Electrostatically Sensitive (ES) Devices
3 About lead free solder (PbF)
4 Self-check function
4.1. How to access
4.2. Screen display
4.3. Display phenomenon and treatment method
5 Chassis Board Layout
6 Before servicing
6.1. Kind and location of the flexible cable
6.2. How to remove the connector
7 Disassembly for Service
7.1. Rear cover
7.2. AP-BOARD
7.3. DG-Board
7.4. V-Board
7.5. Speaker (L, R)
7.6. B-Board
7.7. K-Board
7.8. BL-Board
7.9. LCD panel
8 Adjustment method
8.1. How to enter into adjustment mode
8.2. Cancellation
8.3. Contents of adjustment mode
8.4. Video level adjustment
10
11
13
13
14
14
15
16
19
19
19
19
20
3
3
4
5
5
5
5
6
7
7
8
9
9
8.5. Flicker Adjustment
8.6. MTS Adjustment
9 Conductor Views
9.1. AP-Board
9.2. DG-Board (TC-17LA1)
9.3. DG-Board (TC-20LA1)
9.4. B, BL, K and V-Board
10 Block and Schematic Diagram
10.1. Schematic Diagram Notes
10.2. Power Block Diagram
10.3. Signal Block Diagram
10.4. AP-Board (1 of 3) Schematic Diagram
10.5. AP-Board (2 of 3) Schematic Diagram
10.6. AP-Board (3 of 3) Schematic Diagram
10.7. DG-Board (1 of 3) (For TC-17LA1) Schematic Diagram
10.8. DG-Board (2 of 3) (For TC-17LA1) Schematic Diagram
10.9. DG-Board (3 of 3) (For TC-17LA1) Schematic Diagram
10.10. DG-Board (1 of 3) (For TC-20LA1) Schematic Diagram
10.11. DG-Board (2 of 3) (For TC-20LA1) Schematic Diagram
10.12. DG-Board (3 of 3) (For TC-20LA1) Schematic Diagram
10.13. B, BL, K, and V-Board Schematic Diagram
11 Parts Location & Mechanical Replacement Parts List
11.1. Parts Location
11.2. Packing Exploded View
11.3. Mechanical Replacement Parts List
12 Replacement Parts List
12.1. Replacement Parts List Notes
12.2. Electrical Replacement Parts List
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28
29
31
31
32
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36
37
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39
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2
TC-17LA1 / TC-20LA1
1Safety Precautions
1.1.General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1.Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M9 and 5.2M9.
When the exposed metal does not have a return path to the
chassis, the reading must be
Figure 1
.
1.1.2.Leakage Current Hot Check (See
Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5k9, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
3
TC-17LA1 / TC-20LA1
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
3About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
stamped on the back of PCB.
4
TC-17LA1 / TC-20LA1
4Self-check function
When phenomena like "the power fails from time to time" or "the video/audio fails from time to time" can not be confirmed at the
time of servicing, the self-check function can be used to confirm the occurrence and to limit the scope for the defective circuits.Also,
when "the power fails from time to time", display on the screen can be used to confirm the occurrence and to limit the scope for
the defective circuits.
Any programmed channels, channels caption data and some other user defined settings will be erased and return to factory setting.
4.1.How to access
4.1.1.Access
Produce TV reception screen and, while pressing [VOLUME-] button on the main unit, press [SLEEP] button on the remote
controller unit simultaneously.
4.1.2.Exit
When one of the buttons for channel selection etc. is pressed, the display returns to the normal screen.
4.2.Screen display
4.3.Display phenomenon and treatment method
Display symbolPhenomenon/conditionTreatment method
H10No output of video and audio.Replace tuner (TNR001A (B-BOARD)).
H21No audio output. Surround function not effective.Replace IC2300 (AP-BOARD).
F30No video and audio output. Input switching disabled.Replace IC3000 (AP-BOARD).
H34Black and white stripes pattern. Enhanced back light.Replace IC4003 (DG-BOARD).
H35No videoReplace IC6400 (DG-BOARD).
H36No videoReplace IC6300 (DG-BOARD).
H90Power interrupted with self-check.Replace IC1002 (DG-BOARD).
* Any button operation or switching off the power will reset the self-check data.
5
TC-17LA1 / TC-20LA1
5Chassis Board Layout
Board NameFunction
AP-BoardAudio, Power, Inverter, AV SW
B-BoardTuner
BL-BoardInverter
DG-BoardGC2, PCN, MICOM, EEPROM
K-BoardSwitch
V-BoardRemote sensor, LED
2.<TC-20LA1 only>
Remove the screw (1 pcs) and the screws (4 pcs) and
detach the lock hinge plate.
1.Remove the rear cover.
2.<TC-20LA1 only>
Remove the screw (1 pcs) and the screws (4 pcs) and
detach the lock hinge plate.
3.Remove the screw (1 pcs) and disconnect the couplers (V2
and V3) and the flexible cable (V9) and detach the V-Board.
Caution:
PCB Fixing screws driving torque: 0.2-0.3 N·m (2-3kg·mm)
Do not tighten screws so hard.
3.Remove the screw (1 pcs) and the screws (6 pcs) and
disconnect the couplers (V2 and V3) and the Speakers (L,
R).
Caution:
PCB Fixing screws driving torque: 0.2-0.3 N·m (2-3kg·mm)
Do not tighten screws so hard.
13
TC-17LA1 / TC-20LA1
7.6.B-Board
1.Remove the rear cover.
2.Remove the screw (1 pcs) and the screws (4 pcs) and
detach the lock hinge plate.
3.Remove the screw (1 pcs) and disconnect the couplers (B2
(AP2) and B3 (AP3)) between B-Board and the AP-Board.
Caution:
PCB Fixing screws driving torque: 0.2-0.3 N·m (2-3kg·mm)
Do not tighten screws so hard.
7.7.K-Board
1.Remove the rear cover.
2.Remove the screws (6 pcs) and the screws (2 pcs) (TC20LA1) / (1 pcs) (TC-17LA1) and detach the shield plate
and Inverter plate (U, D).
14
3.Disconnect the coupler (AP8) and disengage the hook (2
pcs) and detach the K-Board.
TC-17LA1 / TC-20LA1
7.8.BL-Board
1.Remove the rear cover.
2.Remove the screws (6 pcs) and the screws (2 pcs) (TC20LA1) / (1 pcs) (TC-17LA1) and detach the shield plate
and Inverter plate (U, D).
Caution:
PCB Fixing screws driving torque: 0.2-0.3 N·m (2-3kg·mm)
Do not tighten screws so hard.
15
TC-17LA1 / TC-20LA1
3.Disconnect the couplers (AP10, BL4 and BL6) and remove
the screws (2 pcs) and detach the BL-Board.
7.9.LCD panel
1.Remove the rear cover.
2.Remove the screws (6 pcs) and the screws (2 pcs) (TC20LA1) / (1 pcs) (TC-17LA1) and detach the shield plate
and Inverter plate (U, D).
Caution:
PCB Fixing screws driving torque: 0.2-0.3 N·m (2-3kg·mm)
Do not tighten screws so hard.
16
TC-17LA1 / TC-20LA1
3.Disengage the shaft holder hook and detach the power
button shaft.
5.<TC-20LA1 only>
Remove the screw (1 pcs) and the screws (4 pcs) and
detach the lock hinge plate.
4.Disconnect the coupler (AP8) and detach the circuit board
K bracket with K-Board.
6.Remove the screw (1 pcs) and disconnect the couplers (B2
(AP2) and B3 (AP3)) between B-Board and the AP-Board.
17
TC-17LA1 / TC-20LA1
7.Disconnect the couplers (AP4, AP6, BL4 and BL6) and the
flexible cable (AP9 and DG3 (TC-20LA1)/ DG4, DG5 (TC17LA1)) and remove the screws (7 pcs) and detach the APBoard, DG-Board and BL-Board.
Caution:
PCB Fixing screws driving torque: 0.2-0.3 N·m (2-3kg·mm)
Do not tighten screws so hard.
8.Remove the screws (2 pcs), detach the LCD panel.
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