Power Transistor Arrays (F-MOS FETs)
PU7457
Silicon N-Channel Power F-MOS FET (with built-in zener diode)
■ Features
●High avalanche energy capacity
●High electrostatic breakdown voltage
●No secondary breakdown
●High breakdown voltage, large allowable power dissipation
●Allowing Low-voltage drive
■ Applications
●Contactless relay
●Diving circuit for a solenoid
●Driving circuit for a motor
●Control equipment
●Switching power supply
■ Absolute Maximum Ratings (T
Parameter
Drain to Source breakdown voltage
Gate to Source voltage
DC
Drain current
Pulse
Avalanche energy capacity
Allowable power
dissipation
Non repetition
TC = 25°C
Ta = 25°C
Channel temperature
Storage temperature
*
L = 5mH, IL = 3A, 1 pulse
Symbol
V
DSS
V
GSS
I
D
I
DP
EAS
P
D
T
ch
T
stg
*
= 25°C)
C
Ratings
100 ± 15
±20
22.5
150
−55 to +150
±3
±9
15
3.5
Unit
V
V
A
A
mJ
W
°C
°C
25.3±0.2
8.0
9.5±0.2
1.65±0.2
0.5±0.15
4.4±0.5
C1.5±0.5
1.0±0.25
2.54±0.2
9✕2.54=22.86±0.25
13572468
10-Lead Plastic SIL Package
Internal Connection
357
2
468
910
unit: mm
4.0±0.2
G: Gate
D: Drain
S: Source
9
0.8±0.25
0.5±0.15
101
■ Electrical Characteristics (T
Parameter
Drain to Source cut-off current
Gate to Source leakage current
Drain to Source breakdown voltage
Gate threshold voltage
Drain to Source ON-resistance
Forward transfer admittance
Diode forward voltage
Input capacitance (Common Source)
Output capacitance (Common Source)
Reverse transfer capacitance (Common Source)
Turn-on time
Fall time
Turn-off time (delay time)
C
Symbol
I
DSS
I
GSS
V
DSS
V
th
R
DS(on)1
R
DS(on)2
| Yfs |
V
DSF
C
iss
C
oss
C
rss
t
on
t
f
t
d(off)
= 25°C)
Conditions
VDS = 80V, VGS = 0
VGS = ±20V, VDS = 0
ID = 1mA, VGS = 0
VDS = 10V, ID = 1mA
VGS = 10V, ID = 2A
VGS = 4V, ID = 2A
VDS = 10V, ID = 2A
IDR = 3A, VGS = 0
VDS = 10V, VGS = 0, f = 1MHz
VGS = 10V, ID = 2A
VDD = 50V, RL = 25Ω
min
85
1
2.5
typ
300
400
4
130
160
25
0.2
0.3
1.5
max
10
±10
115
2.5
450
600
−1.6
Unit
µA
µA
V
V
mΩ
mΩ
S
V
pF
pF
pF
µs
µs
µs
1
Power Transistor Arrays (F-MOS FETs) PU7457
Area of safe operation (ASO) PD Ta EAS T
100
30
I
DP
10
)
A
(
I
D
D
3
1ms
1
10ms
100ms
0.3
Drain current I
0.1
0.03
0.01
1 10 100 10003 30 300
Non repetitive pulse
=25˚C
T
C
DC
Drain to source voltage VDS (V
IAS L-load ID V
10
3
)
I
D
A
(
1
t=100µs
22.5mJ
TC=25˚C
24
)
W
(
20
D
16
12
8
4
Allowable power dissipation P
0
0 16040 12080 14020 10060
)
Ambient temperature Ta (˚C
(1) TC=Ta
(2) With a 50 × 50 × 2mm
Al heat sink
(3) Without heat sink
(1)
(2)
(3)
)
GS
8
7
6
)
A
(
5
D
VDS=10V
T
=25˚C
C
25
)
mJ
(
20
15
10
5
Avalanche energy capacity EAS
0
25 15012550 10075
Junction temperature Tj (˚C
6
)
5
V
(
th
4
Vth T
j
ID=3A
)
C
VDS=10V
I
=1mA
D
0.3
0.1
Avalanche current IAS
0.03
0.01
1 3 10 30 100
L-load (mH
8
7
=10V
V
GS
6
)
A
(
Drain current I
5
D
4
3
2
1
0
060504010 3020
4V
ID V
DS
3.5V
Drain to source voltage VDS (V
4
3
Drain current I
2
1
0
0654132
)
3V
2.5V
15W
)
Gate to source voltage VGS (V
R
I
DS(on)
600
)
Ω
(
500
DS(on)
400
300
200
100
Drain to source ON-resistance R
0
0 4.01.0 3.02.0 3.50.5 2.51.5
D
V
=4V
GS
10V
Drain current ID (A
)
TC=25˚C
)
3
2
1
Gate threshold voltage V
0
0 15012510025 7550
Case temperature TC (˚C
)
S
(
|
| Yfs | I
5
VDS=10V
=25˚C
T
C
4
fs
3
2
1
D
Forward transfer admittance |Y
0
0 4.01.0 3.02.0 3.50.5 2.51.5
Drain current ID (A
)
)
2