Page 1
This product complies with the RoHS Directive (EU 2002/95/EC).
50 Ω 50 Ω
5.5 Ω
D.U.T.
I
F
I
R
0.25 × I
R
t
rr
Fast Recovery Diodes (FRD)
MA2DF31
Silicon mesa type
For high frequency rectification
Features
Super high speed switching characteristic: trr = 20 ns (typ.)
Low noise type
Package
Code
TO-220D-B1
Pin Name
Absolute Maximum Ratings Ta = 25°C
Parameter Symbol Rating Unit
Repetitive peak reverse voltage V
Non-repetitive peak reverse surge voltage V
1
Forward current (Average)
*
Non-repetitive peak forward surge current
Junction temperature T
Storage temperature T
Note) *1: TC = 25°C
2: 50 Hz sine wave 1 cycle (Non-repetitive peak current)
*
RRM
RSM
I
F(AV)
2
*
I
FSM
j
stg
300 V
300 V
5 A
30 A
+150
-40 to +150
°C
°C
1: Cathode
2: Anode
Marking Symbol: MA2DF31
Electrical Characteristics Ta = 25°C±3°C
Parameter Symbol Conditions Min Typ Max Unit
Forward voltage V
Reverse current I
Reverse recovery time
*
Thermal resistance (j-c) R
Thermal resistance (j-a) R
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage of
current from the operating equipment.
3. *: trr measurement circuit
RRM
t
rr
th(j-c)
th(j-a)
IF = 5 A 1.0 1.3 V
F
V
= 300 V 20
RRM
IF = 0.5 A, IR = 1.0 A
Irr = 0.25 A
20 30 ns
3.0
63
mA
°C/W
°C/W
Publication date: December 2008 SKJ00023AED 1
Page 2
This product complies with the RoHS Directive (EU 2002/95/EC).
0 1.00.5 2.01.5
10
2
10
1
10
−1
10
−2
10
−3
MA2DF31_ IF-V
F
Forward current I
F
(A)
Forward voltage VF (V)
Ta = 150°C
25°C
0
100
300200
400
10
−4
10
−3
10
−2
10
−5
10
−6
10
−7
10
−8
10
−9
MA2DF31_ IR-V
R
Reverse current I
R
(A)
Reverse voltage VR (V)
25°C
Ta = 150°C
0
10
3020
40
120
160
200
80
40
0
MA2DF31_ Ct-V
R
Terminal capacitance C
t
(pF)
Reverse voltage VR (V)
Ta = 25°C
0
200
400
600
0 100
400300
200
Reverse voltage VR
(V)
Reverse power dissipation (Average) P
R(AV)
(m
W
)
DC
0.9
0.8
0.5
MA2DF31_ P
R(AV)-VＲ
t
p
T
I
F
0
2
4
6
0 2
86
4
Forward current (Average) I
F(AV)
(A)
Forward power dissipation (Average) P
F(AV)
(W)
DC
0.5
0.2
0.1
0.05
MA2DF31_ P
F(AV)-IF(AV)
t
p
T
I
F
0
2
4
6
0 50
150
100
Case temperature TC
(°C)
Forward current (Average) I
F(AV)
(A)
tp / T
DC
0.5
0.2
0.1
0.05
MA2DF31_ I
F(AV)-TC
Tj = 150
°C
VR = 300 V
t
p
T
I
MA2DF31
IF VF IR VR Ct V
P
R(AV)
V
P
R
F(AV)
I
F(AV)
I
F(AV)
T
R
C
2 SKJ00023AED
Page 3
This product complies with the RoHS Directive (EU 2002/95/EC).
TO-220D-B1 Unit: mm
1.5
+0
−0.4
Solder Dip
4.2 ±0.2
13.7 ±0.2 15.0 ±0.5
2.9 ±0.2
2.6 ±0.1
0.55 ±0.15
4.6 ±0.2
9.9 ±0.3
1.4 ±0.2
0.8 ±0.1
2.54 ±0.30
5.08 ±0.50
1 2
3.0 ±0.5
φ3
.
2
±
0
.
1
0
MA2DF31
SKJ00023AED 3
Page 4
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20080805
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