Total circuit currentI
Mono output levelV
Mono frequency characteristics-1
Mono frequency characteristics-2
Mono distortion ratio
Mono noise levelV
(L), (R) output voltage difference
0(MON)
V
1(MON)
V
2(MON)
THD
N(MON)
V
LR(MON)
Stereo output levelV
Stereo frequency characteristics-1
Stereo frequency characteristics-2
Stereo frequency characteristics-3
V
V
V
Stereo distortion ratioTHD
Stereo noise levelV
Stereo discrimination levelV
Stereo discrimination hysteresis V
SAP output levelV
SAP frequency characteristics-1 V
SAP frequency characteristics-2 V
SAP distortion ratio
SAP noise levelV
SAP discrimination levelV
SAP discrimination hysteresisV
N(ST)
TH(ST)
HY(ST)
0(SAP)
1(SAP)
2(SAP)
THD
N(SAP)
TH(SAP)
HY(SAP)
SAP → Stereo crosstalkC
Stereo → SAP crosstalkC
SAP → Mono crosstalkC
Mono → SAP crosstalkC
AUX 1, AUX 2 to INTC
crosstalk
INT, AUX 2 to AUX 1C
crosstalkEXT: f = 1 kHz, 500 mV[rms]
INT, AUX 1 to AUX 2C
crosstalkEXT: f = 1 kHz, 500 mV[rms]
No signal111825mA
CC
f = 1 kHz, (mono) 100%mod4304805 3 0
mV[rms]
f = 300 Hz, (mono) 30%mod− 0.500.5dB
f = 8 kHz, (mono) 30%mod−1.2− 0.10.7dB
f = 1 kHz, (mono) 100%mod0.7%
(MON)
Input short-circuit, BPF (A curve)−60dBV
f = 1 kHz, (mono) 100%mod− 0.500.5dB
f = 1 kHz, (L(R)-only) 100%mod380480580
Start condition set-up timet
Start condition hold timet
Low period SCL, SDAt
High period SCLt
Rise time SCL, SDAt
Fall time SCL, SDAt
Data set-up time (write)t
Data hold time (write)t
Acknowledge set-up timet
Acknowledge hold timet
Stop condition set-up timet
Pin No.Equivalent circuitDescriptionDC voltage (V)
1AGC:0.5 to 2.0
51 kΩ
1
425 Ω
500 Ω
2AUXIL:2.2
2
20.7 kΩ
13.8 kΩ
V
CC
AGC level sensor pin
GND
V
CC
External input1
L-ch input pin
2.2 V
GND
3AUXIR:2.2
V
CC
External input 1
R-ch input pin
3
20.7 kΩ
13.8 kΩ
2.2 V
GND
6
ICs for TVAN5829S
■ Terminal Equivalent Circuits (continued)
Pin No.Equivalent circuitDescriptionDC voltage (V)
4OFCAN1:2.2
524 Ω
4
80 kΩ
80 kΩ
2.2 V
V
CC
75 µs filter output
Offset cancel pin
GND
5OFCAN2:2.2
V
CC
dbx output
Offset cancel pin
524 Ω
5
80 kΩ
80 kΩ
2.2 V
GND
6WBTIME:2.2
7.5 µΑ
V
CC
Wide expander effective value detection
recovery time set-up pin
6
29 Ω
29 Ω
15 µΑ
GND
7VCC: VCC pinV
8WBDET:2.2
V
CC
RMS detection circuit input pin
of wide band expander
8
14.4 kΩ
2.2 V
GND
CC
7
AN5829SICs for T V
■ Terminal Equivalent Circuits (continued)
Pin No.Equivalent circuitDescriptionDC voltage (V)
9SPEFIL:2.2
230 Ω
230 Ω
9
18 kΩ
2.2 V
18 kΩ
V
CC
Variable de-emphasis level adjusting
pin
GND
10SPETIME:0.2
7.5 µΑ
10
29 Ω
29 Ω
15 µΑ
V
CC
RMS detection recovery time pin of
variable de-emphasis
GND
11SPEDET:2.2
V
CC
RMS detection circuit input pin of
variable de-emphasis
11
3.2 kΩ
2.2 V
GND
12NOISEDET:VCC − 2 V
V
CC
Noise detecting pin of SAP malfunction-prevention-circuit(Mute SAP demodulation at detecting noise.)
141 kΩ
12
BE
GND
8
ICs for TVAN5829S
■ Terminal Equivalent Circuits (continued)
Pin No.Equivalent circuitDescriptionDC voltage (V)
13SAPDET:V
163 kΩ
13
V
CC
SAP signal carrier level detection pin
GND
CC
− 2 V
BE
14MPXIN:2.2
14
524 Ω
54.4 kΩ
2.2 V
15PILOTDET:2.2VCC − 2 V
136 kΩ
15
V
CC
Composite signal input pin
GND
V
CC
Stereo pilot signal detection pin
GND
BE
16PLL:VCC − 2 V
V
CC
Stereo PLL low pass filter connection
pin
58 kΩ
16
GND
17GND: GND pin0
BE
9
AN5829SICs for T V
■ Terminal Equivalent Circuits (continued)
Pin No.Equivalent circuitDescriptionDC voltage (V)
18SCL:
51 kΩ
V
CC
I2C bus clock input pin
18
19SDA:2.2
19
20PE:
20
1.7 kΩ
1.7 kΩ
51 kΩ
GND
V
CC
I2C bus data input pin
GND
Current application input pin for ZAP
at final test
GND
21L-OUT:2.2
520 Ω
21
430 Ω
850 Ω
2.2 V
GND
V
CC
L-ch. line out output pin
10
ICs for TVAN5829S
■ Terminal Equivalent Circuits (continued)
Pin No.Equivalent circuitDescriptionDC voltage (V)
22R OUT:2.2
520 Ω
22
430 Ω
850 Ω
23AUX2R:2.2
23
20.7 kΩ
13.8 kΩ
2.2 V
GND
V
CC
R-ch. line out output pin
External input 2
V
CC
L-ch. input pin
2.2 V
GND
24AUX2L:2.2
V
External input 2
CC
R-ch. input pin
24
20.7 kΩ
13.8 kΩ
2.2 V
GND
11
AN5829SICs for T V
■ Usage Notes
1. AGC set-up method
By turning on AGC, the AGC performs 0 dB at a small signal input, Boost at a medium signal and gain reduction
at a big signal. It can also control the I/O characteristics of AGC by I
2
C as shown below:
1 V
"00"
100 mV
10 mV
Output level (rms)
1 mV
1 mV
10 mV
2. Guarantee of I
2
C bus control operation at an operating ambient temperature is theoretially guranteed based on IC design by means
I
2
C operating temperature
of the inspection using about 50% faster clock speed at the normal temperature (T
AGC = Off
"11"
AGC = On
"01"
"10"
Data of sub
address 00H
100 mV1 V10 V
Input level (rms)
D7 D6
= 25°C).
a
Namely it is a theoretical value based on IC design, therefore it is not guranteed at the shipping inspection because
the inspection under a high and low temperature is not conducted.
3. Electrostatic breakdown
Pay attention to the following levels:
Pin 6: 200 pF, 130 V
Pin 10: 200 pF, 150 V
Pin 22: 200 pF, 190 V
AGC characteristics
12
ICs for TVAN5829S
■ Technical Information
[1] I2C bus
1. Receiving mode
SDA
SCL
Start
condition
1011
As transfer messages, SCL and SDA are transfered synchronouslly and serially. SCL is a constant clock
frequency and SDA is address data for controlling a receiving side and is sent in parallel by synchronizing with
SCL. Data are in principle sent by 8-bit 3-octet (byte) and there exists an acknowledge bit per octet. The frame
structure is mentioned below:
1) Start condition
When SDA becomes from high to low at SCL = high, the receiver gets ready to receive.
2) Stop condition
When SDA becomes from low to high at SCL = high, the receiver stops receiving.
3) Slave address
Specified for each device. If any addresses of other devices are sent, receiving will be stopped.
4) Sub-address
Specified for each function.
5) Data
Data for controlling
6) Acknowledge bit
This is the bit that informs the master of data reception every octet. The master sends the high signal and
the receiver sends back the low signal as shown with the dotted line in the above figure, thus the master
acknowledges reception on the receiver side. If the low signal is not sent back, the reception will be stopped.
Slave
address
B
Acknowledge
0110
6
bit
0000
Transmission message
Sub
address
0
Acknowledge
0010
2
bit
1000
DataStop
8
Acknowledge
bit
0000
0
condition
Except for the start and stop conditions, SDA does not change at SCL = high.
13
AN5829SICs for T V
■ Technical Information
[1] I2C bus (continued)
1. Receiving mode (continued)
2
C of this IC>
<I
1) Enhances adjustment-free mechanism of the TV set thanks to DAC control 3 and 9 switches
2) Auto-increment function
• Sub address 0
(Data sequential transfer leads to the sequential change of sub address, so that the data is inputted.)
• Sub address 8
(With sequential data transfer, data are inputted in the same sub address.)
2
3) I
C bus protocol
• Slave address
• Format (normal)
S Slave addressASub addressAData byteA P
*
: Auto-increment mode
*
: Data renewal mode
W
Start
condition
Acknowledge bit
Write Mode: 0
Stop
condition
• Auto-increment mode/data renewal mode
S Slave addressAWSub addressAData 1AData 2AA PData n
4) As the initial state of DAC is not guaranteed, never fail to input the following data in a power on mode.
"06" register: "04"
"00" register: adjustment data
"01" register: adjustment data
"02" register: "00"
"05" register: adjustment data
2. Transmission mode (read mode)
2
I
C bus protocol
• Slave address: 10110111 (B7H)
• Format
S Slave addressAData byteA P
R
Read
Mode: 1
14
ICs for TVAN5829S
■ Technical Information (continued)
[1] I2C bus (continued)
• Sub address byte and data byte format
Write mode (slave add.: 10110110)
Sub
address
D7D6D5D4
Data byteUpper MSBLower LSB
D3D2D1D0
"00"
"01"
"02"
"05"
"06"
Read mode (slave add.: 10110111)
Upper MSBLower LSB
D7D6D5D4
Pilot det.
1 → DET
AGC adj.Input level adjustment
∗
∗
det.
AUX SW
0: Off
1: On
Mute: 1 → On
L: Mute
R: Mute
H
∗
∗
∗∗∗∗∗∗
AGC
1 → On
∗
∗
Data byte
High frequency separation adjustment
FMONO: 1 → On
0
∗
∗∗∗000
D3D2D1D0
L: L+R
R: L+R
Low frequency separation adjustment
AUXselect
0: AUX1
1: AUX2
Adj.: 1 → On
L:
VGA out
R:
VCO f
SAP
1 → DET
St/SAP
0 → SAP
∗= Don't care
(L+R)/SAP
0 → SAP
∗= Don't care
15
AN5829SICs for T V
■ Technical Information (continued)
[2] Noise detecting operation in SAP receiving mode
MPX
in
14
Input
VCA
150 kHz BPF
75 µs
De-emph.
dbx
Decoder
Stereo
filter
5f
H
SAP
filter
Noise
filter
BPF
SAP
det.
Noise
det.
Matrix
L−R
filter
SAP out
filter
13
12
SAP det.
Noise det.
SW1
a
b
DC voltage
comparater
SW2
a
b
c
a
b
c
Decoder
Decoder
21
L out
22
R out
dbx
I2C
16
Pin 14 input "02" register
Pin 12, pin 13
DC voltage
Noise: Small"00"V12 > V
Noise: Large"00"V12 < V
SW1SW2I2C SAP det.
13
13
bc3.5 V to 5 VSAP
aa0 V to 0.9 VL+R
Pin 21, pin 22
ICs for TVAN5829S
■ Application Circuit Example
20
PE
18
SCL
19
)
a
AUX2 L
AUX2 R
AUX1 L
AUX1 R
SDA
4.7 µF
4.7 µF
4.7 µF
4.7 µF
4.7 µF
3
5
24
23
2
0.33 µF
10 µF(T
8
6
11
)
a
3.3 µF(T
0.1 µF
0.022 µF
9
10
R out
L out
4.7 µF
180 kΩ
4.7 µF
4.7 µF
2.2 µF
0.1 µF
1
22
21
4
15
ZAP
C
2
I
Out SW
L+R
filter
L+R
demod
Decoder
AGC
Offset
75 µs
Pilot det.
DAC
cancel
De-emph.
Matrix
Pilot
St. PLL
cancel
Offset
cancel
L−R
filter
L−R
demod
filter
Wide band
RMS det.
Wide band
expand
Wide band
SAP out
SAP
filter
demod
filter
Spectral
Spectral
RMS det.
expand
Spectral
det.
SAP
det.
Noise
dbx
De-emph.
switch
(L−R)/SAP
H
, 2f
H
f
Trap filter
12
13
0.1 µF
0.1 µF
V
CC
5 V
0.047 µF
16
17
7
filter
Stereo
4.7 µF
Input VCA
14
MPX in
SAP
filter
filter
Noise
17
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