
Power F-MOS FETs
2SK3048
Silicon N-Channel Power F-MOS FET
■ Features
●Avalanche energy capacity guaranteed
●High-speed switching
●Low ON-resistance
●No secondary breakdown
■ Applications
●Contactless relay
●Diving circuit for a solenoid
●Driving circuit for a motor
●Control equipment
●Switching power supply
15.0±0.513.7±0.2
4.2±0.2
9.9±0.3
φ3.2±0.1
1.4±0.2
1.6±0.2
0.8±0.1
3.0±0.5
4.6±0.2
unit: mm
2.9±0.2
2.6±0.1
0.55±0.15
■ Absolute Maximum Ratings (T
Parameter
Drain to Source breakdown voltage
Gate to Source voltage
Drain current
DC
Pulse
Avalanche energy capacity
Allowable power
dissipation
TC = 25°C
Ta = 25°C
Channel temperature
Storage temperature
*
L = 5mH, IL = 3A, 1 pulse
■ Electrical Characteristics (T
Parameter
Drain to Source cut-off current
Gate to Source leakage current
Drain to Source breakdown voltage
Gate threshold voltage
Drain to Source ON-resistance
Forward transfer admittance
Diode forward voltage
Input capacitance (Common Source)
Output capacitance (Common Source)
Reverse transfer capacitance (Common Source)
Turn-on time (delay time)
Rise time
Turn-off time (delay time)
Fall time
Symbol
V
DSS
V
GSS
I
D
I
DP
*
EAS
P
D
T
ch
T
stg
C
Symbol
I
DSS
I
GSS
V
DSS
V
th
R
DS(on)
| Yfs |
V
DSF
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
= 25°C)
C
Ratings
Unit
600
±30
±3
±6
22.5
35
2
150
−55 to +150
= 25°C)
Conditions
VDS = 480V, VGS = 0
VGS = ±30V, VDS = 0
ID = 1mA, VGS = 0
VDS = 25V, ID = 1mA
VGS = 10V, ID = 2A
VDS = 25V, ID = 2A
IDR = 3A, VGS = 0
VDS = 20V, VGS = 0, f = 1MHz
VDD = 200V, ID = 2A
VGS = 10V, RL = 100Ω
mJ
W
°C
°C
23
2.54±0.3
5.08±0.5
1: Gate
2: Drain
3: Source
TO-220D Package
1
V
V
A
A
min
600
2
1.5
typ
1.7
2.5
750
80
25
15
25
90
40
max
100
±1
5
2.5
−1.5
Unit
µA
µA
V
V
Ω
S
V
pF
pF
pF
ns
ns
ns
ns
1

Power F-MOS FETs 2SK3048
Area of safe operation (ASO) PD Ta IAS L-load
100
30
10
)
A
(
D
3
1
0.3
Drain current I
0.1
0.03
0.01
1 10 100 10003 30 300
Non repetitive pulse
=25˚C
T
C
DC
10ms
100ms
Drain to source voltage VDS (V
I
V
D
DS
6
=10V
5
)
A
(
4
D
3
2
GS
V
7V
6V
Drain current I
1
0
0 5 10 15 20 25
Drain to source voltage VDS (V
1ms
t=10µs
100µs
TC=25˚C
5.5V
40W
4.5V
4V
60
)
W
(
50
D
40
30
20
10
Allowable power dissipation P
0
0 16040 12080 14020 10060
)
5V
Ambient temperature Ta (˚C
6
5
)
A
(
4
D
3
2
(1) TC=Ta
(2) Without heat sink
(1)
(2)
ID V
GS
)
VDS=25V
Drain current I
1
85˚C
0
012108264
)
Gate to source voltage VGS (V
0˚CTC=125˚C
25˚C
)
10
)
A
3
(
1
0.3
Avalanche current IAS
0.1
10.1 1030.3
L-load (mH
VDS V
35
)
30
V
(
DS
25
20
15
10
5
Drain to source voltage V
0
0 5 10 15 20 25 30
GS
Gate to source voltage VGS (V
TC=25˚C
22.5mJ
)
TC=25˚C
ID=3A
2A
1A
)
R
I
DS(on)
6
)
Ω
(
5
DS(on)
4
3
2
1
Drain to source ON-resistance R
0
0123456
T
C
=125˚C
85˚C
25˚C
0˚C
Drain current ID (A
2
D
VGS=10V
)
| Yfs | I
7
)
S
(
6
|
fs
5
4
3
2
1
D
VDS=25V
T
85˚C
125˚C
C
=0˚C
25˚C
,
)
Common source
(
, Output capacitance
)
Common source
(
Forward transfer admittance |Y
0
05
Drain current ID (A
43216
)
Input capacitance
C
, C
, C
oss
rss
V
iss
)
pF
(
1000
rss
,C
oss
300
,C
iss
C
)
100
Common source
(
30
10
Reverse transfer capacitance
0 10020 40 60 80
Drain to source voltage VDS (V
DS
f=1MHz
T
C
C
iss
C
oss
C
rss
=25˚C
)

Power F-MOS FETs 2SK3048
VDS, VGS Q
400 14
)
300 12
V
(
DS
250 10
V
DS
200 8
150 6
100 4
50 2
Drain to source voltage V
00
0 5 10 15 20 25
Gate charge amount Qg (nC
2
10
(1) Without heat sink
(2) With a 100 × 100 × 2mm Al heat sink
)
˚C/W
(
10
(t)
th
1
VDS=100V
g
)
V
(
GS
200V
V
GS
Gate to source voltage V
)
R
t
th(t)
t
d(on)
150
)
ns
125
(
d(off)
100
,t
f
,t
r
,t
d(on)
75
50
25
Switching time t
0
0512 43
Drain current ID (A
, tr, tf, t
I
t
d(off)
d(off)
D
VDD=200V
V
=10V
GS
=25˚C
T
C
t
f
t
r
t
d(on)
)
(1)
(2)
–1
10
Thermal resistance R
–2
10
–4
10
–3
–1
–2
10
10
Time t (s
1010
110
10
)
3
2
4
10
3

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2001 MAR