Page 1
This product complies with the RoHS Directive (EU 2002/95/EC).
ESD Diodes
MAZWxxxHG Series
Silicon planar type
For surge absorption circuit
■ Features
•
Two elements anode-common type
■ Package
•
Code
SSSMini3-F2
•
Pin Name
1: Cathode 1
2: Cathode 2
■ Absolute Maximum Ratings Ta = 25°C
Parameter Symbol Rating Unit
Total power dissipation
Junction temperature T
Storage temperature T
Note)*:P
= 150 mW achieved with a printed circuit board.
tot
*
P
tot
j
stg
150 mW
150 °C
−55 to +150 °C
3: Anode 1, 2
■ Internal Connection
3
1
2
■ Common Electrical Characteristics Ta = 25°C ± 3°C
Parameter Symbol Conditions Min Typ Max Unit
Zener voltage
Zener rise operating resistance R
Zener operating resistance R
Reverse current I
Note) 1. Measuring methods are based JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. Electrostatic breakdown voltage is ±10 kV
3.
*
Test method: IEC1000-4-2 (C = 150 pF, R = 330 Ω, Contact discharge: 10 times)
: The temperature must be controlled 25°C for VZ mesurement.
*
VZ value measured at other temperature must be adjusted to VZ (25°C)
VZ guaranted 20 ms after current flow.
V
ZK
R
I
Z
Z
Z
I
Z
I
Z
V
Specified value V
Specified value Ω
Specified value Ω
Specified value µA
R
Refer to the list of the
electrical characteristics
within part numbers
Publication date: September 2007 SKE00035AED
1
Page 2
This product complies with the RoHS Directive (EU 2002/95/EC).
0
2
0
MAZWxxxHG Series
■ Electrical characteristics within part numbers Ta = 25°C ± 3°C
Zener operating
resistance
(Ω)
ZK
VRIZ = 5 mA IZ = 0.5 mA
2
10
= 25°C
T
a
)
10
mA
(
F
1
−1
Forward current I
MAZW120HG
10
IF V
I
Z
Reverse current
(DC)
Zener voltage
Part number Marking symbol
VZ (V) IR (µA) RZ (Ω)R
Min Nom Max (mA) Max (V) Max Max
MAZW062HG 5.8 6.2 6.6
5 0.2 4 50 100 62
MAZW068HG 6.4 6.8 7.2 5 0.1 4 30 60 68
MAZW082HG 7.7 8.2 8.7 5 0.1 5 30 60 82
MAZW100HG 9.4 10.0 10.6 5 0.05 7 30 60 10
MAZW120HG 11.4 12.0 12.7 5 0.05 9 30 60 12
Note) 1. The VZ value is the one after power application for 20 ms at Ta = 25°C.
2. The zener voltage temperature coefficient is the one for Tj = 25°C to 150°C.
P
T
tot
250
)
200
mW
(
tot
150
100
50
Total power dissipation P
a
10 mm
K
Print foil
t = 0.035 mm
10 mm
0.8 mm
2
10
A
T
10
)
mA
(
1
Z
−1
10
Zener current I
−2
10
= 25°C
a
IZ V
MAZW082HG
MAZW068HG
MAZW062HG
Z
MAZW100HG
F
0
020
Ambient temperature Ta (°C
RZ I
2
10
)
Ω
(
Z
10
MAZW082HG
1
Z
MAZW062HG
MAZW120HG
MAZW100HG
MAZW068HG
1601208040
T
= 25°C
a
)
Zener operating resistance R
−1
10
11010
Zener current IZ (mA
2
)
−3
10
12
)
10
mV / °C
(
Z
S
8
6
4
2
Temperature coefficient of zener voltage
0
0 10203040506
2
468101214
Zener voltage VZ (V
SZ I
Zener current IZ (mA
Z
= 25°C to 150°C
T
a
MAZW120HG
MAZW100HG
MAZW082HG
MAZW068HG
MAZW062HG
)
)
SKE00035AED
−2
10
0 0.2 0.4 0.6 1.00.8 1.
Forward voltage VF (V
Ct V
30
)
pF
(
t
20
MAZW068HG
10
Terminal capacitance C
0
0
R
MAZW062HG
MAZW082HG
MAZW100HG
MAZW120HG
4812
Reverse voltage VR (V)
T
)
= 25°C
a
Page 3
This product complies with the RoHS Directive (EU 2002/95/EC).
MAZWxxxHG Series
SSSMini3-F2
1.20
0.30
3
1
(0.4)
±0.05
+0.05
−0.02
(0.4)
Unit: mm
±0.05
0.20
±0.05
±0.05
0.80
1.20
5°
2
0.20
+0.05
−0.02
0.13
+0.05
−0.02
0.80
±0.05
5°
(0.27)
±0.04
(0.5)
0.51
0 to 0.05
SKE00035AED
3
Page 4
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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