Electrostatically Sensitive (ES) Devices
4 About lead free solder (PbF)
5 PCB Structure sheet of GPH7D chassis
6 Service Hint
7 P.C.Board and Plasma panel replacement method
7.1. Remove the Back cover.
7.2. Remove the P-Board.
7.3. Remove the Z-Board.
7.4. Remove the D-Board.
7.5. Remove the PF-Board.
7.6. Remove the SU-Board.
7.7. Remove the SD-Board.
7.8. Remove the SC-Board.
7.9. Remove the SS3-Board.
7.10. Remove the SS2-Board.
7.11. Remove the SS-Board.
7.12. Remove the H3-Board.
7.13. Remove the Fan (L) and Fan (R).
7.14. Remove the C1-Board.
7.15. Remove the C2-Board.
7.16. Remove the Slot box (J-Board, DR-Board, HX-Board).
7.17. Remove the J-Board, the DR-Board and the HX-Board.
7.18. Remove the stand brackets.
7.19. Remove the C3-Board.
7.20. Remove the C4-Board.
7.21. Remove the S1-Board.
7.22. Remove the Plasma panel section from the Front frame
(glass).
7.23. Replace the plasma panel (finished).
7.24. Connection of flexible cable
8 Location of Lead Wiring
9 Adjustment Procedure
9.1. Driver Set-up
9.2. Initialization Pulse Adjust
9.3. P.C.B. (Printed Circuit Board) exchange
9.4. Adjustment Volume Location
9.5. Test Point Location
10 Servi ce mode
10.1. CAT (computer Aided Test) mode
10.2. IIC mode structure (following items value is sample data.)
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MW and 5.2MW.
When the exposed metal does not have a return path to
the chassis, the reading must be
.
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the ACplug inthe ACoutlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such asthe brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
1. Remove the flexible cable holder fastening screws (×8)
and remove the flexible cables (CB1, CB2, CB3).
2. Remove the flexible cables (C41, C43) and release the
speaker cables from the clampers (×2) on the C4-Board.
3. Remove the screws (×3
), and remove the C4-Board.
7.18. Remove the stand brackets.
1. Remove the plasma panel section from the servicing stand
and lay on a flat surface such as a table (covered), with the
plasma panel surface facing downward.
Spread a soft cloth or similar on the table for protection, so
the panel surface is not scratched.
2. Remove the stand bracket (left, right) fastening screws (×3
each) and remove the stand brackets (left, right).
7.21. Remove the S1-Board.
1. Remove a screw, remove the S1-Board and remove the
coupler (S34).
7.19. Remove the C3-Board.
1. Remove the flexible cable holder fastening screws (×8),and
remove the flexible cables (CB5, CB6, CB7, CB8).
2. Remove the couplers (C42, C44), the flexible cables (C31,
C33) and release the speaker cables from the clamper on
the C3-Board.
Select the CD mode by Up/Down button on the remote control at the front page of CAT mode then press the Mute button on the
remote control more than 5 sec.
Micom software version (IC9354), this version can be upgrade by
1. replace of new version IC
2. Loading the new version software from loader tool, TZSC07036.
Memory data change
To exit the CD mode, press the R button on the remote control.
10.1.3. SD mode
Select the SD mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on the
remote control.
To exit the SD mode, press the R button on the remote control.
3) Adjust G Sub bright to start some of green pixels emission
at black 2% area and no emission at black 0% area.
4) Set Gun off to "
5) Adjust B Sub bright to start some of blue pixels emission
at black 2% area and no emission at black 0% area.
6) Set Gun off to "
7) Adjust R Sub bright to start some of red pixels emission
at black 2% area and no emission at black 0% area.
5". (Only green pixels can emit.)
3". (Only blue pixels can emit.)
6". (Only red pixels can emit.)
80 ".
Component
2
(525i, 525p, 625i,
720i or 1080i)
Gray Scale
Pattern
Black 2 %
Black 0 %
Picture: 1) Change input to Component signal.
Normal PANEL W/B
White balance:R,G,B cut off 2) Repeat procedure 1) to 7) of RGB input signal.
Cool PANEL W/B
Aspect:R,G,B Drive
16:9
Note:
OSD is the difference between UY model and Except UY model.
Picture: Normal (Except UY)/Standard (UY model)
White balance (Except UY)/Color Temp (UY model)
NormalR cut off 1) Press the SWAP button, change input to signal path.
2) Set R,G and B cut off to "
CoolB cut off
Chroma Control:
16:9
RGB Sub Adjust:
RGB
Chroma Control:
RGB Sub Adjust:
Chroma Control:
RGB Sub Adjust:
Gun off
G Sub Bright 2
Gun off
B Sub Bright 2
Gun off
R Sub Bright 2
3) Set Gun off to "
4) Adjust G Sub bright to start some of green pixels emission
at black 2% area and no emission at black 0% area.
5) Set Gun off to "
6) Adjust B Sub bright to start some of blue pixels emission
at black 2% area and no emission at black 0% area.
7) Set Gun off to "
8) Adjust R Sub bright to start some of red pixels emission
at black 2% area and no emission at black 0% area.
5". (Only green pixels can emit.)
3". (Only blue pixels can emit.)
6". (Only red pixels can emit.)
Component
2
(525i, 525p, 625i,
720i or 1080i)
Gray Scale
Pattern
Black 2 %
Black 0 %
Picture: 1) Change input to Component signal.
Normal PANEL W/B
White balance:R,G,B cut off 2) Repeat procedure 1) to 7) of RGB input signal.
Cool PANEL W/B
Aspect:R,G,B Drive
16:9
Note:
OSD is the difference between UY model and Except UY model.
Picture: Normal (Except UY)/Standard (UY model)
White balance (Except UY)/Color Temp (UY model)