 5 : Traffic channel : DCS Band
Rx mode
Ch698
Input power : -70dBm
6. Test condition 5 : Traffic channel : PCS Band
Tx mode
Ch662
Input power : -70dBm
7. RF power values are measured using 50Ωcoaxial cable.
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6.7.2 Power Supply Check Point _ TEST CONDITION 1
1. Check to see U302.3 and 5 pin’s Voltage are 2.8V : CP 146
NO Check to see U201 and U302 cold solder,broken,short to the other PCB pattern or not
If you find out any defect, you replace it
2. Check to see U307.1 pin’s Voltage is around 0.5 ~ 1.5V and U307.4 pin Voltage is 2.75V : CP 147
NO Check to see U202 cold solder,broken,short to the other PCB pattern or not
If you find out any defect, you replace it
3. Check to see U307.3 pin’s output Clock (26MHz) : CP148
NO Check to see U307 cold solder, broken,short to the other PCB pattern or not
If you find out any defect, you replace it
4. Check to see C325, C331 and C332 and U306.11, 12, 13, 28, 29 pin’s Voltage are 2.8V : CP149
NO Check to see U302, C325, C331 and C332 cold solder, broken,short to the other PCB
pattern or
Not.
If you find out any defect, you replace it
5. Check to see CC301 and U303.2, 6, 17 pin’s Voltage are 3.5V ~ 4.2V : CP150
NO Check to see CC301 and U303 cold solder, broken,short to the other PCB pattern or not
If you find out any defect, you replace it
CP146
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CP147
CP148
CP149
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CP150
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6.7.3 RF Transceiver _ TEST CONDITION 2, 3, 4, 5, 6, 7
1. Check to see C333 and U302.31 pin’s Clock are 26MHz : CP151
NO Check to see U307 and U302 cold solder,broken,short to the other PCB pattern or not
If you find out any defect, you replace it
2. Check to see C324, C326, C238 and U302.1, 2, 3 pin’s signal : CP 152
NO Check to see U201, U302 cold solder, broken, short to the other PCB pattern or not
If you find out any defect, you replace it
3. Check to see C329 and U307.9 pin’s Voltage is Low (GND) : CP153
NO Check to see U201, U302 cold solder, broken, short to the other PCB pattern or not
If you find out any defect, you replace it
CP151 CP152
CP153
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6.7.4 Power Amplifier Module_ TEST CONDITION 2, 3, 4, 5, 6, 7
1. Check to see U303.3 and 4 pin’s input power around 3 dBm : CP154
NO Check to see U306, U305 and U304 cold solder,broken,short to the other
PCB pattern or not
If you find out any defect, you replace it
2. Check to see C308, U303.18 pin’s Voltage (2.8 V) and C309, U303.20 pin Voltage (0~1.3V) : CP 155
NO Check to see U201, U303, C308 and C309 cold solder, broken, short to the other
PCB pattern or not
If you find out any defect, you replace it
C314 and U303.1 pin’s voltage are Low(GND), PCS/DCS mode is operating. Else
EGSM/GSM850 mode is operating
CP154
CP155
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6.7.5 Antenna Switch Module with SAW Filter _ TEST CONDITION 2, 3, 4, 5, 6, 7
6.7.5.1. RX Parat
1. Check to see U301.9 and 11 pin’s Voltage are GND : CP 156
NO Check to see C304, C305, U201 and U301 cold solder,broken,short to the other
PCB pattern or not
If you find out any defect, you replace it
2. Check to see U301.13 pin’s power and one’s power of EGSM(U301.1, 2pin), DCS(U301.3,4 pin),
PCS(U301.5, 6pin) is same : CP 157
NO Check to see U301 cold solder,broken,short to the other PCB pattern or not
If you find out any defect, you replace it
6.7.5.2. TX Parat
1. Check to see U301.9 and 11 pin’s Voltage are 2.8V : CP 156
NO Check to see C304, C305, U201 and U301 cold solder,broken,short to the other
PCB pattern or not
If you find out any defect, you replace it
2. Check to see U301.13 pin’s power is around 30dBm : CP 158
NO Check to see U202 cold solder,broken,short to the other PCB pattern or not
If you find out any defect, you replace it
CP156
CP157
CP158
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