14 HOW TO CHECK THE HANDSET SPEAKER
15 FREQUENCY TABLE (MHz)
16 EXPLANATION OF CPU DATA COMMUNICATION
16.1. STAND-BY -> TALK, TALK -> STAND-BY
16.2. Ringing
16.3. Changing the Channel
16.4. Ports for transmitting and receiving of data
16.5. Waveform of DATA used for cordless transmission and
reception
17 B LOCK DIAGRAM (BASE UNIT)
22
24
24
25
25
26
26
27
28
28
29
29
30
32
32
32
32
33
34
34
35
36
37
37
38
2
Page 3
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
18 B LOCK DIAGRAM (HANDSET) 39
19 CIRCUIT OPERATION
19.1. Outline
19.2. Power Supply Circuit
19.3. Reset Circuit (Base Unit)
19.4. Charge Circuit
19.5. Telephone Line Interface
19.6. DTMF
19.7. Transmitter/Receiver
19.8. Signal Route
20 CIRCUIT OPERATION (HANDSET)
20.1. Reset Circuit (Handset)
20.2. Battery Low / Power Down Detector
21 CPU DATA (Base Unit)
21.1. IC2
22 CPU DATA (Handset)
22.1. IC2
23 RF IC (Base Unit and Handset)
23.1. IC1
24 HOW TO REPLACE FLAT PACKAGE IC
24.1. Preparation
24.2. Procedure
24.3. Modification Procedure of Bridge
40
40
41
42
43
43
43
44
46
47
47
48
49
49
50
50
51
51
52
52
52
52
25 C ABINET AND ELECTRICAL PARTS LOCATION (BASE UN IT)
26 C ABINET AND ELECTRICAL PARTS LOCATION (HANDET)
27 ACCESSORIES AND PACKING MATERIALS
28 REPLACEMENT PARTS LIST
28.1. Base Unit
28.2. Handset
28.3. ACCESSORIES AND PACKING MATERIALS
29 FOR SCHEMATIC DIAGRAM
29.1. Base Unit (SCHEMATIC DIAGRAM (Base Unit))
29.2. Handset (SCHEMATIC DIAGRAM (Handset))
30 SCHEMATIC DIAGRAM (Base Unit)
30.1. Base Unit
30.2. RF Unit (Base Unit)
31 SCHEMATIC DIAGRAM (Handset)
31.1. Handset
31.2. RF Unit (Handset)
31.3. Memo
32 CIRCUIT BOARD (Base Unit)
32.1. Component View
32.2. Flow Solder Side View
33 CIRCUIT BOARD (Handset)
33.1. Component View
33.2. Flow Solder Side View
53
54
55
56
56
58
60
61
61
61
62
62
63
64
64
65
66
67
67
68
69
69
70
3
Page 4
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
• PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
• •
temperature control and adjust it to 700°F ± 50° F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
•
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• •
•
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
• •
and be sure that any remaining is melted prior to applying the Pb solder.
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
• •
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
Page 5
1.2. How to recognize that Pb Free solder is used
1.2.1. Base Unit Main PCB
IC5
JK1
PbF
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
(Component View)
Note:
The location of the "PbF" marks is subject to change without notice.
1.2.2. Handset PCB
DPX1
(Component View)
Note:
The location of the "PbF" marks is subject to change without notice.
Marked
IC2
PbF
Marked
5
Page 6
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
3 CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer´s Instructions.
6
Page 7
4 BATTERY
4.1. Recharge
4.2. Battery information
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
7
Page 8
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
5 BATTERY REPLACEMENT
8
Page 9
6 LOCATION OF CONTROLS
6.1. Base Unit
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
6.2. Handset
9
Page 10
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
7 CONNECTION
•
• USE ONLY WITH Panasonic AC ADAPTOR PQLV16AL.
• •
•
• The AC adaptor must remain connected at all times.
• •
(It is normal for the adaptor to feel warm during use.)
•
• This unit will not function during a power failure.
• •
If you want to connect a standard telephone on the same line, use a T-adaptor.
•
• KX-TC2000NZ is not designed to be used with rotary (pulse dialling) services.
• •
10
Page 11
For Service Hint:
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
11
Page 12
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
8 OPERATIONS
8.1. Making Calls
8.2. Answering Calls
12
Page 13
8.3. Storing Phone Numbers in Memory
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
8.4. Storing a Phone Number in the DIRECT Button
13
Page 14
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
8.5. Dialing a Stored Number
8.6. Dialing the Stored Number in the DIRECT Button
63, 4, 5, 6Main P. C. BoardScrew (2.6 × 12)........................(E) × 1
Tape and solder.
Main P. C. Board.
17
Page 18
KX-TC200 0NZB / KX-TC2000NZW / KX-TC200 0NZ F
10 TROUBLESHOOTING GUIDE
Cross Reference:
Check Power (P.19)
Bell Reception (P.20)
Check Battery Char ge (P.21)
Check Link (P.22)
Check Handset Transmission (P.24)
Check Handset Reception (P.24)
18
Page 19
10.1. Check Power
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
Cross Reference:
Reset Circuit (Base Unit) (P.42)
Power Supply Circuit (P.41)
Cross Reference:
Charge Circuit (P.43)
*: Each measurement points are shown in CIRCUIT BOARD (Base Unit) (P.67) or CIRCUIT BOARD (Handset) (P.69)
Note:
CPU: IC2
Note:
CPU: IC2
19
Page 20
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
10.2. Bell Reception
Cross Reference:
Check Link (P.22)
Telephone Line Interface (P.43)
Cross Reference:
Check Link (P.22)
*: Each measurement points are shown in CIRCUIT BOARD (Base Unit) (P.67) or CIRCUIT BOARD (Handset) (P.69)
Note:
CPU: IC2
20
Page 21
10.3. Check Battery Charge
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
Cross Reference:
Charge Circuit (P.43)
Power Supply Circuit (P.41)
Cross Reference:
Reset Circuit (Handset) (P.47)
*: Each measurement points are shown in CIRCUIT BOARD (Base Unit) (P.67) or CIRCUIT BOARD (Handset) (P.69)
Note:
CPU: IC2
Note:
CPU: IC2
21
Page 22
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
10.4. Check Link
**: Refer to Adjustment (P.26)Note:
CPU: IC2
RF IC: IC1
*: Each measurement points are shown in CIRCUIT BOARD (Base Unit) (P.67) or CIRCUIT BOARD (Handset) (P.69)
22
Page 23
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
**: Refer to Adjustment (P.29).Note:
CPU: IC2
RF IC: IC1
*: Each measurement points are shown in CIRCUIT BOARD (Base Unit) (P.67) or CIRCUIT BOARD (Handset) (P.69)
23
Page 24
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
10.5. Check Handset Transmission
Cross Reference:
Signal Route (P.46)
10.6. Check Handset Reception
Cross Reference:
Signal Route (P.46)
*: Each measurement points are shown in CIRCUIT
BOARD (Base Unit) (P.67) or CIRCUIT BOARD (Handset)
(P.69)
24
Page 25
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
11 ADJUSTMENTS (BASE UNIT)
If your unit have below symptoms, adjust or confirm each item using remedy colum n from the table.
SymptomRemedy*
The base unit dose not respond to a call from handset.Make confirmation in item (A)
The base unit dose not transmit or the transmit f requency is off.Make adjustments in item (B)
The transmit frequency is off.Make adjustments in item (C)
The transmit power output is low, and the operating distance between the base unit and
the handset is less than normal.
The reception sensitivity of base unit is low with noise.Make confirmation in item (E)
The transmit level is high or low.Make confirmation in item (F)
The reception level is high or low.Make confirmation in item (G)
The unit does not link.Make confirmation in item (H)
*: Refer to Adjustment (P.26).
11.1. Test Mode Flow Chart (Base Unit)
The operation-flow of Test mode and main check items are shown below.
Make adjustments in item (D)
Note:
**: Refer to the above table.
25
Page 26
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
11.2. How to change the channel
*: Refer to Flow Solder Side View (P.68).
11.3. Adjustment
Adjustment Items Test ModeAdjustment
(A)RX VCO
Confirmation
(B)TX VCO
Adjustment
(C)TX Frequency
Adjustment
(D)TX Power
Adjustment
(E)RX Sensitivity
Confirmation
(2nd IF output)
(F) Line Output Level
Confirmation
(G)Line Input
Modulation
Confirmation
(H)Noise Squelch
Confirmation
3ch Talk-
3ch TalkT6
3ch TalkVC1
3ch TalkT5
3ch TalkT2 1. Apply 60dBuVemf output from S.S.G. (modulation frequency 1KHz, dev.
3ch Talk- 1. Apply 60dBuVemf output from S.S.G. (modulation frequency 1KHz, dev.
3ch Talk- 1. Input via loop simulator 1.0KHz, -20dBm (measured at T-R) signal.
3ch Talk- 1. Measure the SSG output level when the noise squelch changes from Low
Point
•
• Confirm so that the reading of the Digital Voltmeter is 2.0V ± 1.0V.
• •
•
• Adjust T6 so that the reading of the Digital Voltmeter is 2.0V ± 0.3V.
• •
•
• Adjustment VC1 so that the reading of the frequency counter is
• •
30.1750MHz ± 100Hz.
•
• Adjust T5 so that the reading of the RF VTVM is more than 9dBm.
• •
0KHz).
2. Confirm that the reading of RF VTVM is the maximum value (more than
20mV)
3KHz).
2. Confirm that the reading of AF VTVM is more than 120mV (600Ω load).
2. Apply 60dBuVemf output from S.S.G. (modulation frequency 1KHz, dev.
0KHz).
3. Confirm so that the reading of FM Deviation Meter is 2.8KHz ±0.3KHz.
to High.
2. Confirm that the SSG output level is -10 ~ +5dBuVemf.
*ProcedureCheck or
* : The connection of adjustment equipment are as shown in Adjustment Standard (Base Unit) (P.27).
SSG Frequency: 39.875 MHz
Replace
Parts
IC1, L10,
C26, R14
IC1, DV1,
T6
IC, X1, T6,
DV1, C35,
C40, VC1
IC1, Q3,
Q4, Q5,
T5, DPX1
DPX1, T2,
CF1, CF2
IC1, Q11
IC1, DV1
IC1, DPX1
26
Page 27
11.4. Adjustment Standard (Base Unit)
When connecting the Simulator and Equipments for checking, please refer to the illustration below.
Q5
C83
C124
C57
Q2
(G)
(C)
(D)
R154
R40
ZD5
R52
R45
R38
R36
R54
Audio
Analyzer
27
DC12V or
AC adaptor
AF OSC
Loop
SIMULATOR
AF Volt Meter (F)
ZD10ZD12
R160
R161
ZD11
R132
Q14
TXPOWERTXGND
C136
R175
C5
C96
C99
D11
Q17
R131
R120
R145
R138
R137
C14
Q25
FM Deviation
Meter
Frequency
Counter
RF
Volt Meter
50Ω
SSG
48.86MHz
C133
C62
C46
C47
R56
C56
R53
R42
C49
C51
R130
Q4
R111
C58
R48
R181
C123
ZD3
C59
R43
R35
R37
C53
R55
Q3
C60
R46
C55
R41
R33
D8
R198
C122
R116
R124
C52
R44
C48
C110
R51
C54
R155
R80
D1
R49
C40
R15
R16
C31
C45
R110
C61
Q6
R112
C29
R50
C125
R30
R86
Confirmation of VCO voltage
DC Volt Meter
(A), (B)
TX-VCORX-VCO
C6
R12
C23
R23
C39
C22
C44
1
C34
C109
C19
R25
R32
C36
R26
R22
R14
C26
R60
C27
C43
C35
C37
R31
R24
R148
R149
R183
IC1
R170
Q20
C101
C7
C33
R19
R20
R21
C93
R2
C79
C11
R143
R150
R13
R166
C16
C10
C24
C121
RF Volt
Meter
C9
R10
R6
R100
C86
R117
C120
R139
(E)
T.P ( CH change at test mode)
R108
C74
R406
R405
C65
R153
R134
R177
R178
R96
C107
R93
C88
R74
R140
C75
R105
Q402
LED1
R409
Q21
1
Q16
R407
C402
R76
R85
R179
R94
R81
R18
Q13
R79
C84
R408
R167
IC2
R78
C70
R410
R63
R158
R89
R77
Q403
R75
R115
R157
C135
R401
C92
R119
Q11
R122
R133
R59
R87
C90
R129
R159
R403
R404
C401
R402
R146
R84
C108
C85
Q401
R82
R123
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
R126
R58
R1
C2
C8
R156
C67
R3
R5
C4
R7
C12
C18
R8
C73
R97
C63
R180
C28
R4
C25
R88
R103
C134
Q7
R114
R68
C64
C106
R185
R57
R109
C77
R197
R83
R62
R141
C82
IC3
R104
1
C69
R90
R95
C72
Note: (A) - (H) is refered to ADJUSTMENTS (BASE UNIT) (P.25)
Oscilloscope(H)
Page 28
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
12 ADJUSTMENTS (HANDSET)
If your unit have below symptoms, adjust or confirm each item using remedy column from the table.
SymptomRemedy*
The movement of Battery Low Indicator is wrong.Make confirmation in item (A)
The base unit does not respond to a call from the handset.Make adjustments in item (B)
The base unit does not transmit or the transmit frequency is off.Make confirmation in item (C)
The transmit frequency is off.Make adjustments in item (D)
The transmit power output is low, and the operating distance between the base unit and
the Handset is less than normal.
The reception sensitivity of the handset is low with noise.Make confirmation item (F)
Does not link between the base unit and the handset.Make confirmation in item (G)
The reception level is high or low.Make confirmation item (H)
The transmit level is high or low.Make confirmation in item (I)
*: Refer to Adjustment (P.29).
Unit condition:
1. Remove the antenna lead wire from P.C Board of the handset.
2. Power Supply: DC 3.9V (DC power supply)
3. Volume: HIGH (When P.C. Board of handset is in test mode, volume condition is medium. Press “LOCATOR” key once.)
4. Speaker Load: 150Ω
CHTX FrequencyRX Frequency
CH339.875MHz30.175MHz
Make confirmation in item (E)
12.1. Test Mode Flow Chart (Handset)
Note:
Refet to CIRCUIT BOARD (Handset) (P.69)
Signal Route (P.46)
28
Page 29
12.2. How to change the channel
12.3. Adjustment
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
Adjustment Items Test ModeAdjustment
(A) Battery Low
Confirmation
(B) TX VCO
Adjustment
(C) RX VCO
Confirmation
(D) TX Frequency
Adjustment
(E) TX Power
Confirmation
(F) RX Sensitivity
Confirmation
(2nd IF output)
(G) Noise Squelch
Confirmation
(H) Speaker
Output Level
Confirmation
(I) Mic Modulation
Factor
Confirmation
(J) Data
Modulation
Confirmation
(K) Battery low
Confirmation
3ch Talk- 1. Adjust the power supply voltage to DC3.60V,and confirm so that the
3ch TalkT6 1. Adjust T6 so that the reading of the Digital Voltmeter is 1.5V ± 0.3V.IC1, X1,
3ch Talk- 1. Confirm so that the reading of the Digital Voltmeter is 0.7 ~ 3.0V.IC1, X1,
3ch TalkVC1
3ch Talk-
3ch TalkT3 1. Apply 60dBuVemf output from S.S.G. (modulation frequency 1KHz, dev.
3ch Talk- 1. Measure the SSG output level when the noise squelch changes from
3ch Talk- 1. Apply 60dBuVemf output from S.S.G. (modulation frequency 1KHz, dev.
3ch Talk- 1. Apply a MIC signal (1KHz, 5.0mV at 600Ω load).
3ch Talk-
-- 1. Apply 3.50V between BATT(+) and BATT(-).
Point
ProcedureCheck or
reading of oscillosope is High.
2. Adjust that power supply voltage to DC 3.40V, and confirm so that the
reading of oscilloscope is Low.
•
• Adjust VC1 so that the reading of the frequency counter is 39.8750MHz
• •
± 100Hz.
•
• Confirm so that the reading of the RF VTVM is more than -3.0dBm
• •
(50Ω load).
0KHz).
2. Confirm that the reading of RF VTVM is the maximum value (more than
15mV).
Low to High. (modulation frequency 1KHz, dev.3kHz)
2. Confirm that the SSG output level is -18 ~ 0dBuVemf.
3KHz).
2. Confirm that the reading of AF VTVM is more than 30mV.
(distortion: less than 5%) (volume High).
2. Confirmation so that the reading of FM Deviation Meter is 3.4KHz ±
0.4KHz.
•
• Confirm for 5.0 ± 1.0KHz FM Deviation Meter reading.
• •
2. Confirm that there is no flashing of RECHARGE LED.
3. Apply 3.40V between BATT(+) and BATT(-).
4. Confirm that there is flashing of RECHARGE LED.
Replace
Parts
IC1
T6, DV1
L6, C24
IC1,
DPX1, T5
IC1,Q3,Q4,
Q5, DPX1
DPX1,
T3,IC1,
CF1, CF2
IC1, DPX1
IC1
IC1, DV1
IC1
The connections of adjustment equipment are as shown in Adjustment Standard (Handset) (P.30).
SSG Frequency: 30.175 MHz
29
Page 30
12.4. Adjustment Standard (Handset)
When connecting the Simulator and Equipments for checking, please refer to the illustration below.
(Component View)
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
30
C37
REC
C56
C51
L1
DV1
VC1
C43
150Ω
C42
AF Volt Meter (H)
X1
R101
R11
C31
T6
C15
L6
T5
L200
R106
C29
R28
C38
C23
R14
C26
CF1
C27
T3
R21
R93
C34
C77
C76
R108
R94
R95
R110
C8
DPX1
C18
C75
C12
R109
C1
CF2
Q1
T1
C32
R16
C16
C9
R5
C30
R18
R8
R6
R46
R98
R37
C64
R87
R74
C73
R78
R99
C69
C72
R86
R85
R39
Q4
D1
R30
R29
C79
R102
R23
R103
C33
BZ1
R3
C14
R55
D3
R63
C78
R42
R17
R61
R20
Q3
Q2
Q7
R19
R22
C39
R54
R105
R56
Q8
Q12
C58
R48
R107
C46
R70
X3
C45
X2
R58
R69
R77
R67
R66
R57
R12
R79
R62
R71
R72
R112
R59
R80
R73
IC2
C66
R81
C65
R83
C84
C68
C71
C70
C67
R84
R96
R82
R64
C74
R76
R53
R75
R65
R111
R68
R60
Q11
L3
C63
R36
ZD1
C80
CHG+CHG-
L5
47µF
C86
ZD3
L4
+
-
BATT1
C48
Q9
L2
L7
(A) Battery Low
AFGenerator
(G) Noise Squelch
Oscilloscope
Note: (A)-(I) is refered to ADJUSTMENTS (HANDSET) (P.28)
Page 31
(Flow Solder Side View)
31
TX VCO
DC Volt Meter(B)
Audio
Analyzer
(E)
(D)
(I), (J)
SSG
43.820MHz
RF Millivolt
Meter
Frequency
Counter
FM Deviation
Meter
R52
C62
Q6
C57
R44
R40
R38
C52
C61
R50
R24
C40
C59
R45
C4
R49
C60
R41
C36
C49
C10
R47
C41
50Ω
(F)
RF
Volt Meter
TXPOWERTXGND
C55
R43
R97
C50
Q5
C53
R51
C44
C47
R200
C201
C54
R35
R34
C35
R26
C24
C88
C3
C202
Q200
C200
C17
R1
R25
C203
R201
C6
C5
IC1
C28
C89
C7
C22
C2
C21
R13
C85
C13
R9
R113
R10
DIRTAUTO
TALK
LED5
R2
3
21
LED2
6
LED1
K11
45
9
LED4
LED3
78
#
0
REDIALRINGER
FLASH
PAUSE
LOUDPROG
CH
MIC1
LED6
RX VCO
DC Volt Meter(C)
Note: (A)-(I) is refered to ADJUSTMENTS (HANDSET) (P.28)
DC Power
Supply
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
Page 32
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
13 RF SPEC IFICATION
13.1. Base Unit
ItemValueRefer to -.*Remarks
TX Frequency30.175MHz ± 100HzADJUSTMENTS (BASE UNIT) (C)at CH3
TX Powermore than 1mWADJUSTMENTS (BASE UNIT) (D)at CH3
Line Modulation factor2.5 kHz~3.1 kHzADJUSTMENTS (BASE UNIT) (G)
Data Modulation factor4.5 kHz~7.5 kHz—
Line Output levelmore than 120mV—
*: Refer to Adjustment (P.26).
13.2. Handset
ItemValueRefer to -.**Remarks
TX Frequency39.875 MHz ± 0.1kHzADJUSTMENTS (HANDSET) (D)at CH3
TX Powermore than 1mWADJUSTMENTS (HANDSET) (E)at CH3 (Antenna
Data Modulation factor5.0 kHz~6.0 kHzADJUSTMENTS (HANDSET) (J)at CH3
MIC Modulation factor2.9 kHz/dev~3.8 kHz/devADJUSTMENTS (HANDSET) (I)at CH3 (MIC terminal
SP Output levelmore than 30mV—
soldering point 50Ω
Load)
2.4mV Input)
**: Refer to Adjustment (P.29).
14 HOW TO CHECK THE HANDSET SPEAKER
1. Prepare the digital voltmeter, and set the selector knob to ohm meter.
2. Put the probes at the speaker terminals as shown below.
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KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
15 FREQUENCY TABLE (MHz)
BASE UNITPORTABLE UNIT
ChannelTransmit FrequencyReceive FrequencyTransmit FrequencyReceive Frequency
16.5. Waveform of DATA used for cordless transmission and reception
The DATA which is transmitted from the Handset to the Base Unit is combination of DATA 0, DATA 1, PSEUD.
The DATA which is transmitted from the Base Unit to the Handset is combination of DATA 0, DATA 1, PSEUD.
16.5.1. Handset
16.5.2. Base Unit
•
• For example (one of part of data)
• •
37
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17 BLOCK DIAGRAM (BASE UNIT)
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
38
H/S
DUPLEXER
DPX1
RX LOOP
TX LOOP
RF AMP
Q3,Q4, T5
ANTENNA
X1
RX VCO
L10, C26
RF AMP
Q1, T2
POWER
CONTROL
Q2
TX VCO
Q5, T6, DV1
VC1
10.7MHz450kHz
RF FILTER
CF1, CF2
RF IC
MIX 1/2
PLL OSC
DC 5V
IC1
RF
-DATA
-CLK
-STB
EXP
COM
X2
17
14
TELEPHONE LINE
INTERFACE
TEL
LINE
AMP
Q11, IC3
POWER SUPPLY
RESET CHARGE
5V
REGULATOR
Q18, Q19
TEL
LINE
SW
T7
DIODE
BRIDGE
D2, D3,
D4, D5
DC IN
12V 150mA
(AC Adaptor)
AC DOWN
DTC
Q402,Q403
TEL LINE
DC 5V
CONTROL LINE
AUDIO SIGNAL
LED
Q21, LED1
VTXRF
TX
DATA
-DATA
-CLK
-STB
RX
DATA
CPU
IC2
RESET
DTC
Q401
CHARGE
DTC
Q7
CHARGE
CONTROL
Q14, Q17
Q24, Q25
DC 12V
CHARGE
TERMINAL
KX-TC2000NZB/W/F BLOCK DIAGRAM (BASE UNIT)
Page 39
18 BLOCK DIAGRAM (HANDSET)
39
Base
DUPLEXER
DPX1
RX LOOP
TX LOOP
RF AMP
Q5, T5
Q200
ANTENNA
X1
RX VCO
L6, C24
RF AMP
Q1, T3
POWER
CONTROL
Q4
TX VCO
Q6, T6, DV1
VC1
MIX 1/2
PLL OSC
DC 3.9V
RF FILTER
CF1, CF2
RF IC
IC1
RF
-DATA
-CLK
-STB
EXP
COM
X3
SPEAKER
REC1
MIC
MC1
DIODE
BRIDGE
Q9
DC 3.9V
CONTROL LINE
AUDIO SIGNAL
BATTERY
3.9V
LED
Q8, LED 1-4
KEY BOARD
VTX
TX
DATA
RF
-DATA
-CLK
-STB
DATA
CPU
IC2
RX
RESET
Q11
CHARGE
DTC
IC2 PING37
BUZZER
Q7, BZ1
Q12
DIODE
BRIDGE
D1
CHARGE
TERMINAL
KX-TC2000NZB/W/F BLOCK DIAGRAM (HANDSET)
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
Page 40
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
19 CIRCUIT OPERATION
19.1. Outline
Base unit consists of the following ICs as shown in BLOCK DIAGRAM.
•
• CPU:IC2
• •
−
− Controlling the whole system
− −
−
− Forming/analyzing all data signals (ACK, CMD signal etc.*)
− −
−
− All interfaces (ex: LED, KEY, SP, Mic, LCD, Detector Circuit (Charge/ Power Down)
− −
*Refer to EXPLANATION OF CPU DATA COMMUNICATION (P.34).
•
• RF IC:IC1
• •
−
− PLL Oscillator
− −
−
− Detection
− −
−
− Compress/ Expander
− −
−
− first/ second mixer
− −
−
− Amplifier for transmission and reception
− −
•
• Additionally,
• •
−
− Power Supply Circuit
− −
−
− Reset Circuit
− −
−
− Charge Circuit
− −
−
− Telephone Line Interface Circuit
− −
Handset consist of the following ICs as shown in BLOCK DIAGRAM.
•
• CPU: IC2
• •
−
− All data signals (forming/analyzing ACK or CMD signal*)
− RAM for keeping the data (CH Number, ID Code, etc.)
− −
•
• RF IC:IC1
• •
−
− PLL Oscillator
− −
−
− Detector
− −
−
− Compress/Expander
− −
−
− first, second mixer
− −
−
− Amplifier for transmission and reception
− −
*Refer to EXPLANATION OF CPU DATA COMMUNICATION (P.34).
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KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
19.2. Power Supply Circuit
The power supply to the CPU (Digital, Analog) and RF IC from AC Adaptor (+12V) is shown in the diagram below.
The base unit power supply is DC12V. The handset´s power is supplied from 3.6V battery (Nickel-Cadmium battery) which is
installed in the handset.
Power supply for transmitter is turned on by a press of "Talk" key on the handset. During the stand-by mode, the unit stops
transmitting but receives the signal.
Also during on-hook condition (the handset is placed on the base unit), backup power for memory of the last dialed number is
supplied through the battery. The memory of this unit is not backed up by the current from
the telephone line.
The base unit DC power supply is regulated by Q18, the CPU power is regulated by Q19. The Q401, Q403 detects AC Adaptor
power failure and maintains the unit security code.
Fig. 1
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KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
19.3. Reset Circuit (Base Unit)
After power supply from AC adaptor, the below circuit is for making reset signal. Refer to the below waveform.
Fig. 2
Fig. 3
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KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
19.4. Charge Circuit
Circuit Operation:
When charging the handset on the base unit, the charge current is as follows;
→ L5 →
CHG-(Handset)] → CHG-(Base) → L5,
In this way, the CPU on both unit detects the fact that the battery is charged.
The charge current is controlled by switching Q24, Q25 of Base Unit. The battery is charged in normal mode for 15 hours and
then in trickle mode.
19.5. Telephone Line Interface
Function:
•
• Bell signal detection
• •
•
• ON/OFF hook and pulse dial circuit
• •
•
• Side tone circuit
• •
Bell signal detection and OFF HOOK circuit:
In the idle mode, Q103 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
JK1 (3): T → L6 → R184 → R144 → IC3D (12,13 → 14) → C97 → R148 → Q20 → IC2 (24) [BELL]
JK1 (2): R → L4 → R183 → R152 →↑
When the CPU (DSP) detects a ring signal and press the TALK Key on the handset. Q6 turns on and then RY1 turns on,
thus providing an off-hook condition (active DC current flow through the circuit) and the following signal flow is for the loop
current.
T → R160 → L4 → D2 → RY1 → R107 → T7 → R116 → D5 → L6 → R161 → R[OFF HOOK]
ON HOOK Circuit:
Q6 is open, RY1 disconnected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-hook
condition.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal.
As for this unit, TX signal feed back from Q11 is canceled by the cancellor circuit of AGC.
19.6. DTMF
The DTMF signal is generated by five outputs of IC2 (CPU) and output to telephone line through the filter of IC3A which is a
lowpass filter as shown below.
The combination of five outputs “1”, “0” makes 32 (=2
generator.
5) level signals and makes smooth waveform after filter like a DTMF
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KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
19.7. Transmitter/Receiver
Base Unit and Handset are mainly consists of RF(Radio Frequency) IC and CPU.
Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency.
Signal Pass :
*Refer to CDL TX/RX in Signal Route (P.46).
19.7.1. Base to Handset
Circuit Operation:
The voice signal input from the TEL LINE interface goes to RF IC as shown in
BLOCK DIAGRAM (BASE UNIT) (P.38).
In the talk mode (off-hook) condition, the telephone line voice signal passes through D2, D3, D4, D5, RY1 (Relay), R107 and
T7.
The other party´s voice signal is coupled with T7 and amplified by Q11 and led to IC3-B (OP Amplifier device).
And the signal goes through the compressor of RF IC, it is output to transmitter circuit.
The signal of the data sent to the handset is applied in the anode of the variable capacitor diode (VARICAP : DV1).
The capacitor of VARICAP is changing in accordance with the voice signal from telephone line interface or TX DATA signal from
CPU. Therefore, the carrier frequency which is generated by TXVCO will be changing, and Frequency modulated RF
signal is generated and amplified by RF AMP(Q3, Q4, T5). It pass through the Duplexer DPX1 and radiated from Antenna.
The signal is transmitted from the base unit and received by the handset antenna and amplified by RF amplifier (Q1) through
DPX1 as shown in BLOCK DIAGRAM (HANDSET) (P.39). And then it is converted to 10.7 MHz and 455 KHz Intermediate
frequency by RF IC and related components.
The demodulated audio signal is output from RF IC (DET OUT) and passed through "Expander" process to reduce noise, then
voice signal amplified by "Receiver amplifier" is output to receiver (REC1).
The receiver loudness is adjustable using "LOUD" key on the handset. Q2 and Q3 control the volume. When CPU (VOL1)
becomes low, the volume becomes "MID", while CPU (VOL1, 2) become low, the volume becomes "HIGH".
TX data (to Handset)
CPU (VTX) becomes low to turn on the transmission power transistor Q2, and CPU (TX-data) sends data signal. It is
FM-modulated by TXVCO and driven by RF AMP, then transmitted to the handset.
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KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
19.7.2. Handset to Base
Circuit Operation:
The voice signal from the handset user is picked up by the microphone (MC1), voice signal passes through "Compressor"
process to reduce noise as shown in BLOCK DIAGRAM (HANDSET) (P.39). And the voice is FM-modulated by
VARICAP (DV1).
The carrier frequency is generated by TX VCO. The transmitter power transistor Q4 is turned on/off by CPU (VTX).
The carrier signal is amplified by RF AMP and sent to the handset duplexer and antenna.
The signal of 39MHz band (39.775~40.000MHz) which is input from ANT is filtered at DPX1 as shown in
BLOCK DIAGRAM (BASE UNIT) (P.38), then it is input to RF IC.
The signal input to RF IC is converted through Mixer inside of RF IC, RF filter (CF1, CF2) and Expander.
The signal is transmitted from the handset and received by the base unit antenna and amplified by RF amplifier Q1, then
it is converted to10.7 MHz and 450 KHz Intermediate by RF IC. The demodulated audio signal is output from RF IC
(DET OUT) and passed through "Expander" process to reduce noise, then voice signal is led to LINE AMP. The signal is
passed through TELEPHONE INTERFACE and Tel-line.
RX data (from Handset):
The data signal from handset (ex: Talk, ACK, COM) is also included in 39 MHz band same as the voice data. After second if
filter, the data signal is made square shape by data limiting AMP of the RF IC. RX data is output to CPU (RX Data).
19.7.3. RF signal operation/control and PLL operation (RF UNIT)
Base unit radio frequency signal received by antenna passes through duplexer (DPX1).
RF signal is amplified by RF AMP. RF signal received from RF IC is mixed with RX local frequency at Mixer to generate
10.7 MHz wide band IF. The reference frequency is generated by X1 11.150 MHz crystal. VC1 is the reference frequency
for adjustment. The 10.7 MHz is mixed with reference and 450KHz narrow band IF is generated. The demodulation audio signal
is adjusted to the maximum at T1. RF IC is controlled by CPU (RF_STB, DATA, CLK). The RX local frequency is generated
by RXVCO.
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KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
19.8. Signal Route
Each signal route is as follows.
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KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
20 CIRCUIT OPERATION (HANDSET)
20.1. Reset Circuit (Handset)
The power of handset is supplied by battery.
Whenever the battery is recharged or inserted, the impulse at CHG+ becomes Reset signal through Q11, and sent to CPU.
Fig. 4
Fig. 5
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KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
20.2. Battery Low / Power Down Detector
Circuit Operation:
“Battery Low” and “Power Down” are detected by RF IC which check the voltage from battery. Shortly, every detected blocks
are inside of RF IC. The detected voltage is as follows;
•
• Battery Low
• •
Battery voltage : V(Batt) < 3.457V
The CPU detects this level and “Recharge battery” LED starts flashing.
•
• Power Down
• •
Battery voltage : V(Batt) < 3.0V
The output of RF IC (P-DOWN) becomes low level, then CPU stops working to keep the data (CH number, ID Code, etc.)
Fig. 6
48
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21 CPU DATA (Base Unit)
21.1. IC2
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
49
Page 50
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
22 CPU DATA (Handset)
22.1. IC2
50
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23 RF IC (Base Unit and Handset)
23.1. IC1
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
51
Page 52
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
24 HOW TO REPLACE FLAT
PACKAGE IC
24.1. Preparation
•
• SOLDER
• •
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR19RMA
•
• Soldering iron
• •
Recommended power consumption will be between 30 W
to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 W to 80 W iron, but
beginner might damage foil by overheating.)
•
• Flux
• •
HI115 Specific gravity 0.863.
(Original flux will be replaced daily.)
24.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two
marked2pins.
24.3. Modification Procedure of
Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering
iron as shown in below figure.
*Most important matter is accurate setting
of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as
sliding the soldering iron.
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KX-TC200 0NZB / KX-TC2000NZW / KX-TC200 0NZ F
25 CABINET AND ELECTRICAL PARTS LOCATION (BASE
UNIT)
53
Page 54
KX-TC200 0NZB / KX-TC2000NZW / KX-TC200 0NZ F
26 CABINET AND ELECTRICAL PARTS LOCATION
(HANDET)
54
Page 55
27 ACCESSORIES AND PACKING MATERIALS
KX-TC200 0NZB / KX -TC2000N ZW / KX-TC2000NZF
55
Page 56
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
28 REPLACEMENT PARTS
LIST
Note:
1. RTL (Retention Time Limited)
The marking (RTL) indicates that the Retention Time is
limited for this item.
After the discontinuation of this assembly in production, the
item will continue to be available for a specific period of
time. The retention period of availability depends on the
type of assembly and the laws governing parts and product
retention.
At the end of this period, the assembly will no longer be
available.
2. Important safety notice
Components identified by the
characteristics important for safety. When replacing any of
these components, only use specified manufacture´s parts.
3. The S mark indicates service standard parts and may differ
from production parts.
4. RESISTORS & CAPACITORS
Unless otherwise specified;
All resistors are in ohms (Ω) K=1000Ω, M=1000kΩ
All capacitors are in MICRO FARADS (µF) P=µµF
*Type & Wattage of Resistor