Panasonic GP8D Service Manual

ORDER NO. ITD0506035CE

D10 Canada: B07

Progressive Wide Plasma Display

TH-37PWD8BK TH-37PWD8BS TH-37PWD8EK TH-37PWD8ES TH-37PWD8GK TH-37PWD8GS TH-37PWD8UK TH-42PWD8BK TH-42PWD8BS TH-42PWD8EK TH-42PWD8ES TH-42PWD8GK TH-42PWD8GS TH-42PWD8UK

GP8D Chassis

Specifications

Power Source (UK, GK/S) 120 VAC, 50/60 Hz (GK/GS/UK) Power Source (EK/S, BK/S) 220-240 VAC, 50/60 Hz (EK/ES/B Power Consumption (UK, GK/S)

Maximum 225 W (37PWD8GK/GS/UK) 275 W (42PWD8GK/GS/UK) Stand-bycondition Save OFF 1.0 W, Save ON 0.7 W (GK/GS/UK) Power off condition 0.05 W (GK/GS/UK)

Power Consumption (EK/S, BK/S)

Normal use 215 W (37PWD8EK/ES/BK/BS) 240 W (42PWD8EK/ES/BK/BS) Stand-bycondition Save off 1.2 W, Save on 0.9 W (EK/ES/B Power off condition 0.1 W (EK/ES/B

BS)

TH-37PWD8BK

Plasma Displaypanel Drive method:AC type 37-inch

16:9 aspect ratio (37 inch)

Drive method:AC type 42-inch 16:9 aspect ratio (42 inch)

Contrast Ratio 4000:1

Screen size 32” 13/64 (818 mm) (W) × 18” 9/64 (461 mm) (H) × 36” 31/32 (939 mm) (diagonal) (37 inch)

36” 7/32 (920 mm) (W) × 20” 25/64 (518 mm) (H) × 41” 37/64 (1,056 mm) (diagonal) (42 inch)

(No. of pixels) 408,960 (852 (W) × 480 (H))

[2,556 × 480 dots]

Operating condition

Temperatuer 32 °F - 104 °F (0 °C - 40 °C) Humidit

20 % - 80 %

Applicablesignals

Color System NTSC, PAL, PAL60, SECAM, Modified NTSC Scanning format 525 (480) / 60i 60p, 625 (575)/50i 50p, 750 (720)/60p 50p, 1125 (1080) / 60i 50i 24p 25p

30p 24sF .... SMPTE274M, 1250 (1080) / 50i

PC signals VGAdisplay

SVGA, XGA, SXGA, UXGA..... (compressed)

Horizontal scanning frequency 15 - 110 kHz Vertical scanning frequency 48 - 120 Hz

Connection terminals

V (EK/S, BK, S, UK) VIDEO IN / OUT (BNC) 1.0 Vp-p (75-ohm or high impedance)

S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)

UDIO IN (RCA PIN JACK ×2) 0.5 Vrms (high impedance)

COMPONENT / RGB (UK)

/ G (BNC) 1.0 Vp-p/composite (75-ohm)

0.7 Vp-p/non-composite (75-ohm)

PB/ B (BNC), PR/ R (BNC) 0.7 Vp-p (75-ohm)

UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)

PC (GK/GS/UK) (HIGH-DENSITYD-SUB 15PIN) R, G, B/0.7 Vp-p (75-ohm)

Component

:1.0 Vp-p (75-ohm : include sync)

CB:±0.7 Vp-p (75-ohm)

CR:±0.7 Vp-p (75-ohm)

HD, VD/1.0 - 5.0 Vp-p (high impedance)

UDIO IN (M3 JACK) 0.5 Vrms (high impedance)

PC (EK/ES/BK/BS) (HIGH-DENSITYD-SUB 15PIN) R, G, B/0.7 Vp-p (75-ohm)

HD, VD/1.0 - 5.0 Vp-p (high impedance)

UDIO IN (M3 JACK) 0.5 Vrms (high impedance) SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE SPEAKERS (6 Ω) 16 W [8 W + 8 W] (10 % THD)

Accessories Supplied

Remote Control Transmitter EUR7636070R Batteries 2×AASize Fixing bands (TMME203 or TMME187) × 2

Dimensions (W×H×D) 36.2” (920 mm) × 21.7” (550 mm) × 3.5” (89 mm)

(exclusive of protruding portion) (37 inch)

40.2” (1,020 mm) × 24” (610 mm) × 3.5” (89 mm) (exclusive of protruding portion) (42 inch)

Mass (Weight) (UK)

main unit onl

approx. 55.1 lbs (37PWD8UK) approx. 65.0 lbs (42PWD8UK)

with speakers approx. 63.9 lbs (37PWD8UK) approx. 73.9 lbs (42PWD8UK)

Mass (Weight) (GK/GS)

main unit onl

approx. 54.0 lbs (37PWD8GK/GS) approx. 63.9 lbs (42PWD8GK/GS)

with speakers approx. 62.8 lbs (37PWD8GK/GS) approx. 72.8 lbs (42PWD8GK/GS)

Mass (Weight) (EK/S, BK/S)

main unit onl

approx. 25.0 kg net (37PWD8EK/ES/BK/BS) approx. 29.5 kg net (42PWD8EK/ES/BK/BS)

with speakers approx. 29.0 kg (37PWD8EK/ES/BK/BS) approx. 33.5 kg (42PWD8EK/ES/BK/BS)

TH-37PWD8BK

Notes:

· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

· This equipment complies with the EMC standards listed below. EN55022, EN55024, EN61000-3-2, EN61000-3-3.

CONTENTS

Page Page

1 Applicable signals 5 2 Safety Precautions

2.1. General Guidelines

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 PCB Structure sheet of GP8D chassis 6 Service Hint 7 P.C.Board and Plasma panel replacement

7.1. Removal of the back cover

7.2. Removal of the Slot block

7.3. Removal of the J-Board

7.4. Removal of the HX-Board

7.5. Removal of the P-Board

7.6. Removal of the D-Board

7.7. Removal of the AC-Inlet

7.8. Removal of the H3-Board

7.9. Removal of the S1-Board

7.10. Removal of the SU-Board

7.11. Removal of the SD-Board

7.12. Removal of the SC-Board

7.13. Removal of the SS-Board

7.14. Removal of the C1-Board

7.15. Removal of the C2-Board

7.16. Removal of the Front frame (glass)

7.17. Removal of the V1-Board and the V2-Board

7.18. Removal of stand brackets

7.19. Replacement of the plasma panel

8 Location of Lead Wiring

8.1. Wiring for 37 inch model

8.2. Wiring for 42 inch model

9 Adjustment Procedure

9.1. Driver Set-up

9.2. Initialization Pulse Adjust

9.3. P.C.B. (Printed Circuit Board) exchange

9.4. Adjustment Volume Location

9.5. Test Point Location

10 Service mode

10.1. CAT (computer Aided Test) mode

10.2. IIC mode structure (following items value is sample data.)

11 Alignment

7 8

9 10 11

11 11 11 11 12 12 12 12 13 13 13 14 14 14 15 15 15 16 16

17 18

19 20 21 21 21

11.1. PC/RGB panel white balance

11.2. HD/ 525ip /625ip panel white balance

12 Trouble shooting guide

12.1. Self Check

12.2. No Power

12.3. No Picture

12.4. Local screen failure

13 Option Setting 14 Circuit Board Layout

14.1. P-Board

14.2. HA-Board

14.3. HB-Board

14.4. HX-Board (37 inch)

14.5. HX-Board (42 inch)

14.6. J-Board (37 inch)

14.7. J-Board (42 inch)

14.8. D-Board

14.9. C1-Board (37 inch)

14.10. C1-Board (42 inch)

14.11. C2-Board (37 inch)

14.12. C2-Board (42 inch)

14.13. SC-Board

14.14. SU-Board (37 inch)

14.15. SU-Board (42 inch)

14.16. SD-Board (37 inch)

14.17. SD-Board (42 inch)

14.18. SS-Board

14.19. H3, S1, V1 and V2-Board

15 Block and Schematic Diagrams

15.1. Schematic Diagram Notes

15.2. Main Block Diagram

15.3. P-Board Block Diagram

15.4. P-Board (1 of 6) Schematic Diagram

15.5. P-Board (2 of 6) Schematic Diagram

15.6. P-Board (3 of 6) Schematic Diagram

15.7. P-Board (4 of 6) Schematic Diagram

15.8. P-Board (5 of 6) Schematic Diagram

15.9. P-Board (6 of 6) Schematic Diagram

15.10. HA-Board Block and Schematic Diagram

15.11. HB-Board Block Diagram

25 27

29 30 30 31

32 35

35 38 39 40 41 42 44 46 48 49 50 51 52 55 56 57 58 59 61

63 64 65 66 67 68 69 70 71 72 73

TH-37PWD8BK

15.12. HB-Board (1 of 2) Schematic Diagram 74

15.13. HB-Board (2 of 2) Schematic Diagram

15.14. HX-Board Block Diagram

15.15. HX-Board Schematic Diagram

75 76 77

15.16. S1, V1 and V2-Board Block Diagram and Schematic Diagram

15.17. J-Board (1 of 2) and H3-Board Block Diagram

15.18. J-Board (2 of 2) Block Diagram

15.19. J-Board (1 of 4) Schematic Diagram (37 inch)

15.20. J-Board (2 of 4) Schematic Diagram (37 inch)

15.21. J-Board (3 of 4) Schematic Diagram (37 inch)

15.22. J-Board (4 of 4) Schematic Diagram (37 inch)

15.23. J-Board (1 of 4) Schematic Diagram (42 inch)

15.24. J-Board (2 of 4) Schematic Diagram (42 inch)

15.25. J-Board (3 of 4) Schematic Diagram (42 inch)

15.26. J-Board (4 of 4) Schematic Diagram (42 inch)

15.27. D-Board Block Diagram

15.28. D-Board (1 of 12) Schematic Diagram

15.29. D-Board (2 of 12) Schematic Diagram

15.30. D-Board (3 of 12) Schematic Diagram

15.31. D-Board (4 of 12) Schematic Diagram

15.32. D-Board (5 of 12) Schematic Diagram

15.33. D-Board (6 of 12) Schematic Diagram

15.34. D-Board (7 of 12) Schematic Diagram

15.35. D-Board (8 of 12) Schematic Diagram

15.36. D-Board (9 of 12) Schematic Diagram

15.37. D-Board (10 of 12) Schematic Diagram

15.38. D-Board (11 of 12) Schematic Diagram

15.39. D-Board (12 of 12) Schematic Diagram

15.40. C1 and C2-Board Block Diagram

15.41. C1-Board (1 of 2) Schematic Diagram (37 inch)

78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98

99 100 101 102 103

15.42. C1-Board (2 of 2) Schematic Diagram (37 inch)

15.43. C1-Board (1 of 2) Schematic Diagram (42 inch)

15.44. C1-Board (2 of 2) Schematic Diagram (42 inch)

15.45. C2-Board (1 of 2) Schematic Diagram (37 inch)

15.46. C2-Board (2 of 2) Schematic Diagram (37 inch)

15.47. C2-Board (1 of 2) Schematic Diagram (42 inch)

15.48. C2-Board (2 of 2) Schematic Diagram (42 inch)

15.49. SC-Board Block Diagram

15.50. SC-Board (1 of 2) Schematic Diagram

15.51. SC-Board (2 of 2) Schematic Diagram

15.52. SU-Board Block Diagram

15.53. SU-Board Schematic Diagram (37 inch)

15.54. SU-Board Schematic Diagram (42 inch)

15.55. SD-Board Block Diagram

15.56. SD-Board Schematic Diagram (37 inch)

15.57. SD-Board Schematic Diagram (42 inch)

15.58. SS-Board Block Diagram

15.59. SS-Board Schematic Diagram

16 Parts Location

16.1. Parts Location (1)

16.2. Parts Location (2)

17 Packing Exploded Views

17.1. Packing Exploded Views (1)

17.2. Packing Exploded Views (2)

17.3. Packing Exploded Views (3)

18 Mechanica l Replacement Parts List 19 Replacement Parts List

19.1. Replacement Parts List Notes

19.2. Electrical Replacement Parts List (37inch)

19.3. Electrical Replacement Parts List (42inch)

104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121

123

123 124

125

125 126 127

128 131

131 132 153

1 Applicable signals

TH-37PWD8BK

2 Safety Precautions

2.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

2.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MW and 5.2MW.

When the exposed metal does not have a return path to

the chassis, the reading must be

Figure 1

2.1.2. Leakage Current Hot Check (See

Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

TH-37PWD8BK

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

TH-37PWD8BK

4 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

Caution

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.

· ·

Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

· ·

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto

· ·

the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

stamped on the back of PCB.

5 PCB Structure sheet of GP8D chassis

Board Name Function Remarks

D Digital Signal Processor 1

J Slot Interface (Audio/Video/Sync input

Switch), SYNC processor, Audio processor, Speaker out amplifier, DC-

DC converter SS Sustain Out 1 SC Scan out 1 SU Sustain connection (Upper) 1 SD Sustain connection (Lower) 1 C1 Data Drive (Lower Right) C2 Data Drive (Lower Left) H3 Speaker terminal S1 Power switch V1 LED (Stand-by/Power on) & Remote

receiver V2 Key switch 1

P Line filter, Power supply 1 HX PC_type_Input terminal HB BNC Composite/S Video 2 HA BNC Component Video 3

Remarks

1. Recommend PCB´s for initial service for GP8D chassis.

2. For TH-37/42PWD8UK/BK/BS/EK/ES

3. For TH-37/42PWD8UK

TH-37PWD8BK

6 Service Hint

Note:

· Extension cable kit for Slot Board is supplied as service fixtures and tools.

· ·

(PartNo.TZSC07040)

· J13 Slot is not equiped for 37” model.

· ·

7 P.C.Board and Plasma panel replacement

TH-37PWD8BK

Prior to the replacement of Plasma panel, place the unit on the pedestal stand and remove the front frame.

7.1. Removal of the back cover

1. Unscrew the screws (×12 ,×6 ,×4 ,×4 ) and remove the back cover.

7.2. Removal of the Slot block

Caution:

To remove P.C.B., wait 1 minute after power was off for discharge from electrolysis capacitors.

1. Remove the couplers (J1, J2, J3, J4, J5, J6, J7, J8, J10, J15).

2. Release the cable from the clampers at left side of the slot block.

3. Unscrew the screws (×4

) and remove the slot block.

7.3. Removal of the J-Board

1. Unscrew the screws (×8 ), release J14 from the HXBoard and remove the J-Board.

7.4. Removal of the HX-Board

1. Unscrew the screws (×6 ) and remove the slot case.

2. Unscrew the screws (×4 ).

3. Unscrew the screws (×1 ) and remove the HX-Board.

TH-37PWD8BK

7.5. Removal of the P-Board

7.7. Removal of the AC-Inlet

1. Remove the couplers (P2, P5, P7, P9, P10, P11, P12, P23 and P25).

2. Unscrew the screws (×5

) and remove the P-Board.

7.6. Removal of the D-Board

1. Remove the coupler (P9) on the P-Board and release the cables from the clamper.

2. Unscrew the screws (×2

) and remove the AC inlet.

7.8. Removal of the H3-Board

1. Unscrew the screws (×2 ), and remove the H3-Board with the Bracket (right & left).

1. Disconnect the couplers (D1, D3, D5, D20, D25) and the flexible cables (D31, D32).

2. Unscrew the screws (×5

) and remove the D-Board.

2. Remove the couplers (H37).

3. Unscrew the screws (×6 (right & left).

), and remove the H3-Board

7.9. Removal of the S1-Board

1. Release the cable from the clamper.

2. Unscrew the screws (×2 the bracket.

3. Remove a coupler (S34), unscrew a screw (×1 remove the S1-Board.

) and remove the S1-Board with

) and

7.10. Removal of the SU-Board

1. Unscrew the screws (×2 ).

2. Slide the SU-Board to the left and disconnect from the couplers (SC41) on the SC-Board.

3. Remove the coupler (SU45).

TH-37PWD8BK

7.11. Removal of the SD-Board

1. Unscrew the screws (×2 ).

2. Slide the SD-Board to the left and disconnect from the couplers (SC42) on the SC-Board.

3. Remove the coupler (SD46).

4. Remove the flexible cables (SU1, SU2, SU3) connected to the SU-Board from the plasma panel, and remove the SUBoard.

4. Remove the flexible cables (SD1, SD2, SD3) connected to the SD-Board from the plasma panel, and remove the SDBoard.

TH-37PWD8BK

7.12. Removal of the SC-Board

1. Remove the couplers (SC2, SC20, SC23, SC45, SC46).

2. Unscrew the screws (×6

) and remove the SC-Board.

7.13. Removal of the SS-Board

1. Remove the couplers (SS11, SS12, SS23, SS34).

2. Remove the flexible cables (SS41, SS42, SS43, SS44).

3. Unscrew the screws (×6

), and remove the SS-Board.

7.14. Removal of the C1-Board

1. Unscrew the flexible cable holder fastening screws (×6 ).

2. Remove the flexible cables (CB1, CB2, CB3).

3. Remove a flexible cable (C11), a coupler (C12) and release the speaker cables from a clamper (×1) on the C1-Board.

4. Unscrew the screws (×3

), and remove the C1-Board.

7.15. Removal of the C2-Board

1. Unscrew the flexible cable holder fastening screws (×8 ).

2. Remove the flexible cables (CB4, CB5, CB6, CB7).

3. Remove the couplers (C22, C23), a flexible cable (C21) and release the speaker cables from the clamper on the C2Board.

4. Unscrew the screws (×3

), and remove the C2-Board.

7.16. Removal of the Front frame

(glass)

1. Remove the screws (×2 ) fixing the front frame and the plasma panel.

TH-37PWD8BK

7.17. Removal of the V1-Board and the V2-Board

1. Lay down the front frame on the flat surface of the table

(covered by a soft cloth not to damage the surface.)

2. Remove the couplers (V2 on the V1-Board and V15 on the

V2-Board).

3. Unscrew the screws (×3

4. Remove the V1-Board, the V2-Board hold bracket and the

V2-Board.

2. Confirm the S1-Board has been removed and the cable to the V1-Board and V2-Board released.

3. For leaving the front frame from the plasma panel, pull the bottom of the front frame to forward, lift up, and remove.

TH-37PWD8BK

7.18. Removal of stand brackets

1. Remove the plasma panel section from the servicing stand and lay on a table (covered), with the plasma panel surface facing downward.

Spread a soft cloth for protection, to prevent panel surface from scratching.

2. Remove the stand bracket (left, right) fastening screws (×4

each) and remove the stand brackets (left, right).

7.19. Replacement of the plasma

panel

1. Place the new plasma panel (finished) on the flat surface of the table (covered by a soft cloth), with the plasma panel surface facing downward.

2. Fit the stand brackets (left, right.) fasten 4 screws each on the new plasma panel.

3. Place the plasma panel section on the servicing stand.

4. Attach the front frame, each P.C.Board and so on, to the new plasma panel.

* When fitting the front frame, be careful not to allow any debris, dust or handling residues to remain between the front glass and plasma panel.

8 Location of Lead Wiring

8.1. Wiring for 37 inch model

TH-37PWD8BK

8.2. Wiring for 42 inch model

9 Adjustment Procedure

TH-37PWD8BK

9.1. Driver Set-up

9.1.1. Item / Preparation

1. Input a white signal of the RGB signal generator.

2. Set the picture controls: -

Picture menu: Standard

Color temperature: Middle

Picture: 25

Aspect: Full

Caution

1. First perform Vsus adjustment.

2. Confirmation of Vscn voltage should be performed after confirmation of Vad adjustment.

When Vad=-90V, Voltage of Vscn is 30V ±3V.

9.1.2. Adjustments

Adjust driver section voltages referring the panel data on the panel data label.

Name Test Point Voltage Volume Remarks

Vsus TPVSUS

(SS) Ve TPVE (SS) Ve ± 2V VR6074 (SS) * Vset TPVSET

(SC) Vad TPVAD (SC) -90V ± 1V VR6477

Vscn TPVSCN

(SC) Vda TPVDA (SS) 67V ± 1V R665 (P) PFC C446 (+)(-) 395V ± 0.5V R443 (P) Vlow C555 (+)(-) 73V ± 0.1V R661 (P) load

Csus TPVSUS

(SS)

*See the Panel label.

Vsus ± 1V R628 (P) *

232V ± 7V Fixed

(SC)

Vad+120V ±3VFixed

current :

0.4A

164V ± 0.5V R671 (P) load

current :

1.45A

TH-37PWD8BK

9.2. Initialization Pulse Adjust

1. Input the White signal to plasma video input.

2. Set the picture controls as follows.

· Picture menu: Standard

· ·

· Color temperature : Middle

· ·

· Picture : 25

· ·

3. Connect Oscilloscope to TPSC1 (T1) and check for 15±10µ Sec.

4. Connect Oscilloscope to TPSC1 (T2) and adjust R6557 for 184+5µ /-10µ Sec.

Test point Volume Level T1 TPSC1 (SC) --- 15 ± 10µ Sec T2 TPSC1 (SC) R6557 (SC) 184 + 5µ / - 10µ Sec

9.3. P.C.B. (Printed Circuit Board) exchange

9.3.1. Caution

1. To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.

9.3.2. Quick adjustment after P.C.B. exchange

P.C.B. Name Test Point Voltage Volume Remarks

P Board Vsus TPVSUS (SS) Vsus ± 2V R628 (P) *

Vda TPVDA (SS) 67V ± 1V R665 (P) PFC C446 (+) (-) (P) 395V ± 0.5V R443 (P) Vlow C557 (+) (-) (P) 73V ± 0.1V R661 (P) load current : 0.4A Csus TPVSUS (SS) 178V ± 0.5V R671 (P) load current : 1.45A

SC Board Vad TPVAD (SC) -90V ± 1V VR6477 (SC) SS Board Ve TPVE (SS) Ve ± 2V VR6074 (SS) * D, DG Board White blance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals

*See the Panel label.

Caution:

Absolutely do not reduce Vsus below Ve not to damage the P.C.B.

9.4. Adjustment Volume Location

TH-37PWD8BK

9.5. Test Point Location

TH-37PWD8BK

10 Service mode

10.1. CAT (computer Aided Test) mode

To exit the CAT mode, access the ID mode and switch off the main power.

10.1.1. IIC mode

Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on the remote control.

Subject and item are mentioned on page 24.

To exit the IIC mode, press the R button on the remote control.

TH-37PWD8BK

10.1.2. CD mode

Select the CD mode by Up/Down button on the remote control at the front page of CAT mode then press the Mute button on the remote control more than 5 sec.

Micom software version (IC9703), this version can be upgrade by

1. replace of new version IC

2. Loading the new version software from loader tool, TZSC07036.

Memory data change

To exit the CD mode, press the R button on the remote control.

10.1.3. SD mode

Select the SD mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on the remote control.

To exit the SD mode, press the R button on the remote control.

TH-37PWD8BK

10.2. IIC mode structure (following items value is sample data.)

11 Alignment

11.1. PC/RGB panel white balance

INPUT Alignment menu ProcedureEquipment Setting

TH-37PWD8BK

1 PC (VGA) Color Picture menu:

Gray Scale Analyzer Standard Pattern

High light 75%

Low light 15%

Picture:

White balance:

Cool

Aspect:

Component/ RGB-IN Select:

RGB

IIC mode:

Panel W/B Adj

Color temprature:

High

Full

PANEL W/B

Note: · Before adjustment, color signal has not been displayed on panel.

· The pedestal adjustment has been done.

· The signal root must be A side.

1) Set G cut off to " 80 ".

2)Find 75% (amplitude) of white area by color sensor.

G Drive 3) Set G Drive to " E0 ".

B Drive 4) Adjust B and R Drive to set the High color temperature

R Drive as shown Table 1.

R,G,B Drive 5) Increase equaly R, G and B Drive to get the R,G,B Drive largest level of 3 color drive to "FC".

R,G,B cut off

Color Temp. x y

Cool(Hi) 0.276 0.276

Normal(Mid) 0.288 0.296

Warm(Low) 0.313 0.329

Table 1 W/B adjustment value

2 Picture menu: 1) Change white balance to "Normal".

Standard PANEL W/B

White balance: R,G,B cut off 2) In Mid color temperature, repeat the procedures 1) to 5) of

Normal PANEL W/B

Aspect: R,G,B Drive

Full

3 Picture menu: 1) Change white balance to "Warm".

Standard PANEL W/B

White balance: R,G,B cut off 2) In Low color temperature, repeat the procedures 1) to 5) of

Warm PANEL W/B

Aspect: R,G,B Drive

Full

· NTSC

4 1) Copy the R drive, G drive and B drive data obtained in above

· PAL

· DVI

Cool mode.

steps into NTSC, PAL and DVI area.

TH-37PWD8BK

Color temperature

High

Medium

Low

A0-11AD

A0-11B0

A0-11B3

A0-11AE

A0-11B1

A0-11B4

Table 2 Drive data addresses (PC/RGB)

Color temperature

High

Medium

Low

A0-1180

A0-1183

A0-1186

A0-1181

A0-1184

A0-1187

Table 3 Drive data addresses (NTSC)

Color temperature

A0-11AF

A0-11B2

A0-11B5

A0-1182

A0-1185

A0-1188

High

Medium

Low

A0-1189

A0-118C

A0-118F

A0-118A

A0-118D

A0-1190

Table 4 Drive data addresses (PAL)

Color temperature

High

Medium

Low

A0-11B6

A0-11B9

A0-11BC

A0-11B7

A0-11BA

A0-11BD

Table 5 Drive data addresses (DVI)

A0-118B

A0-118E

A0-1191

A0-11B8

A0-11BB

A0-11BE

11.2. HD/ 525ip /625ip panel white balance

INPUT Alignment menu ProcedureEquipment Setting

TH-37PWD8BK

1 Color Picture menu:

HD (YUV2_HD) Gray Scale Pattern

High light 75%

Low light 15%

Analyzer Standard

Picture:

White balance:

Cool

Aspect:

Component/ RGB-IN Select:

RGB

IIC mode:

Panel W/B Adj

Color temprature:

High

Full

PANEL W/B

Note: · Before adjustment, color signal has not been displayed on panel.

· The pedestal adjustment has been done.

· The signal root must be A side.

1) Set G cut off to " 80 ".

2)Find 75% (amplitude) of white area by color sensor.

G Drive 3) Set G Drive to " E0 ".

B Drive 4) Adjust B and R Drive to set the High color temperature

R Drive as shown Table 1.

R,G,B Drive 5) Increase equaly R, G and B Drive to get the R,G,B Drive largest level of 3 color drive to "FC".

R,G,B cut off

Color Temp. x y

Cool(Hi) 0.276 0.276

Normal(Mid) 0.288 0.296

Warm(Low) 0.313 0.329

Table 1 W/B adjustment value

2 Picture menu: 1) Change white balance to "Normal".

Standard PANEL W/B

White balance: R,G,B cut off 2) In Mid color temperature, repeat the procedures 1) to 5) of

Normal PANEL W/B

Aspect: R,G,B Drive

Full

3 Picture menu: 1) Change white balance to "Warm".

Standard PANEL W/B

White balance: R,G,B cut off 2) In Low color temperature, repeat the procedures 1) to 5) of

Warm PANEL W/B

Aspect: R,G,B Drive

Full

· YUV1_525ip

4 1) Copy the R drive, G drive and B drive data obtained in above

· YUV3_625ip

Cool mode.

steps into YUV1_525ip, YUV3_625ip area.

TH-37PWD8BK

Color temperature

High

Medium

Low

A0-119B

A0-119E

A0-11A1

A0-119C

A0-119F

A0-11A2

Table 2 Drive data addresses (YUV2_HD)

Color temperature

High

Medium

Low

A0-1192

A0-1195

A0-1198

A0-1193

A0-1196

A0-1199

Table 3 Drive data addresses (YUV1_525ip)

A0-119D

A0-11A0

A0-11A3

A0-1194

A0-1197

A0-119A

Color temperature

High

Medium

Low

A0-11A4

A0-11A7

A0-11AA

A0-11A5

A0-11A8

A0-11AB

Table 4 Drive data addresses (YUV3_625ip)

A0-11A6

A0-11A9

A0-11AC

12 Trouble shooting guide

12.1. Self Check

12.1.1. Display Indication

1. Self-check is used to automatically check the bus line controlled circuit of the Plasma display.

2. To get into the Self-check mode, press the volume down button on the customer controls at the front of the set, at the same time pressing the OFF-TIMER button on the remote control, and the screen will show :-

If the CCU ports have been checked and found to be incorrect

Or not located then " - - " will appear in place of " OK "

12.1.2. Power LED Blinking timing chart

1. Subject

Information of LED Flashing timing chart.

2. Contents

When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.

TH-37PWD8BK

12.2. No Power

First check point

There are following 3 states of No Power indication by power LED.

1. No lit

2. Green is lit then turns red blinking a few seconds later.

3. Only red is lit.

1. No lit

12.3. No Picture

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