• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2Warning
2.1.Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacturer's Instructions.
2.2.About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
The frequency range of 1.92 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same frequency. Refer to Frequency Table (P.64).
4.1.1.TDD Frame Format
4.1.2.TDMA system
This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 µs, the 10 ms of voice data is transmitted.
• 2 - Handsets Link
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.
A voice signal from TEL line is encoded to digital data "TXDATA" by DSP (IC501) in a base unit.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a handset RF, RF signal is received in two antennas.
RFIC (IC701) compares RF signal levels and selects the antenna to be used. Then RFIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
DSP (IC501) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
A voice signal from microphone is encoded to digital data "TXDATA" by DSP (IC501) in a handset.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a base unit RF, RF signal is received in two antennas.
RFIC (IC701) compares RF signal levels and selects the antenna to be used. Then RFIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
DSP (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
(DSP, EEPROM) is a digital speech/signal processing system that implements all the functions of speech compression and
memory management required in a digital telephone.
The DSP system is fully controlled by a host processor DSP. The host processor provides activation and control of all that functions as follows.
• DTMF Generator
The DTMF detection is implemented by the DSP system in software.
The DTMF detection is performed during Line Monitoring modes of operation.
When the DTMF data from the handset is received, the DTMF signal is output.
• Caller ID demodulation
The DSP implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
• Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the Telephone line, etc. They are determined by the signal path route operation of voice signal.
This circuit is used to initialize the microcomputer when it incorporates an AC adaptor.
Circuit Operation:
When the AC Adaptor is inserted into the unit, then the voltage is shifted by IC331 and power is supplied to the DSP.
The set starts to operate when VCC goes up to 3.0 V or more in the circuit voltage diagram.
Note:
(*1) The initializing time of the DSP chip is 28 ms under normal conditions.
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
T → L101 → R111 → C111 → Q111 → DSP pin 58 [BELL]
When the CPU (DSP) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T → L101 → D101 → Q141 → Q161 → R163 → R167 → D101 → L102 → P101 → R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an onhook condition.
Pulse Dial Circuit:
Pin 59 of DSP turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of DSP.
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 86 of IC501. There is no parallel connection if the voltage is
1.65 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:
When off hook, the voltage is monitored at pin 90 of IC501; the presence/absence of a parallel connection is determined when
the voltage changes by 0.2 V or more.
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used.
The Caller-ID data from exchange is supplied to the telephone using either method of FSK or DTMF. The method is chosen
according to the exchange of telephone office. This unit is available to receive the data with both methods and displays the
received data on LCD.
• FSK (Frequency Shift Keying) format
• DTMF format
It is the method to send the telephone number of calling party with DTMF to the telephone. DTMF is sent before the first bell signal.
The data is sent in turn; first the start code, secondly the telephone number of calling party, lastly end code.
The DTMF is chosen from A (1633 Hz and 697 Hz), B (1633 Hz and 770 Hz), C (1633 Hz and 852 Hz) and D (1633 Hz and 941
Hz) as the start code and end code according to the exchange.
When the handset is put on the cradle of the base unit, the power is supplied from CHARGE+ and CHARGE- terminals to
charge the battery via R366 or Q361. The voltage between CHARGE+ and CHARGE- flows Q531 → pin 38 of IC501, where the
charge is detected. Then IC501 calculates the battery consumption amount from the previous charge, and it controls Q361/
Q362/Q364 by pin 42 of IC501 until charging is complete. When charging is complete, the control pattern is switched to Trickle
charging form from Operational charging form.
The voice signal from the microphone is input to DSP (90, 91). Also the power for the microphone is supplied from DSP (92) and
the power is turned OFF on standby.
4.7.6.Reception Signal
The voice signal from the base unit is output to DSP (98). This signal is led to R435 and drives the speaker, and the other signal
output from DSP (97) drives the speaker.
RF part includes Transmitter and Receiver functions. Digital signals (Mainly voice data) that come from DSP, are modulated and
are transmitted. On the other hand, received signals are demodulated and go out to DSP.
4.8.1.Power Supply Circuit
As indicated below, the various voltages are supplied to each block.
V_PA, about 3.2 V at base unit or 3.1 V at handset, is supplied to the Power amplifier.
IC741 is 3.0 V at base unit or 2.7 V at handset Regulator and outputs VRF (3.0 V at base unit or 2.7 V at handset) by order of
RADIO_EN signal.
V_RF is approximately 4.0 V (Base Unit) or 3.1 V (Handset).
The voltage from the AC adaptor is supplied to the charge circuits. Main charge (180~250 mA at the Battery) of maximum 7hours is started soon after the handset is placed on the charger unit. Then it changes to Trickle charge to prevent from overcharging.
Charging form
The route for this is as follows: DC+pin of J1(+) → F1 → D1 → R1 → CHARGE+pad → Handset → CHARGE-pad → DC-pin of
The battery strength may not be indicated correctly if the
battery is disconnected and connected again, even after it is
fully charged. In that case, by recharging the battery as
mentioned above, you will get a correct indication of the
battery strength.