Power Transistor Arrays (F-MOS FETs)
PUB4702
Silicon N-Channel Power F-MOS FET
■ Features
●Avalanche energy capacity guaranteed
●High-speed switching
●Low ON-resistance
●No secondary breakdown
●Low-voltage drive
●Incorporating built-in zener diodes
■ Applications
●Contactless relay
●Diving circuit for a solenoid
●Driving circuit for a motor
●Control equipment
●Switching power supply
■ Absolute Maximum Ratings (T
Parameter
Drain to Source breakdown voltage
Gate to Source voltage
Drain current
DC
Pulse
Avalanche energy capacity
Allowable power
dissipation
TC = 25°C
Ta = 25°C
Channel temperature
Storage temperature
*
L = 5mH, IL = 1A, 1 pulse
Symbol
V
V
I
D
I
DP
EAS
P
D
T
ch
T
stg
DSS
GSS
*
= 25°C)
C
Ratings
35 ± 10
−55 to +150
±15
±1
±2
2.5
15
3.5
150
Unit
V
V
A
A
mJ
W
°C
°C
9.5±0.2
1.65±0.2
C1.5±0.5
8.0
4.4±0.5
25.3±0.2
0.5±0.15
1.0±0.25
2.54±0.2
9✕2.54=22.86±0.25
13572468
10-Lead Plastic SIL Package
910
unit: mm
4.0±0.2
0.8±0.25
0.5±0.15
G: Gate
D: Drain
S: Source
■ Electrical Characteristics (T
Parameter
Drain to Source cut-off current
Gate to Source leakage current
Drain to Source breakdown voltage
Gate threshold voltage
Drain to Source ON-resistance
Forward transfer admittance
Diode forward voltage
Input capacitance (Common Source)
Output capacitance (Common Source)
Reverse transfer capacitance (Common Source)
Turn-on time
Fall time
Turn-off time (delay time)
C
Symbol
I
DSS
I
GSS
V
DSS
V
th
R
DS(on)1
R
DS(on)2
| Yfs |
V
DSF
C
iss
C
oss
C
rss
t
on
t
f
t
d(off)
= 25°C)
Conditions
VDS = 25V, VGS = 0
VGS = ±15V, VDS = 0
ID = 1mA, VGS = 0
VDS = 10V, ID = 1mA
VGS = 10V, ID = 0.5A
VGS = 4V, ID = 0.5A
VDS = 10V, ID = 0.5A
IDR = 1A, VGS = 0
VDS = 10V, VGS = 0, f = 1MHz
VGS = 10V, ID = 0.5A
VDD = 25V, RL = 50Ω
min
25
1
0.6
typ
220
390
1
135
85
50
120
390
800
max
10
±10
45
2.5
380
680
−1.5
Unit
µA
µA
V
V
mΩ
mΩ
S
V
pF
pF
pF
ns
ns
ns
1
Power Transistor Arrays (F-MOS FETs) PUB4702
Area of safe operation (ASO) PD Ta ID V
10
3
I
DP
)
A
(
D
1
0.3
Non repetitive pulse
=25˚C
T
C
100ms
10ms
Drain current I
0.1
0.03
Drain to source voltage VDS (V
R
I
DS(on)
)
700
mΩ
(
600
DS(on)
500
400
300
200
100
0
Drain to source ON-resistance R
Ta=150˚C
85˚C
054132
25˚C
D
V
GS
Drain current ID (A
t=1ms
=4V
)
16
)
14
W
(
D
12
10
8
6
4
2
Allowable power dissipation P
301010.3 3
)
0
0 16040 12080 14020 10060
Ambient temperature Ta (˚C
2.5
)
S
(
|
2.0
fs
1.5
1.0
0.5
(1) TC=Ta
(2) With a 50 × 50 × 2mm
Al heat sink
(3) Without heat sink
(1)
(2)
(3)
| Yfs | I
D
VDS=10V
Ta=25˚C
)
Forward transfer admittance |Y
0
0 2.00.5 1.51.0
Drain current ID (A
)
2.00
1.75
1.50
)
A
(
1.25
D
1.00
0.75
Drain current I
0.50
0.25
0
054132
Gate to source voltage VGS (V
C
iss
3
10
)
,
)
pF
(
rss
,C
Common source
(
oss
,C
iss
C
)
2
10
, Output capacitance
)
Common source
(
Common source
(
Input capacitance
Reverse transfer capacitance
10
0252051510
Drain to source voltage VDS (V
, C
oss
, C
GS
VDS=10V
Ta=25˚C
)
V
rss
DS
f=1MHz
Ta=25˚C
C
iss
C
oss
C
rss
)
2
10
)
˚C/W
(
10
(t)
th
1
Thermal resistance R
–1
10
–4
10
2
R
t
th(t)
Notes: Rth was measured at Ta=25˚C
and under natural convection.
Without heat sink
–3
–2
10
Time t (s
–1
10
1
1010
)