Panasonic GP6DE, TH-42PE30B Service Manual

ORDER NO. EXP0403007C2
Digital Progressi ve Plasma Television
TH-37PE30B TH-42PE30B
GP6DE Chassis
Specifications
Power Source 220 V -240 V 50 Hz /60 Hz A.C. Power Consumption
Normal use 253 W (TH-37PE30B), 323 W (TH-42PE30B) Standby 1.8 W (TV only), 15.0 W (TV + DVB system set to record Timer programmes) Power-OFF 1.0 W
Plasma Displ ay panel
Drive method AC type Aspect Ratio 16:9 Contrast Ratio 4000:1 Screen size (No.of pixels) 37-inch (TH-37PE30B)
818 mm (W) × 461 mm (H) × 939 mm (diagonal)
42-inch (TH-42PE30B)
920 mm (W) × 518 mm (H) × 1,056 mm (diagonal)
408,960 (852 (W) × 480 (H)) [2,556 × 480 dots ]
Sound
Speaker Woofer 80 mm × 2, Tweeter 16 mm × 73 mm × 8 Audio Output 26W[8W+8W,5W+5W]((10%THD) Headphone M3 (3.5 mm) Jack × 1
Applicable signals
Colour System NTSC, PAL, PAL60, SECAM, Modified NTSC Scanning format 525 (480) /60i 60p, 625 (575) /50i 50p PC signals VGA display
VGA
SVGA, XGA, SXGA, UXGA ..... (compressed)
Horizontal scanning frequency 15 - 110 kHz Vertical scanning frequency 48 - 120 Hz
Receiving Systems/Band namePAL I
UHF E21 - 68.
© 2004 Matsushita Electric Industrial Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
TH-37PE30B / TH-42PE30B
OUTPUT
AUDIO OUT AUDIO L-R (RCA Pin Type × 2) 0.5 Vrms
INPUT
AV3-Front VIDEO (RCA Pin Type × 2) 1.0 Vp-p (75 9)
AV4C-Rear Y 1.0 Vp-p (including synchronization)
PC (HIGH-DENSITY D-SUB 15PIN) R, G, B/ 0.7 Vp-p (75 9)
Others SD Card slot × 1, PC Card slot × 1
INPUT/OUTPUT
AV1-Rear 21 Pin terminal (Audio/Video in, TV out, RGB in) AV2-Rear 21 Pin terminal (Audio/Video in, Audio/Video out, S-Video in, Q-Link) AV4-Rear 21 Pin terminal (Audio/Video in, Audio/Video out, S-Video in, RGB in, Q-Link)
ANT-Rear UHF / VHF Operating Conditions Temperature :0 ° - 40 °C
Accessories Supplied
Operating Instructions TQBC0719-1 Mains Lead K2CT3DH00017 Remote Control Transmitter EUR7635010 Batteries 2×R6Size Clamper TMME206 × 2 Ferrite core Large size × 2, Small size × 5
Dimensions ( W × H × D ) 1,040 mm × 697 mm × 139 mm (TH-37PE30B)
Mass (Weight) 34.5 kg (TH-37PE30B)
PAL 525/60 Playback of NTSC tape from some PAL Video recorders (VCR) DVB Digital terrestrial services via UHF aerial input. M.NTSC Playback from M.NTSC Video recorders (VCR) NTSC (AV INPUT ONLY) Playback from NTSC Video recorders (VCR)
S-VIDEO (MINI DIN 4-pin) Y: 1.0 Vp-p (75 9 ) C:0.286 Vp-p (75 9) AUDIO L-R (RCA Pin Type × 2) 0.5 Vrms
PB/P
R
Humidity :20 % - 80 %RH (non-condensing)
1,140 mm × 757 mm × 139 mm (TH-42PE30B)
41.0 kg (TH-42PE30B)
±0.35 Vp-p
HD, VD / 1.0 - 5.0 Vp-p (high impedance)
Notes:
·
· Design and specifications are subject to change without notice.Mass and dimensions shown are approximate.
· ·
·
· This equipment complies with the EMC standards listed below.
· ·
EN55013,EN61000-3-2,EN61000-3-3,EN55020.
CONTENTS
1 Applicable signals 5 2 Safety Precautions
2.1. General Guidelines
2.2. Touch-Current Check
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
4 About lead free solder (PbF)
Page Page
5 Service Hint 6 P.C.Board and Plasma panel replacement method
6
6
7 Location of Lead Wiring
6
7 8
7.1. Lead of Wiring (1)
7.2. Lead of wiring (2)
7.3. Lead of wiring (3)
7.4. Lead of wiring (4)
10 15
15 16 17 18
2
9
7.5. Lead of wiring (5) 18
7.6. Lead of wiring (7)
8SelfCheck
8.1. Power LED Blinking timing chart
8.2. No Power
8.3. No Picture
8.4. Local screen failure
9 Service Mode Function
9.1. How to enter SERVICE 1
9.2. How to enter SERVICE 2
9.3. Option Description
10 CAT (Computer Aided Test) mode
10.1. IIC mode
10.2. CD mode
10.3. SD mode
10.4. IIC mode structure (following items value is sample data.)
11 Adjustment Procedure
11.1. +B Set-up
11.2. Driver Set-up
11.3. Initialization Pulse Adjust
11.4. P.C.B. (Printed Circuit Board) exchange
11.5. Adjustment Volume Location
11.6. Test Point Location
12 Alignment
12.1. Pedestal setting
12.2. PAL panel white balance
12.3. PC panel white balance
12.4. Sub brightness setting
12.5. ABL Level
13 Hotel mode 14 Conductor Views
14.1. PF-Board
14.2. P-Board
14.3. PA-Board
14.4. D-Board
14.5. DG-Board
14.6. H and T-Board
14.7. C1-Board (For TH-37PE30B)
14.8. C1-Board (For TH-42PE30B)
14.9. C2-Board (For TH-37PE30B)
14.10. C2-Board (For TH-42PE30B)
14.11. SC-Board
14.12. SU-Board (For TH-37PE30B)
14.13. SU-Board (For TH-42PE30B)
14.14. SD-Board (For TH-37PE30B)
14.15. SD-Board (For TH-42PE30B)
14.16. SS-Board
14.17. SS2, SS3, SS4 and SS5-Board
14.18. K and S-Board
14.19. G-Board
14.20. JG-Board
14.21. XV-Board
15 Block and Schematic Diagrams
19
20
21 22 23 23
24
24 24 26
28
28 29 29
30
31
31 31 32 33 33 33
34
34 35 36 37 37
38 39
39 41 43 45 47 49 51 52 53 54 55 58 59 60 61 62 64 65 66 67 69
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TH-37PE30B / TH-42PE30B
15.1. Schematic Diagram Notes
15.2. Main Block Diagram
15.3. PF-Board Block Diagram
15.4. PF-Board Schematic Diagram
15.5. P-Board Block Diagram
15.6. P-Board Schematic Diagram
15.7. PA-Board Block Diagram
15.8. PA-Board (1 of 2) Schematic Diagram
15.9. PA-Board (2 of 2) Schematic Diagram
15.10. H and T-Board Block Diagram
15.11. H-Board (1 of 2) Schematic Diagram
15.12. H-Board (2 of 2) and T-Board Schematic Diagram
15.13. DG-Board (1 of 2) Block Diagram
15.14. DG-Board (2 of 2) Block Diagram
15.15. DG-Board (1 of 9) Schematic Diagram
15.16. DG-Board (2 of 9) Schematic Diagram
15.17. DG-Board (3 of 9) Schematic Diagram
15.18. DG-Board (4 of 9) Schematic Diagram
15.19. DG-Board (5 of 9) Schematic Diagram
15.20. DG-Board (6 of 9) Schematic Diagram
15.21. DG-Board (7 of 9) Schematic Diagram
15.22. DG-Board (8 of 9) Schematic Diagram
15.23. DG-Board (9 of 9) Schematic Diagram
15.24. D-Board Block Diagram
15.25. D-Board (1 of 12) Schematic Diagram
15.26. D-Board (2 of 12) Schematic Diagram
15.27. D-Board (3 of 12) Schematic Diagram
15.28. D-Board (4 of 12) Schematic Diagram
15.29. D-Board (5 of 12) Schematic Diagram
15.30. D-Board (6 of 12) Schematic Diagram
15.31. D-Board (7 of 12) Schematic Diagram
15.32. D-Board (8 of 12) Schematic Diagram
15.33. D-Board (9 of 12) Schematic Diagram
15.34. D-Board (10 of 12) Schematic Diagram
15.35. D-Board (11 of 12) Schematic Diagram
15.36. D-Board (12 of 12) Schematic Diagram
15.37. C1, C2, G and K-Board Block Diagram
15.38. C1-Board Schematic Diagram (TH-37PE30B)
15.39. C1-Board Schematic Diagram (TH-42PE30B)
15.40. C2-Board (1 of 2) Schematic Diagram (TH-37PE30B)
15.41. C2-Board (2 of 2) Schematic Diagram (TH-37PE30B)
15.42. C2-Board Schematic Diagram (TH-42PE30B)
15.43. G-Board Schematic Diagram
15.44. K-Board Schematic Diagram
15.45. SC-Board Block Diagram
15.46. SC-Board (1 of 3) Schematic Diagram
15.47. SC-Board (2 of 3) Schematic Diagram
15.48. SC-Board (3 of 3) Schematic Diagram
15.49. SU-Board Block Diagram
15.50. SU-Board Schematic Diagram (TH-37PE30B)
15.51. SU-Board Schematic Diagram (TH-42PE30B)
15.52. SD-Board Block Diagram
15.53. SD-Board Schematic Diagram (TH-37PE30B)
15.54. SD-Board Schematic Diagram (TH-42PE30B)
71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98
99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124
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TH-37PE30B / TH-42PE30B
15.55. SS, S, SS2, SS3, SS4 and SS5-Board Block Diagram 125
15.56. SS-Board (1 of 2) and S-Board Schematic Diagram
15.57. SS-Board (2 of 2) SS2, SS3, SS4 and SS5-Board Schematic Diagram
15.58. JG-Board Block Diagram
15.59. JG-Board (1 of 2) Schematic Diagram
15.60. JG-Board (2 of 2) Schematic Diagram
15.61. XV-Board Block Diagram
126
127 128 129 130 131
15.62. XV-Board (1 of 5) Schematic Diagram
15.63. XV-Board (2 of 5) Schematic Diagram
15.64. XV-Board (3 of 5) Schematic Diagram
15.65. XV-Board (4 of 5) Schematic Diagram
15.66. XV-Board (5 of 5) Schematic Diagram
16 Parts Location 17 Packing Exploded Views
132 133 134 135 136
137 138
4
1 Applicable signals
TH-37PE30B / TH-42PE30B
5
TH-37PE30B / TH-42PE30B
2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.2. Touch-Current Check
1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2.Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.
3.Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4.Check each exposed metallic part, and measure the voltage at each point.
5.Reserve the AC plug in the AC outlet and repeat each of the above measure.
6.The potential at any point (TOUGH CURRENT) expressed as voltage U For a. c.: U For d. c.: U
= 35 V (peak) and U2= 0.35 V (peak);
1
=1.0V,
1
Note:
The limit value of U
= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
2
mA d. c. The limit value U
= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
1
7.In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.
and U2, does not exceed the following values:
1
Figure 1
6
TH-37PE30B / TH-42PE30B
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).
7
TH-37PE30B / TH-42PE30B
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
· ·
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
· ·
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
· ·
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
stamped on the back of PCB.
8
5 Service Hint
TH-37PE30B / TH-42PE30B
Stand the unit used for pedestal.
Remove the Rear Cover.
Service position.
Board Name Function C1 DATA DRIVER (RIGHT) C2 DATA DRIVER (LEFT) D DIGTAL SIGNAL PROCESS DG DIGTAL CORE, MICOM G FRONT TERMINAL, SWITCH H REAR TERMINAL JG SD CARD/PC CARD, JPEG I/F D/A K LED, REMOTE, POWER SWITCH P POWER SUPPLY PA DC/DC, AUDIO PF LINE FILTER S POWER SWITCH SC SCAN DRIVE SD SCAN OUT (DOWN) SS SUSTAIN DRIVE SS2 SUSTAIN CONNECTION (UP) SS3 SUSTAIN CONNECTION (DOWN) SU SCAN OUT (UP) T TUNER XV DVB TUNER
Remove the AV Connector Cover.
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TH-37PE30B / TH-42PE30B
6 P.C.Board and Plasma panel replacement method
n
n To replace the plasma panel (finished), place the unit on
nn
the servicing stand, remove the front frame (finished), and replace the panel, being careful not to scratch the plasma panel surface.
1.Remove the rear cover and the AV connector cover.
2.Remove the P-Board. a.Remove the couplers (P2, P5, P7, P9, P11, P12, P23,
P25, P27).
b.Remove the screws (×5) and remove the P-Board.
5.Remove the XV-Board.
3.Remove the PA-Board. a.Remove the couplers (PA1, PA2, PA3, PA4, PA5, PA6,
PA7, PA8, PA10A, PA12).
b.Remove the screws (×4
with the PA-Board Bracket.
c.Remove the screws (×6
4.Remove the D-Board. a.Disconnect the couplers (D3, D4, D6, D12, D22, D25)
and the flexible cables (D31, D32).
b.Remove the screws (×7) and remove the D-Board with
the bracket.
) and remove the PA-Board
) and remove the PA-Board.
6.Remove the DG-Board, the H-Board and the T-Board. a.Remove the couplers (DG2, DG3, DG6, DG8, DG10,
DG12, H9), a flexible cable (DG7), and the screws (×5
).
b.Remove the DG-Board, the H-Board and the T-Board
with the bracket.
c.Remove the bridge connectors (DG1-H1, DG4-H4) and
remove the screws (×3 d.Remove the DG-Board. e.Remove the screws (×6
screws (×2
f.Remove the coupler (H10) and the antenna cable,
remove the T-Board with the T-Board bracket. g.Remove the H-Board.
) on the T-Board bracket.
) on the DG-Board.
) on the H-Board and the
10
h.Remove the screws (×2) and remove the T-Board.
7.Remove the PF-Board. a.Remove the couplers (PF2, PF10). b.Remove the screws (×5
), and remove the PF-Board
with the Bracket.
TH-37PE30B / TH-42PE30B
c.Remove the flexible cables (SU1, SU2, SU3) connected
to the SU-Board, and remove the SU-Board.
9.Remove the SD-Board. a.Remove the screws (×2). b.Slide the SD-Board to the left and disconnect from the
couplers (SC43, SC44) on the SC-Board.
c.Remove the coupler (PF1) and remove the screws (×5
).
d.Remove the PF-Board.
8.Remove the SU-Board. a.Remove the screws (×2). b.Slide the SU-Board to the left and disconnect from the
couplers (SC41, SC42) on the SC-Board.
11
TH-37PE30B / TH-42PE30B
c.Remove the flexible cables (SD1, SD2, SD3) connected
to the SD-Board, and remove the SD-Board.
10.Remove the SC-Board. a.Remove the couplers (SC2, SC20, SC23), the screws
(×9) and remove the SC-Board.
11.Remove the SS2-Board. a.Remove the coupler (SS47), and remove the flexible
cable (SS45).
b.Remove the screws (×2), and remove the SS2-Board.
12.Remove the SS3-Board. a.Remove the coupler (SS40) and the flexible cable
(SS46).
b.Remove the screws (×2), and remove the SS3-Board.
12
13.Remove the SS-Board. a.Remove the couplers (SS11, SS12, SS23, SS34), and
remove the flexible cables (SS40, SS47) on the SS3­Board and SS2-Board.
b.Remove the flexible cables (SS41, SS42, SS43, SS44).
c.Remove the screws (×6), and remove the SS-Board.
TH-37PE30B / TH-42PE30B
15.Remove the C2-Board. a.Remove the flexible cable holder fastening screws (×8),
and remove the flexible cables (CB4, CB5, CB6, CB7).
b.Remove the couplers (C23, C24), a flexible cable (C21)
and release the speaker cables from the clamper on the C2-Board.
c.Remove the screws (×4), and remove the C2-Board.
16.Remove the JG-Board and G-Board. a.Remove the screws (×7) fixing the woofer speakers, the
interconnecting couplers (×4, to woofer and tweeter) and remove the woofer speakers (right and left).
b.Disconnect a coupler (DG10), a flexible cable (DG7)
and the couplers of interconnecting connector (from DG18 to G18 and H9 to G5).
c.Remove the screws (×5
) and remove the JG-Board
and G-Board with the Bracket.
d.Remove the screws (×7
) and remove the JG-Board
with Bracket.
e.Remove the screws (×2
) and remove the Shield
case of JG-Board.
14.Remove the C1-Board. a.Remove the flexible cable holder fastening screws (×6)
and remove the flexible cables (CB1, CB2, CB3).
b.Remove the flexible cables (C11, C12) release the
speaker cables from the clampers (×2) on the C1­Board.
c.Remove the screws (×4), and remove the C1-Board.
f.Remove the screws (×5) and remove the JG-Board.
13
TH-37PE30B / TH-42PE30B
g.Remove the screws (×2) and remove the G-Board.
17.Remove the Front frame (glass). a.Remove the front frame and the plasma panel fastening
screws (×10 stand braket fastening screws(×6
), and remove the front frame and the
).
b.Release all cables from the clamper on the bracket of
the front frame.
c.For leaving the the plasma panel from the front frame,
pull the bottom of the front frame forward, lift, and remove.
18.Remove stand brackets. a.Remove the plasma panel section from the servicing
stand and lay on a surface such as a table (covered), with the plasma panel surface facing downward.
Spread a soft cloth or similar on the table for protection, so the panel surface is not scratched.
b.Remove the stand bracket (left, right) fastening screws
(×4 each) and remove the stand brackets (left, right).
19.Replace the plasma panel (finished). a.Place the new plasma panel (finished) on the flat
surface of the table (covered by a soft cloth), with the plasma panel surface facing downward.
b.Fit the stand brackets (left, right) to the new plasma
panel. c.Place the plasma panel section on the servicing stand. d.Attach the front frame and the each P.C.Board and so
on, to the new plasma panel.
* When fitting the front frame, be careful not to allow
any debris, dust or handling residues to remain
between the front glass and plasma panel.
14
7 Location of Lead Wiring
7.1. Lead of Wiring (1)
TH-37PE30B / TH-42PE30B
15
TH-37PE30B / TH-42PE30B
7.2. Lead of wiring (2)
16
7.3. Lead of wiring (3)
TH-37PE30B / TH-42PE30B
17
TH-37PE30B / TH-42PE30B
7.4. Lead of wiring (4)
7.5. Lead of wiring (5)
18
7.6. Lead of wiring (7)
TH-37PE30B / TH-42PE30B
19
TH-37PE30B / TH-42PE30B
8SelfCheck
1.Self-Check is used to automatically check the bus lines and hexadecimal code of the TV set.
2.To get into the Self -Check mode press the Down ( time pressing the Status button on the remote control, and the screen will show :
) button on the customer controls at the front of the set, at the same
If the CCU ports have been ked and found to be incorrect or not located then “--” will appear in place of “O.K.”.
Display Ref.No Description P.C.B. MEM IC1008 EEPROM DG-BOARD GC2M IC1301 GROBAL CORE MAIN DG-BOARD GC2P IC1304 GROBAL CORE SUB DG-BOARD GC2S IC1302 GROBAL CORE 3D Comb DG-BOARD GC2V IC1350 GROBAL CORE V Scalar DG-BOARD HAD IC1851 HD-AD CONVERTER DG-BOARD LSYNC IC2652 SYNC PROCESSOR H-BOARD AVSW IC3200 AV switch H-BOARD YUVSW IC1270 YUV switch DG-BOARD Tun1 TNR001 TUNER 1 TU-BOARD VIF --- --- --­DAC1 IC3003 Ext. DAC DG-BOARD MSP IC2002 Multi Sound Processor H-BOARD SOUND IC2401 AUDIO AMP PA-BOARD PANEL --- PANEL --­JPEG IC60 JPEG I/F PG-BOARD
20
TH-37PE30B / TH-42PE30B
8.1. Power LED Blinking timing chart
1.Subject Information of LED Flashing timing chart.
2.Contents When an abnormality has occurred on the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.
21
TH-37PE30B / TH-42PE30B
8.2. No Power
First check point
There are following 3 states of No Power indication by power LED.
1.No lit
2.Green is lit then turns red blinking a few seconds later.
3.Only red is lit.
1.No lit
22
8.3. No Picture
TH-37PE30B / TH-42PE30B
8.4. Local screen failure
Plasma display may have local area failure on the screen. Fig - 1 is the possible defect P.C.Board for each local area.
Fig - 1
23
TH-37PE30B / TH-42PE30B
9 Service Mode Function
MPU controls the functions switching for each IICs through IIC bus in this chassis. The following setting and adjustment can be adjusted by remote control in Service Mode.
9.1. How to enter SERVICE 1
1.In sound menu, set BASS to MAXIMUM, and set TREBLE to MINIMUM.
2.Simultaneously press INDEX button on remote control and DOWN button [
9.2. How to enter SERVICE 2
1.Set the channel to CH99.
2.Select the JPEG Viewer.
3.Press HOLD button on remote control.
Note:
To exit to Service mode, press N or Power button on remote control.
]ontheTVset.
24
TH-37PE30B / TH-42PE30B
25
TH-37PE30B / TH-42PE30B
9.3. Option Description
26
TH-37PE30B / TH-42PE30B
27
TH-37PE30B / TH-42PE30B
10 CAT (Computer Aided Test) mode
10.1. IIC mode
Select the IIC mode by Up/Down (Channel) button on the remote control at the front page of CAT mode then press the OK button on the remote control.
Subject and item are mentioned on IIC mode structure. (Refer to item 10.4.) To exit the IIC mode, press the MENU button on the remote control.
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TH-37PE30B / TH-42PE30B
10.2. CD mode
Select the CD mode by Up/Down (Channel) button on the remote control at the front page of CAT mode then press the Mute button on the remote control more than 5 sec.
Micom software version (IC1007), this version can be upgrade by replace of new version IC
Memory data change
To exit the CD mode, press the MENU button on the remote control.
10.3. SD mode
Select the SD mode by Up/Down (Channel) button on the remote control at the front page of CAT mode then press the OK button on the remote control.
To exit the SD mode, press the MENU button on the remote control.
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TH-37PE30B / TH-42PE30B
10.4. IIC mode structure (following items value is sample data.)
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