14 HOW TO CHECK THE HANDSET SPEAKER
15 FREQUENCY TABLE (MHz)
16 EXPLANATION OF CPU DATA COMMUNICATION
16.1. STAND-BY -> TALK, TALK -> STAND-BY
16.2. Ringing
16.3. Changing the Channel
16.4. Ports for transmitting and receiving of data
16.5. Waveform of DATA used for cordless transmission and
reception
17 B LOCK DIAGRAM (BASE UNIT)
22
24
24
25
25
26
26
27
28
28
29
29
30
32
32
32
32
33
34
34
35
36
37
37
38
2
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
18 B LOCK DIAGRAM (HANDSET) 39
19 CIRCUIT OPERATION
19.1. Outline
19.2. Power Supply Circuit
19.3. Reset Circuit (Base Unit)
19.4. Charge Circuit
19.5. Telephone Line Interface
19.6. DTMF
19.7. Transmitter/Receiver
19.8. Signal Route
20 CIRCUIT OPERATION (HANDSET)
20.1. Reset Circuit (Handset)
20.2. Battery Low / Power Down Detector
21 CPU DATA (Base Unit)
21.1. IC2
22 CPU DATA (Handset)
22.1. IC2
23 RF IC (Base Unit and Handset)
23.1. IC1
24 HOW TO REPLACE FLAT PACKAGE IC
24.1. Preparation
24.2. Procedure
24.3. Modification Procedure of Bridge
40
40
41
42
43
43
43
44
46
47
47
48
49
49
50
50
51
51
52
52
52
52
25 C ABINET AND ELECTRICAL PARTS LOCATION (BASE UN IT)
26 C ABINET AND ELECTRICAL PARTS LOCATION (HANDET)
27 ACCESSORIES AND PACKING MATERIALS
28 REPLACEMENT PARTS LIST
28.1. Base Unit
28.2. Handset
28.3. ACCESSORIES AND PACKING MATERIALS
29 FOR SCHEMATIC DIAGRAM
29.1. Base Unit (SCHEMATIC DIAGRAM (Base Unit))
29.2. Handset (SCHEMATIC DIAGRAM (Handset))
30 SCHEMATIC DIAGRAM (Base Unit)
30.1. Base Unit
30.2. RF Unit (Base Unit)
31 SCHEMATIC DIAGRAM (Handset)
31.1. Handset
31.2. RF Unit (Handset)
31.3. Memo
32 CIRCUIT BOARD (Base Unit)
32.1. Component View
32.2. Flow Solder Side View
33 CIRCUIT BOARD (Handset)
33.1. Component View
33.2. Flow Solder Side View
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54
55
56
56
58
60
61
61
61
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62
63
64
64
65
66
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67
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69
70
3
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
• PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
• •
temperature control and adjust it to 700°F ± 50° F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
•
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• •
•
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
• •
and be sure that any remaining is melted prior to applying the Pb solder.
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
• •
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
1.2. How to recognize that Pb Free solder is used
1.2.1. Base Unit Main PCB
IC5
JK1
PbF
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
(Component View)
Note:
The location of the "PbF" marks is subject to change without notice.
1.2.2. Handset PCB
DPX1
(Component View)
Note:
The location of the "PbF" marks is subject to change without notice.
Marked
IC2
PbF
Marked
5
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
3 CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer´s Instructions.
6
4 BATTERY
4.1. Recharge
4.2. Battery information
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
7
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
5 BATTERY REPLACEMENT
8
6 LOCATION OF CONTROLS
6.1. Base Unit
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
6.2. Handset
9
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
7 CONNECTION
•
• USE ONLY WITH Panasonic AC ADAPTOR PQLV16AL.
• •
•
• The AC adaptor must remain connected at all times.
• •
(It is normal for the adaptor to feel warm during use.)
•
• This unit will not function during a power failure.
• •
If you want to connect a standard telephone on the same line, use a T-adaptor.
•
• KX-TC2000NZ is not designed to be used with rotary (pulse dialling) services.
• •
10
For Service Hint:
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
11
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
8 OPERATIONS
8.1. Making Calls
8.2. Answering Calls
12
8.3. Storing Phone Numbers in Memory
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
8.4. Storing a Phone Number in the DIRECT Button
13
KX-TC2000NZB / KX-TC2000NZW / KX-TC2000NZF
8.5. Dialing a Stored Number
8.6. Dialing the Stored Number in the DIRECT Button