PAL 525/60Playback of NTSC tape from some PAL Video recorders
DVB (E model only)Digital terrestrial services via VHF / UHF aerial input.
M.NTSCPlayback from M. NTSC Video recorders (VCR)
NTSC (AVinput only)Playback from NTSC Video recorders (VCR)
·
· TV signals maynot be received in some areas.
· ·
B modelPAL I:UHF E21 - 68
PAL 525/60Playback of NTSC tape from some PAL Video recorders
DVBDigital terrestrial services via UHF aerial input.
M.NTSCPlayback from M.NTSC Video recorders (VCR).
NTSC (AVinput only)Playback from NTSC Video recorders (VCR).
Aerial - Rea
VHF / UHF (Except B model), UHF (B model)
Operating ConditionsTemperature: 0 °C - 35 °C
Humidity: 20 % - 80 % RH (non-condensing)
Connection Terminals
AV1 (Scart terminal)21 Pin terminal (Audio/Video in, Audio/Video out, RGB in, Q-Link)
AV2 (Scart terminal)21 Pin terminal (Audio/Video in, Audio/Video out, RGB in, S-Video in, Q-Link)
COMPONENT
IDEO
PB,P
R
AUDIO L-RRCA PIN Type × 20.5 V [rms]
HDMITYPE A Connectors
Output
AUDIO L-RRCA PIN Type × 20.5 V [rms] (high impedance)
Dimensions (W × H × D)
With Pedestal917 mm × 665 mm × 320 mm (37-inch)
1,020 mm × 725 mm × 320 mm (42-inch)
TV only917 mm × 620 mm × 95 mm (37-inch)
1,020 mm × 680 mm × 95 mm (42-inch)
Mass
With Pedestal25.0 kg Net (37-inch)
28.0 kg Net (42-inch)
TV only23.0 kg Net (37-inch)
26.0 kg Net (42-inch)
Note:
·
· Design and Specifications are subject to change without notice. Weight and Dimensions shown are approximate.
· ·
·
· This equipment complies with the EMC standards listed below.
· ·
EN55013, EN61000-3-2, EN61000-3-3, EN55020.
(VCR)
(VCR) or NTSC disc playback from DVD player and
recorder.
1.0 V [p-p] (including synchronization)
± 0.35 V [p-p]
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) aresupplied as repair parts and only one wire or some of the wires
have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straightin or unplug them straight out.
4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUGH CURRENT) expressed as voltage U
For a. c.: U
For d. c.: U
= 35 V (peak) and U2= 0.35 V (peak);
1
= 1.0 V,
1
Note:
The limit value of U
= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
2
mA d. c.
The limit value U
= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
1
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ESdevices. (Otherwise ham less motion suchas the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
1. Remove the SU-Board and SD-Board. (See section 6.7.
and 6.8.)
2. Unlock the cable clampers to free the cable.
3. Disconnect the connector (SC2).
4. Disconnect the flexible cable (SC20).
5. Remove the screws (×6
) and remove the SC-Board.
6.10. Remove the SS-Board
1. Disconnect the connectors (SS11, SS12, SS23 and SS34).
2. Disconnect the flexible cables (SS53A, SS54A, SS55A and
SS56A) (42 inch)/ (SS53, SS54, SS55, and SS56) (37inch)
3. Remove the screws (×6
) and remove the SS-Board.
6.11. Remove the stand brackets
1. Remove the plasma panel section from the servicing stand
and lay on a fiat surface such as a table (covered) with the
plasma panel surface facing downward.
2. Remove the stand brackets (left, right)fastening screws (×6
each) and remove the stand brackets (left, right).
Please confirm that all flexible cables are assembled correctly.
Also make sure that they are locked in the connectors.
Verify by giving the flexible cables a very slight pull.
Self-check indication only:
Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [OK] button on the remote control
for more than 3 seconds.
Self-check indication and forced to factory shipment setting:
Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote
While pressing [VOLUME ( - )] button of the main unit, press [0] button of the remote control three times within 3 seconds.
10.1.1. Key command
“1” button...Main items Selection in forward direction
“2” button...Main items Selection in reverse direction
“3” button...Sub items Selection in forward direction
“4” button...Sub items Selection in reverse direction
“RED” button...All Sub items Selection in reverse direction
“GREEN” button...All Sub items Selection in forward direction
“VOL” button...Value of sub items change in forward direction ( + ), in reverse direction ( - )
SOS History (Number of LED blinking) indication.
From left side; Last SOS, before Last, three occurrence before, 2nd occurrence after shipment, 1st occurrence after shipment.
This indication will be cleared by “Self-check indication and forced to factory shipment setting”.
10.2.3. POWER ON TIME/COUNT
Time : Cumulative power on time, indicated hour : minute by decimal
Count : Number of On times by decimal
Note : This indication will not cleared by self-check or any command.