Panasonic 2SK3048 User Manual

Power F-MOS FETs
2SK3048
Silicon N-Channel Power F-MOS FET
Features
Avalanche energy capacity guaranteed
High-speed switching
No secondary breakdown
Applications
Contactless relay
Diving circuit for a solenoid
Driving circuit for a motor
Control equipment
Switching power supply
15.0±0.513.7±0.2
4.2±0.2
9.9±0.3
φ3.2±0.1
1.4±0.2
1.6±0.2
0.8±0.1
3.0±0.5
4.6±0.2
unit: mm
2.9±0.2
2.6±0.1
0.55±0.15
Absolute Maximum Ratings (T
Parameter
Drain to Source breakdown voltage Gate to Source voltage
Drain current
DC
Pulse Avalanche energy capacity Allowable power dissipation
TC = 25°C
Ta = 25°C Channel temperature Storage temperature
*
L = 5mH, IL = 3A, 1 pulse
Electrical Characteristics (T
Parameter
Drain to Source cut-off current Gate to Source leakage current Drain to Source breakdown voltage Gate threshold voltage Drain to Source ON-resistance Forward transfer admittance Diode forward voltage Input capacitance (Common Source) Output capacitance (Common Source) Reverse transfer capacitance (Common Source) Turn-on time (delay time) Rise time Turn-off time (delay time) Fall time
Symbol
V
DSS
V
GSS
I
D
I
DP
*
EAS
P
D
T
ch
T
stg
C
Symbol
I
DSS
I
GSS
V
DSS
V
th
R
DS(on)
| Yfs | V
DSF
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
= 25°C)
C
Ratings
Unit
600 ±30
±3 ±6
22.5 35
2
150
55 to +150
= 25°C)
Conditions
VDS = 480V, VGS = 0 VGS = ±30V, VDS = 0 ID = 1mA, VGS = 0 VDS = 25V, ID = 1mA VGS = 10V, ID = 2A VDS = 25V, ID = 2A IDR = 3A, VGS = 0
VDS = 20V, VGS = 0, f = 1MHz
VDD = 200V, ID = 2A VGS = 10V, RL = 100
mJ
W
°C °C
23
2.54±0.3
5.08±0.5
1: Gate 2: Drain 3: Source
TO-220D Package
1
V V A A
min
600
2
1.5
typ
1.7
2.5
750
80 25 15 25 90 40
max
100
±1
5
2.5
1.5
Unit
µA µA
V V
S
V pF pF pF
ns ns ns ns
1
Power F-MOS FETs 2SK3048
Area of safe operation (ASO) PD Ta IAS L-load
100
30
10
) A
(
D
3
1
0.3
Drain current I
0.1
0.03
0.01 1 10 100 10003 30 300
Non repetitive pulse
=25˚C
T
C
DC
10ms
100ms
Drain to source voltage VDS (V
I
V
D
DS
6
=10V
5
)
A
(
4
D
3
2
GS
V
7V
6V
Drain current I
1
0
0 5 10 15 20 25
Drain to source voltage VDS (V
1ms
t=10µs
100µs
TC=25˚C
5.5V
40W
4.5V
4V
60
) W
(
50
D
40
30
20
10
Allowable power dissipation P
0
0 16040 12080 14020 10060
)
5V
Ambient temperature Ta (˚C
6
5
) A
(
4
D
3
2
(1) TC=Ta (2) Without heat sink
(1)
(2)
ID V
GS
)
VDS=25V
Drain current I
1
85˚C
0
012108264
)
Gate to source voltage VGS (V
0˚CTC=125˚C 25˚C
)
10
) A
3
(
1
0.3
Avalanche current IAS
0.1
10.1 1030.3
L-load (mH
VDS V
35
)
30
V
(
DS
25
20
15
10
5
Drain to source voltage V
0
0 5 10 15 20 25 30
GS
Gate to source voltage VGS (V
TC=25˚C
22.5mJ
)
TC=25˚C
ID=3A
2A 1A
)
R
I
DS(on)
6
)
(
5
DS(on)
4
3
2
1
Drain to source ON-resistance R
0
0123456
T
C
=125˚C
85˚C
25˚C
0˚C
Drain current ID (A
2
D
VGS=10V
)
| Yfs |  I
7
) S
(
6
|
fs
5
4
3
2
1
D
VDS=25V
T
85˚C
125˚C
C
=0˚C
25˚C
,
)
Common source
(
, Output capacitance
)
Common source
(
Forward transfer admittance |Y
0
05
Drain current ID (A
43216
)
Input capacitance
C
, C
, C
oss
rss
V
iss
)
pF
(
1000
rss
,C
oss
300
,C
iss
C
)
100
Common source
(
30
10
Reverse transfer capacitance
0 10020 40 60 80
Drain to source voltage VDS (V
DS
f=1MHz T
C
C
iss
C
oss
C
rss
=25˚C
)
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